
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 881175
[patent_doc_number] => 07355271
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-08
[patent_title] => 'Flexible assembly of stacked chips'
[patent_app_type] => utility
[patent_app_number] => 10/573561
[patent_app_country] => US
[patent_app_date] => 2003-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 2675
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/355/07355271.pdf
[firstpage_image] =>[orig_patent_app_number] => 10573561
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/573561 | Flexible assembly of stacked chips | Sep 29, 2003 | Issued |
Array
(
[id] => 1066356
[patent_doc_number] => 06847125
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-01-25
[patent_title] => 'Resin-encapsulated semiconductor apparatus and process for its fabrication'
[patent_app_type] => utility
[patent_app_number] => 10/671681
[patent_app_country] => US
[patent_app_date] => 2003-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 10760
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/847/06847125.pdf
[firstpage_image] =>[orig_patent_app_number] => 10671681
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/671681 | Resin-encapsulated semiconductor apparatus and process for its fabrication | Sep 28, 2003 | Issued |
Array
(
[id] => 7283672
[patent_doc_number] => 20040145063
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-29
[patent_title] => 'Integrated circuit assembly module that supports capacitive communication between semiconductor dies'
[patent_app_type] => new
[patent_app_number] => 10/671642
[patent_app_country] => US
[patent_app_date] => 2003-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0145/20040145063.pdf
[firstpage_image] =>[orig_patent_app_number] => 10671642
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/671642 | Integrated circuit assembly module that supports capacitive communication between semiconductor dies | Sep 25, 2003 | Issued |
Array
(
[id] => 7286525
[patent_doc_number] => 20040108588
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Package for microchips'
[patent_app_type] => new
[patent_app_number] => 10/669901
[patent_app_country] => US
[patent_app_date] => 2003-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[patent_no_of_words] => 6144
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20040108588.pdf
[firstpage_image] =>[orig_patent_app_number] => 10669901
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/669901 | Package for microchips | Sep 23, 2003 | Abandoned |
Array
(
[id] => 5718451
[patent_doc_number] => 20060071224
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-06
[patent_title] => 'Radiation-emitting semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 10/528852
[patent_app_country] => US
[patent_app_date] => 2003-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1970
[patent_no_of_claims] => 16
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[pdf_file] => publications/A1/0071/20060071224.pdf
[firstpage_image] =>[orig_patent_app_number] => 10528852
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/528852 | Radiation-emitting semiconductor component | Sep 21, 2003 | Issued |
Array
(
[id] => 7278542
[patent_doc_number] => 20040060919
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-01
[patent_title] => 'Semiconductor production device ceramic plate'
[patent_app_type] => new
[patent_app_number] => 10/663681
[patent_app_country] => US
[patent_app_date] => 2003-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 11612
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[pdf_file] => publications/A1/0060/20040060919.pdf
[firstpage_image] =>[orig_patent_app_number] => 10663681
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663681 | Semiconductor production device ceramic plate | Sep 16, 2003 | Abandoned |
Array
(
[id] => 7301245
[patent_doc_number] => 20040113222
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-17
[patent_title] => 'Stacked microelectronic module with vertical interconnect vias'
[patent_app_type] => new
[patent_app_number] => 10/663371
[patent_app_country] => US
[patent_app_date] => 2003-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2277
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0113/20040113222.pdf
[firstpage_image] =>[orig_patent_app_number] => 10663371
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663371 | Stacked microelectronic module with vertical interconnect vias | Sep 15, 2003 | Abandoned |
Array
(
[id] => 7442352
[patent_doc_number] => 20040195696
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-07
[patent_title] => 'Integrated circuit die having a copper contact and method therefor'
[patent_app_type] => new
[patent_app_number] => 10/662541
[patent_app_country] => US
[patent_app_date] => 2003-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3598
[patent_no_of_claims] => 39
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20040195696.pdf
[firstpage_image] =>[orig_patent_app_number] => 10662541
