
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1288811
[patent_doc_number] => 06639324
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-10-28
[patent_title] => 'Flip chip package module and method of forming the same'
[patent_app_type] => B1
[patent_app_number] => 10/253822
[patent_app_country] => US
[patent_app_date] => 2002-09-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/639/06639324.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/253822 | Flip chip package module and method of forming the same | Sep 24, 2002 | Issued |
Array
(
[id] => 1221809
[patent_doc_number] => 06703704
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-03-09
[patent_title] => 'Stress reducing stiffener ring'
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[patent_app_number] => 10/254391
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Array
(
[id] => 1225191
[patent_doc_number] => 06700196
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[patent_kind] => B1
[patent_issue_date] => 2004-03-02
[patent_title] => 'Programmable multi-chip module'
[patent_app_type] => B1
[patent_app_number] => 10/253851
[patent_app_country] => US
[patent_app_date] => 2002-09-23
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Array
(
[id] => 1306270
[patent_doc_number] => 06621167
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-16
[patent_title] => 'Metal interconnect structure'
[patent_app_type] => B1
[patent_app_number] => 10/064671
[patent_app_country] => US
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Array
(
[id] => 1002709
[patent_doc_number] => 06909166
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[patent_issue_date] => 2005-06-21
[patent_title] => 'Leads of a no-lead type package of a semiconductor device'
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Array
(
[id] => 6694932
[patent_doc_number] => 20030107126
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[patent_issue_date] => 2003-06-12
[patent_title] => 'High performance multi-chip flip chip package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/245529 | High performance multi-chip flip chip package | Sep 16, 2002 | Abandoned |
Array
(
[id] => 1203527
[patent_doc_number] => 06720648
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[patent_title] => 'Electronic device'
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[pdf_file] => patents/06/720/06720648.pdf
[firstpage_image] =>[orig_patent_app_number] => 10230071
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Array
(
[id] => 6317150
[patent_doc_number] => 20020195699
[patent_country] => US
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[patent_issue_date] => 2002-12-26
[patent_title] => 'Packaged die on PCB with heat sink encapsulant'
[patent_app_type] => new
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[pdf_file] => publications/A1/0195/20020195699.pdf
[firstpage_image] =>[orig_patent_app_number] => 10232782
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/232782 | Packaged die on PCB with heat sink encapsulant | Aug 27, 2002 | Issued |
Array
(
[id] => 1128466
[patent_doc_number] => 06791197
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[patent_issue_date] => 2004-09-14
[patent_title] => 'Reducing layer separation and cracking in semiconductor devices'
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[pdf_file] => patents/06/791/06791197.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/227772 | Reducing layer separation and cracking in semiconductor devices | Aug 25, 2002 | Issued |
Array
(
[id] => 1266580
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[patent_title] => 'Semiconductor device'
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[patent_app_number] => 10/222791
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Array
(
[id] => 1047421
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[patent_issue_date] => 2005-03-08
[patent_title] => 'Etched metal trace with reduced RF impendance resulting from the skin effect'
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Array
(
[id] => 1221860
[patent_doc_number] => 06703710
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[patent_title] => 'Dual damascene metal trace with reduced RF impedance resulting from the skin effect'
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Array
(
[id] => 1310293
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[patent_title] => 'Interconnect structures containing stress adjustment cap layer'
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Array
(
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[patent_title] => 'Alignment mark structure for laser fusing and method of use'
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Array
(
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Array
(
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Array
(
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Array
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Array
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