Jasmine Jhihan B. Clark

Array ( [id] => 994015 [patent_doc_number] => 06917116 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-07-12 [patent_title] => 'Electrical connection device between two tracks of an integrated circuit' [patent_app_type] => utility [patent_app_number] => 10/714442 [patent_app_country] => US [patent_app_date] => 2003-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4137 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/917/06917116.pdf [firstpage_image] =>[orig_patent_app_number] => 10714442 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7415154 [patent_doc_number] => 20040159927 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-19 [patent_title] => 'Semiconductor device package and method of manufacture' [patent_app_type] => new [patent_app_number] => 10/712981 [patent_app_country] => US [patent_app_date] => 2003-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4773 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20040159927.pdf [firstpage_image] =>[orig_patent_app_number] => 10712981 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1074094 [patent_doc_number] => 06838759 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-01-04 [patent_title] => 'Small memory card' [patent_app_type] => utility [patent_app_number] => 10/705801 [patent_app_country] => US [patent_app_date] => 2003-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 990 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/838/06838759.pdf [firstpage_image] =>[orig_patent_app_number] => 10705801 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7610973 [patent_doc_number] => 06841884 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-11 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/702561 [patent_app_country] => US [patent_app_date] => 2003-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4792 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/841/06841884.pdf [firstpage_image] =>[orig_patent_app_number] => 10702561 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7353721 [patent_doc_number] => 20040089912 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-13 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/701641 [patent_app_country] => US [patent_app_date] => 2003-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5491 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20040089912.pdf [firstpage_image] =>[orig_patent_app_number] => 10701641 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7609480 [patent_doc_number] => 06998709 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-14 [patent_title] => 'RFIC die-package configuration' [patent_app_type] => utility [patent_app_number] => 10/702402 [patent_app_country] => US [patent_app_date] => 2003-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4416 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/998/06998709.pdf [firstpage_image] =>[orig_patent_app_number] => 10702402 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 991108 [patent_doc_number] => 06919635 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-07-19 [patent_title] => 'High density microvia substrate with high wireability' [patent_app_type] => utility [patent_app_number] => 10/701311 [patent_app_country] => US [patent_app_date] => 2003-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3272 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/919/06919635.pdf [firstpage_image] =>[orig_patent_app_number] => 10701311 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 982640 [patent_doc_number] => 06927484 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-08-09 [patent_title] => 'Stack arrangement of a memory module' [patent_app_type] => utility [patent_app_number] => 10/700871 [patent_app_country] => US [patent_app_date] => 2003-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3123 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/927/06927484.pdf [firstpage_image] =>[orig_patent_app_number] => 10700871 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1050725 [patent_doc_number] => 06861761 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-01 [patent_title] => 'Multi-chip stack flip-chip package' [patent_app_type] => utility [patent_app_number] => 10/697111 [patent_app_country] => US [patent_app_date] => 2003-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2109 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/861/06861761.pdf [firstpage_image] =>[orig_patent_app_number] => 10697111 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5595980 [patent_doc_number] => 20060159897 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-20 [patent_title] => 'Data carrier with a module with a reinforcement strip' [patent_app_type] => utility [patent_app_number] => 10/534165 [patent_app_country] => US [patent_app_date] => 2003-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4770 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20060159897.pdf [firstpage_image] =>[orig_patent_app_number] => 10534165 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7629372 [patent_doc_number] => 06818984 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-16 [patent_title] => 'Programmable multi-chip module' [patent_app_type] => B2 [patent_app_number] => 10/697442 [patent_app_country] => US [patent_app_date] => 2003-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2590 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 4 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/818/06818984.pdf [firstpage_image] =>[orig_patent_app_number] => 10697442 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1006132 [patent_doc_number] => 06906428 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-14 [patent_title] => 'Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component' [patent_app_type] => utility [patent_app_number] => 10/698081 [patent_app_country] => US [patent_app_date] => 2003-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 5845 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/906/06906428.pdf [firstpage_image] =>[orig_patent_app_number] => 10698081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6915590 [patent_doc_number] => 20050093151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-05 [patent_title] => 'SEMICONDUCTOR CIRCUIT WITH MULTIPLE CONTACT SIZES' [patent_app_type] => utility [patent_app_number] => 10/696017 [patent_app_country] => US [patent_app_date] => 2003-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2964 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0093/20050093151.pdf [firstpage_image] =>[orig_patent_app_number] => 10696017 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6988809 [patent_doc_number] => 20050087882 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-28 [patent_title] => 'Multi function package' [patent_app_type] => utility [patent_app_number] => 10/695192 [patent_app_country] => US [patent_app_date] => 2003-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2322 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20050087882.pdf [firstpage_image] =>[orig_patent_app_number] => 10695192 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7457173 [patent_doc_number] => 20040119159 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-24 [patent_title] => 'Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge' [patent_app_type] => new [patent_app_number] => 10/693132 [patent_app_country] => US [patent_app_date] => 2003-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5166 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20040119159.pdf [firstpage_image] =>[orig_patent_app_number] => 10693132 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 730144 [patent_doc_number] => 07042071 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-09 [patent_title] => 'Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/689642 [patent_app_country] => US [patent_app_date] => 2003-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 9759 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/042/07042071.pdf [firstpage_image] =>[orig_patent_app_number] => 10689642 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1025583 [patent_doc_number] => 06885099 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-26 [patent_title] => 'Multichip module, manufacturing method thereof, multichip unit and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 10/691382 [patent_app_country] => US [patent_app_date] => 2003-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 8515 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/885/06885099.pdf [firstpage_image] =>[orig_patent_app_number] => 10691382 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 975989 [patent_doc_number] => 06933606 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-08-23 [patent_title] => 'Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/685412 [patent_app_country] => US [patent_app_date] => 2003-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 19 [patent_no_of_words] => 3488 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/933/06933606.pdf [firstpage_image] =>[orig_patent_app_number] => 10685412 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5898368 [patent_doc_number] => 20060043601 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-02 [patent_title] => 'Hermetically encapsulated component and waferscale method for the production thereof' [patent_app_type] => utility [patent_app_number] => 10/527932 [patent_app_country] => US [patent_app_date] => 2003-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 6254 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0043/20060043601.pdf [firstpage_image] =>[orig_patent_app_number] => 10527932 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 982638 [patent_doc_number] => 06927482 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-08-09 [patent_title] => 'Surface mount package and method for forming multi-chip microsensor device' [patent_app_type] => utility [patent_app_number] => 10/605472 [patent_app_country] => US [patent_app_date] => 2003-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 2420 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/927/06927482.pdf [firstpage_image] =>[orig_patent_app_number] => 10605472 [rel_patent_id] =>[rel_patent_doc_number] =>)