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/662541 | Integrated circuit die having a copper contact and method therefor | Sep 14, 2003 | Issued |
Array
(
[id] => 7318931
[patent_doc_number] => 20040135250
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-15
[patent_title] => 'MCM package with bridge connection'
[patent_app_type] => new
[patent_app_number] => 10/657231
[patent_app_country] => US
[patent_app_date] => 2003-09-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0135/20040135250.pdf
[firstpage_image] =>[orig_patent_app_number] => 10657231
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/657231 | MCM package with bridge connection | Sep 8, 2003 | Issued |
Array
(
[id] => 1093972
[patent_doc_number] => 06825553
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-30
[patent_title] => 'Multichip wafer level packages and computing systems incorporating same'
[patent_app_type] => B2
[patent_app_number] => 10/656352
[patent_app_country] => US
[patent_app_date] => 2003-09-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 19
[patent_no_of_words] => 4999
[patent_no_of_claims] => 26
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[pdf_file] => patents/06/825/06825553.pdf
[firstpage_image] =>[orig_patent_app_number] => 10656352
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/656352 | Multichip wafer level packages and computing systems incorporating same | Sep 4, 2003 | Issued |
Array
(
[id] => 7380394
[patent_doc_number] => 20040036166
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-26
[patent_title] => 'Method and system for electrically coupling a chip to chip package'
[patent_app_type] => new
[patent_app_number] => 10/651601
[patent_app_country] => US
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[pdf_file] => publications/A1/0036/20040036166.pdf
[firstpage_image] =>[orig_patent_app_number] => 10651601
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/651601 | Method and system for electrically coupling a chip to chip package | Aug 28, 2003 | Issued |
Array
(
[id] => 7080594
[patent_doc_number] => 20050045974
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-03
[patent_title] => 'Die carrier'
[patent_app_type] => utility
[patent_app_number] => 10/650572
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10650572
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/650572 | Die carrier with fluid chamber | Aug 26, 2003 | Issued |
Array
(
[id] => 803627
[patent_doc_number] => 07423332
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-09-09
[patent_title] => 'Vertical laminated electrical switch circuit'
[patent_app_type] => utility
[patent_app_number] => 10/647981
[patent_app_country] => US
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[pdf_file] => patents/07/423/07423332.pdf
[firstpage_image] =>[orig_patent_app_number] => 10647981
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/647981 | Vertical laminated electrical switch circuit | Aug 25, 2003 | Issued |
Array
(
[id] => 7304984
[patent_doc_number] => 20040115920
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[patent_issue_date] => 2004-06-17
[patent_title] => 'Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus'
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[pdf_file] => publications/A1/0115/20040115920.pdf
[firstpage_image] =>[orig_patent_app_number] => 10644952
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/644952 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Aug 20, 2003 | Issued |
Array
(
[id] => 1083496
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[patent_title] => 'Semiconductor package and semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 10644852
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Array
(
[id] => 938666
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[patent_title] => 'Compliant package with conductive elastomeric posts'
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[pdf_file] => patents/06/972/06972495.pdf
[firstpage_image] =>[orig_patent_app_number] => 10643701
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/643701 | Compliant package with conductive elastomeric posts | Aug 18, 2003 | Issued |
Array
(
[id] => 1094000
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[patent_issue_date] => 2004-11-30
[patent_title] => 'Face-to-face multi-chip flip-chip package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/642823 | Face-to-face multi-chip flip-chip package | Aug 18, 2003 | Issued |
Array
(
[id] => 1041016
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[patent_title] => 'Oxide semiconductor electrode and process for producing the same'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/640952 | Integrated circuit stack with partially etched lead frames | Aug 14, 2003 | Abandoned |
Array
(
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[pdf_file] => publications/A1/0227/20040227231.pdf
[firstpage_image] =>[orig_patent_app_number] => 10642391
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/642391 | Power module with voltage overshoot limiting | Aug 13, 2003 | Issued |