Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 881175 [patent_doc_number] => 07355271 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-08 [patent_title] => 'Flexible assembly of stacked chips' [patent_app_type] => utility [patent_app_number] => 10/573561 [patent_app_country] => US [patent_app_date] => 2003-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 2675 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/355/07355271.pdf [firstpage_image] =>[orig_patent_app_number] => 10573561 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/573561
Flexible assembly of stacked chips Sep 29, 2003 Issued
Array ( [id] => 1066356 [patent_doc_number] => 06847125 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-25 [patent_title] => 'Resin-encapsulated semiconductor apparatus and process for its fabrication' [patent_app_type] => utility [patent_app_number] => 10/671681 [patent_app_country] => US [patent_app_date] => 2003-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 10760 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/847/06847125.pdf [firstpage_image] =>[orig_patent_app_number] => 10671681 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/671681
Resin-encapsulated semiconductor apparatus and process for its fabrication Sep 28, 2003 Issued
Array ( [id] => 7283672 [patent_doc_number] => 20040145063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-29 [patent_title] => 'Integrated circuit assembly module that supports capacitive communication between semiconductor dies' [patent_app_type] => new [patent_app_number] => 10/671642 [patent_app_country] => US [patent_app_date] => 2003-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2909 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20040145063.pdf [firstpage_image] =>[orig_patent_app_number] => 10671642 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/671642
Integrated circuit assembly module that supports capacitive communication between semiconductor dies Sep 25, 2003 Issued
Array ( [id] => 7286525 [patent_doc_number] => 20040108588 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-10 [patent_title] => 'Package for microchips' [patent_app_type] => new [patent_app_number] => 10/669901 [patent_app_country] => US [patent_app_date] => 2003-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6144 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20040108588.pdf [firstpage_image] =>[orig_patent_app_number] => 10669901 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/669901
Package for microchips Sep 23, 2003 Abandoned
Array ( [id] => 5718451 [patent_doc_number] => 20060071224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-04-06 [patent_title] => 'Radiation-emitting semiconductor component' [patent_app_type] => utility [patent_app_number] => 10/528852 [patent_app_country] => US [patent_app_date] => 2003-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1970 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20060071224.pdf [firstpage_image] =>[orig_patent_app_number] => 10528852 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/528852
Radiation-emitting semiconductor component Sep 21, 2003 Issued
Array ( [id] => 7278542 [patent_doc_number] => 20040060919 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-01 [patent_title] => 'Semiconductor production device ceramic plate' [patent_app_type] => new [patent_app_number] => 10/663681 [patent_app_country] => US [patent_app_date] => 2003-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 11612 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0060/20040060919.pdf [firstpage_image] =>[orig_patent_app_number] => 10663681 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/663681
Semiconductor production device ceramic plate Sep 16, 2003 Abandoned
Array ( [id] => 7301245 [patent_doc_number] => 20040113222 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Stacked microelectronic module with vertical interconnect vias' [patent_app_type] => new [patent_app_number] => 10/663371 [patent_app_country] => US [patent_app_date] => 2003-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2277 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20040113222.pdf [firstpage_image] =>[orig_patent_app_number] => 10663371 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/663371
Stacked microelectronic module with vertical interconnect vias Sep 15, 2003 Abandoned
Array ( [id] => 7442352 [patent_doc_number] => 20040195696 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-07 [patent_title] => 'Integrated circuit die having a copper contact and method therefor' [patent_app_type] => new [patent_app_number] => 10/662541 [patent_app_country] => US [patent_app_date] => 2003-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3598 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20040195696.pdf [firstpage_image] =>[orig_patent_app_number] => 10662541 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/662541
Integrated circuit die having a copper contact and method therefor Sep 14, 2003 Issued
Array ( [id] => 7318931 [patent_doc_number] => 20040135250 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-15 [patent_title] => 'MCM package with bridge connection' [patent_app_type] => new [patent_app_number] => 10/657231 [patent_app_country] => US [patent_app_date] => 2003-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3006 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0135/20040135250.pdf [firstpage_image] =>[orig_patent_app_number] => 10657231 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/657231
MCM package with bridge connection Sep 8, 2003 Issued
Array ( [id] => 1093972 [patent_doc_number] => 06825553 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-30 [patent_title] => 'Multichip wafer level packages and computing systems incorporating same' [patent_app_type] => B2 [patent_app_number] => 10/656352 [patent_app_country] => US [patent_app_date] => 2003-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4999 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/825/06825553.pdf [firstpage_image] =>[orig_patent_app_number] => 10656352 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/656352
