
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7427722
[patent_doc_number] => 20040007775
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-15
[patent_title] => 'Semiconductor package and fabrication method of the same'
[patent_app_type] => new
[patent_app_number] => 10/614671
[patent_app_country] => US
[patent_app_date] => 2003-07-07
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 2443
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0007/20040007775.pdf
[firstpage_image] =>[orig_patent_app_number] => 10614671
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/614671 | Semiconductor package and fabrication method of the same | Jul 6, 2003 | Issued |
Array
(
[id] => 1081420
[patent_doc_number] => 06836026
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-12-28
[patent_title] => 'Integrated circuit design for both input output limited and core limited integrated circuits'
[patent_app_type] => B1
[patent_app_number] => 10/614402
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[patent_app_date] => 2003-07-03
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Array
(
[id] => 1102777
[patent_doc_number] => 06815813
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-09
[patent_title] => 'Self-contained heat sink and a method for fabricating same'
[patent_app_type] => B1
[patent_app_number] => 10/604211
[patent_app_country] => US
[patent_app_date] => 2003-07-01
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Array
(
[id] => 1136678
[patent_doc_number] => 06784539
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[patent_kind] => B2
[patent_issue_date] => 2004-08-31
[patent_title] => 'Thermally enhanced semiconductor chip having integrated bonds over active circuits'
[patent_app_type] => B2
[patent_app_number] => 10/603711
[patent_app_country] => US
[patent_app_date] => 2003-06-25
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Array
(
[id] => 1006061
[patent_doc_number] => 06906405
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[patent_issue_date] => 2005-06-14
[patent_title] => 'Electronic part and its manufacturing method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/465221 | Electronic part and its manufacturing method | Jun 19, 2003 | Issued |
Array
(
[id] => 982312
[patent_doc_number] => 06927156
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[patent_kind] => B2
[patent_issue_date] => 2005-08-09
[patent_title] => 'Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon'
[patent_app_type] => utility
[patent_app_number] => 10/465171
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/465171 | Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon | Jun 17, 2003 | Issued |
Array
(
[id] => 1041000
[patent_doc_number] => 06870258
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[patent_issue_date] => 2005-03-22
[patent_title] => 'Fixture suitable for use in coupling a lid to a substrate and method'
[patent_app_type] => utility
[patent_app_number] => 10/458802
[patent_app_country] => US
[patent_app_date] => 2003-06-16
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[firstpage_image] =>[orig_patent_app_number] => 10458802
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/458802 | Fixture suitable for use in coupling a lid to a substrate and method | Jun 15, 2003 | Issued |
Array
(
[id] => 7323464
[patent_doc_number] => 20040251523
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[patent_issue_date] => 2004-12-16
[patent_title] => 'Stackable integrated circuit package and method therefor'
[patent_app_type] => new
[patent_app_number] => 10/463051
[patent_app_country] => US
[patent_app_date] => 2003-06-16
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Array
(
[id] => 961333
[patent_doc_number] => 06952046
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[patent_issue_date] => 2005-10-04
[patent_title] => 'Electronic and optoelectronic component packaging technique'
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Array
(
[id] => 7250325
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[patent_title] => 'Built-up bump pad structure and method for same'
[patent_app_type] => new
[patent_app_number] => 10/449212
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/449212 | Built-up bump pad structure and method for same | May 29, 2003 | Issued |
Array
(
[id] => 6699455
[patent_doc_number] => 20030222335
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[patent_title] => 'Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/448921 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | May 28, 2003 | Issued |
Array
(
[id] => 1144970
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[patent_title] => 'Interconnect integration'
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Array
(
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[patent_title] => 'Power semiconductor device'
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Array
(
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[patent_title] => 'Method of manufacturing a semiconductor device with an air gap formed using a photosensitive material'
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Array
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Array
(
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Array
(
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/437562 | Non-leaded semiconductor package and method of fabricating the same | May 12, 2003 | Issued |