Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1128280 [patent_doc_number] => 06791148 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-14 [patent_title] => 'Method and composite for decreasing charge leakage' [patent_app_type] => B2 [patent_app_number] => 10/369786 [patent_app_country] => US [patent_app_date] => 2003-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3705 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/791/06791148.pdf [firstpage_image] =>[orig_patent_app_number] => 10369786 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/369786
Method and composite for decreasing charge leakage Feb 17, 2003 Issued
Array ( [id] => 6785775 [patent_doc_number] => 20030137014 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-24 [patent_title] => 'Semiconductor integrated circuit device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/358276 [patent_app_country] => US [patent_app_date] => 2003-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 7523 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20030137014.pdf [firstpage_image] =>[orig_patent_app_number] => 10358276 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/358276
Semiconductor integrated circuit device and method of manufacturing the same Feb 4, 2003 Issued
Array ( [id] => 6854161 [patent_doc_number] => 20030127662 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-10 [patent_title] => 'Utilization of die active surfaces for laterally extending die internal and external connections' [patent_app_type] => new [patent_app_number] => 10/345895 [patent_app_country] => US [patent_app_date] => 2003-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4052 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20030127662.pdf [firstpage_image] =>[orig_patent_app_number] => 10345895 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/345895
Utilization of die active surfaces for laterally extending die internal and external connections Jan 14, 2003 Issued
Array ( [id] => 6764106 [patent_doc_number] => 20030098504 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-29 [patent_title] => 'Semiconductor memory module having double-sided stacked memory chip layout' [patent_app_type] => new [patent_app_number] => 10/341397 [patent_app_country] => US [patent_app_date] => 2003-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 10756 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20030098504.pdf [firstpage_image] =>[orig_patent_app_number] => 10341397 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/341397
Semiconductor memory module having double-sided stacked memory chip layout Jan 13, 2003 Issued
Array ( [id] => 1182276 [patent_doc_number] => 06740973 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-05-25 [patent_title] => 'Stacked structure for an image sensor' [patent_app_type] => B1 [patent_app_number] => 10/340361 [patent_app_country] => US [patent_app_date] => 2003-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1605 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/740/06740973.pdf [firstpage_image] =>[orig_patent_app_number] => 10340361 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/340361
Stacked structure for an image sensor Jan 8, 2003 Issued
Array ( [id] => 6764116 [patent_doc_number] => 20030098514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-29 [patent_title] => 'Packages for semiconductor die' [patent_app_type] => new [patent_app_number] => 10/340331 [patent_app_country] => US [patent_app_date] => 2003-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3522 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20030098514.pdf [firstpage_image] =>[orig_patent_app_number] => 10340331 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/340331
Packages for semiconductor die Jan 8, 2003 Issued
Array ( [id] => 7963805 [patent_doc_number] => 06680525 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-01-20 [patent_title] => 'Stacked structure of an image sensor' [patent_app_type] => B1 [patent_app_number] => 10/340251 [patent_app_country] => US [patent_app_date] => 2003-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1661 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/680/06680525.pdf [firstpage_image] =>[orig_patent_app_number] => 10340251 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/340251
Stacked structure of an image sensor Jan 8, 2003 Issued
Array ( [id] => 7625080 [patent_doc_number] => 06724090 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-20 [patent_title] => 'Multi-chip package and method for manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 10/338202 [patent_app_country] => US [patent_app_date] => 2003-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 22 [patent_no_of_words] => 5390 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 13 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/724/06724090.pdf [firstpage_image] =>[orig_patent_app_number] => 10338202 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/338202
Multi-chip package and method for manufacturing the same Jan 7, 2003 Issued
Array ( [id] => 1254428 [patent_doc_number] => 06670714 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-30 [patent_title] => 'Semiconductor integrated circuit device having multilevel interconnection' [patent_app_type] => B1 [patent_app_number] => 10/337402 [patent_app_country] => US [patent_app_date] => 2003-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 4220 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/670/06670714.pdf [firstpage_image] =>[orig_patent_app_number] => 10337402 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/337402
Semiconductor integrated circuit device having multilevel interconnection Jan 6, 2003 Issued
Array ( [id] => 6801276 [patent_doc_number] => 20030096441 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-22 [patent_title] => 'Fabrication method of thin film transistor substrate for X-ray detector' [patent_app_type] => new [patent_app_number] => 10/330126 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3521 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20030096441.pdf [firstpage_image] =>[orig_patent_app_number] => 10330126 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/330126