Multichip wafer level packages and computing systems incorporating same Sep 4, 2003 Issued
Array ( [id] => 7380394 [patent_doc_number] => 20040036166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-02-26 [patent_title] => 'Method and system for electrically coupling a chip to chip package' [patent_app_type] => new [patent_app_number] => 10/651601 [patent_app_country] => US [patent_app_date] => 2003-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3099 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20040036166.pdf [firstpage_image] =>[orig_patent_app_number] => 10651601 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/651601
Method and system for electrically coupling a chip to chip package Aug 28, 2003 Issued
Array ( [id] => 7080594 [patent_doc_number] => 20050045974 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-03 [patent_title] => 'Die carrier' [patent_app_type] => utility [patent_app_number] => 10/650572 [patent_app_country] => US [patent_app_date] => 2003-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3721 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20050045974.pdf [firstpage_image] =>[orig_patent_app_number] => 10650572 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/650572
Die carrier with fluid chamber Aug 26, 2003 Issued
Array ( [id] => 803627 [patent_doc_number] => 07423332 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-09-09 [patent_title] => 'Vertical laminated electrical switch circuit' [patent_app_type] => utility [patent_app_number] => 10/647981 [patent_app_country] => US [patent_app_date] => 2003-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 5245 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/423/07423332.pdf [firstpage_image] =>[orig_patent_app_number] => 10647981 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/647981
Vertical laminated electrical switch circuit Aug 25, 2003 Issued
Array ( [id] => 7304984 [patent_doc_number] => 20040115920 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus' [patent_app_type] => new [patent_app_number] => 10/644952 [patent_app_country] => US [patent_app_date] => 2003-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 46 [patent_no_of_words] => 14829 [patent_no_of_claims] => 77 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20040115920.pdf [firstpage_image] =>[orig_patent_app_number] => 10644952 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/644952
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus Aug 20, 2003 Issued
Array ( [id] => 1083496 [patent_doc_number] => 06833614 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-12-21 [patent_title] => 'Semiconductor package and semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/644852 [patent_app_country] => US [patent_app_date] => 2003-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 20 [patent_no_of_words] => 7225 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/833/06833614.pdf [firstpage_image] =>[orig_patent_app_number] => 10644852 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/644852
Semiconductor package and semiconductor device Aug 20, 2003 Issued
Array ( [id] => 938666 [patent_doc_number] => 06972495 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-06 [patent_title] => 'Compliant package with conductive elastomeric posts' [patent_app_type] => utility [patent_app_number] => 10/643701 [patent_app_country] => US [patent_app_date] => 2003-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 3984 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/972/06972495.pdf [firstpage_image] =>[orig_patent_app_number] => 10643701 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/643701
Compliant package with conductive elastomeric posts Aug 18, 2003 Issued
Array ( [id] => 1094000 [patent_doc_number] => 06825567 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-11-30 [patent_title] => 'Face-to-face multi-chip flip-chip package' [patent_app_type] => B1 [patent_app_number] => 10/642823 [patent_app_country] => US [patent_app_date] => 2003-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1882 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/825/06825567.pdf [firstpage_image] =>[orig_patent_app_number] => 10642823 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/642823
Face-to-face multi-chip flip-chip package Aug 18, 2003 Issued
Array ( [id] => 1041016 [patent_doc_number] => 06870266 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-22 [patent_title] => 'Oxide semiconductor electrode and process for producing the same' [patent_app_type] => utility [patent_app_number] => 10/642281 [patent_app_country] => US [patent_app_date] => 2003-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 5386 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/870/06870266.pdf [firstpage_image] =>[orig_patent_app_number] => 10642281 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/642281
Oxide semiconductor electrode and process for producing the same Aug 17, 2003 Issued
Array ( [id] => 6969731 [patent_doc_number] => 20050035441 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-17 [patent_title] => 'Integrated circuit stack with partially etched lead frames' [patent_app_type] => utility [patent_app_number] => 10/640952 [patent_app_country] => US [patent_app_date] => 2003-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2354 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20050035441.pdf [firstpage_image] =>[orig_patent_app_number] => 10640952 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/640952
Integrated circuit stack with partially etched lead frames Aug 14, 2003 Abandoned
Array ( [id] => 7407476 [patent_doc_number] => 20040227231 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-18 [patent_title] => 'Power module with voltage overshoot limiting' [patent_app_type] => new [patent_app_number] => 10/642391 [patent_app_country] => US [patent_app_date] => 2003-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4639 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20040227231.pdf [firstpage_image] =>[orig_patent_app_number] => 10642391 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/642391
Power module with voltage overshoot limiting Aug 13, 2003 Issued
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