Fabrication method of thin film transistor substrate for X-ray detector Dec 29, 2002 Issued
Array ( [id] => 7295977 [patent_doc_number] => 20040124525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-01 [patent_title] => 'CHIP COOLING' [patent_app_type] => new [patent_app_number] => 10/330742 [patent_app_country] => US [patent_app_date] => 2002-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 5298 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20040124525.pdf [firstpage_image] =>[orig_patent_app_number] => 10330742 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/330742
Chip cooling Dec 26, 2002 Issued
Array ( [id] => 1136615 [patent_doc_number] => 06784529 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-31 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/329342 [patent_app_country] => US [patent_app_date] => 2002-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2673 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/784/06784529.pdf [firstpage_image] =>[orig_patent_app_number] => 10329342 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/329342
Semiconductor device Dec 26, 2002 Issued
Array ( [id] => 7457162 [patent_doc_number] => 20040119157 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-24 [patent_title] => 'REMOTE THERMAL VIAS FOR DENSELY PACKED ELECTRICAL ASSEMBLAGE' [patent_app_type] => new [patent_app_number] => 10/328332 [patent_app_country] => US [patent_app_date] => 2002-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3151 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20040119157.pdf [firstpage_image] =>[orig_patent_app_number] => 10328332 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/328332
Remote thermal vias for densely packed electrical assemblage Dec 22, 2002 Issued
Array ( [id] => 1214324 [patent_doc_number] => 06710443 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-23 [patent_title] => 'INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE' [patent_app_type] => B1 [patent_app_number] => 10/326612 [patent_app_country] => US [patent_app_date] => 2002-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 5793 [patent_no_of_claims] => 44 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/710/06710443.pdf [firstpage_image] =>[orig_patent_app_number] => 10326612 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/326612
INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATING STRUCTURE Dec 19, 2002 Issued
Array ( [id] => 1183300 [patent_doc_number] => 06737755 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-05-18 [patent_title] => 'Ball grid array package with improved thermal characteristics' [patent_app_type] => B1 [patent_app_number] => 10/322661 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 2138 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/737/06737755.pdf [firstpage_image] =>[orig_patent_app_number] => 10322661 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/322661
Ball grid array package with improved thermal characteristics Dec 18, 2002 Issued
Array ( [id] => 6858977 [patent_doc_number] => 20030089985 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-15 [patent_title] => 'Deflectable interconnect' [patent_app_type] => new [patent_app_number] => 10/324626 [patent_app_country] => US [patent_app_date] => 2002-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6787 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20030089985.pdf [firstpage_image] =>[orig_patent_app_number] => 10324626 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/324626
Deflectable interconnect Dec 17, 2002 Issued
Array ( [id] => 1237287 [patent_doc_number] => 06690086 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-02-10 [patent_title] => 'Apparatus and method for reducing interposer compression during molding process' [patent_app_type] => B2 [patent_app_number] => 10/318172 [patent_app_country] => US [patent_app_date] => 2002-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 2383 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/690/06690086.pdf [firstpage_image] =>[orig_patent_app_number] => 10318172 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/318172
Apparatus and method for reducing interposer compression during molding process Dec 12, 2002 Issued
Array ( [id] => 7120373 [patent_doc_number] => 20050012202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-20 [patent_title] => 'Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method' [patent_app_type] => utility [patent_app_number] => 10/487182 [patent_app_country] => US [patent_app_date] => 2002-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2505 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20050012202.pdf [firstpage_image] =>[orig_patent_app_number] => 10487182 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/487182
Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method Dec 4, 2002 Issued
Array ( [id] => 1136686 [patent_doc_number] => 06784541 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-31 [patent_title] => 'Semiconductor module and mounting method for same' [patent_app_type] => B2 [patent_app_number] => 10/302986 [patent_app_country] => US [patent_app_date] => 2002-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 53 [patent_no_of_words] => 9256 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/784/06784541.pdf [firstpage_image] =>[orig_patent_app_number] => 10302986 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/302986
Semiconductor module and mounting method for same Nov 24, 2002 Issued
Array ( [id] => 6781182 [patent_doc_number] => 20030062629 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-03 [patent_title] => 'Flip chip adaptor package for bare die' [patent_app_type] => new [patent_app_number] => 10/302594 [patent_app_country] => US [patent_app_date] => 2002-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2947 [patent_no_of_claims] => 114 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20030062629.pdf [firstpage_image] =>[orig_patent_app_number] => 10302594 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/302594
Flip chip adaptor package for bare die Nov 21, 2002 Issued
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