Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6316893 [patent_doc_number] => 20020195631 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-26 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/121602 [patent_app_country] => US [patent_app_date] => 2002-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3740 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20020195631.pdf [firstpage_image] =>[orig_patent_app_number] => 10121602 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/121602
Semiconductor device and manufacturing method thereof Apr 14, 2002 Issued
Array ( [id] => 1178674 [patent_doc_number] => 06747346 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-06-08 [patent_title] => 'Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device' [patent_app_type] => B2 [patent_app_number] => 10/121431 [patent_app_country] => US [patent_app_date] => 2002-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4783 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 30 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/747/06747346.pdf [firstpage_image] =>[orig_patent_app_number] => 10121431 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/121431
Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device Apr 11, 2002 Issued
Array ( [id] => 1352129 [patent_doc_number] => 06583477 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-06-24 [patent_title] => 'Field emission device' [patent_app_type] => B1 [patent_app_number] => 10/121981 [patent_app_country] => US [patent_app_date] => 2002-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2614 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/583/06583477.pdf [firstpage_image] =>[orig_patent_app_number] => 10121981 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/121981
Field emission device Apr 11, 2002 Issued
Array ( [id] => 1344227 [patent_doc_number] => 06590282 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-08 [patent_title] => 'Stacked semiconductor package formed on a substrate and method for fabrication' [patent_app_type] => B1 [patent_app_number] => 10/038232 [patent_app_country] => US [patent_app_date] => 2002-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3592 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 333 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/590/06590282.pdf [firstpage_image] =>[orig_patent_app_number] => 10038232 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/038232
Stacked semiconductor package formed on a substrate and method for fabrication Apr 11, 2002 Issued
Array ( [id] => 1044197 [patent_doc_number] => 06867500 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-15 [patent_title] => 'Multi-chip module and methods' [patent_app_type] => utility [patent_app_number] => 10/118401 [patent_app_country] => US [patent_app_date] => 2002-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 4872 [patent_no_of_claims] => 69 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/867/06867500.pdf [firstpage_image] =>[orig_patent_app_number] => 10118401 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/118401
Multi-chip module and methods Apr 7, 2002 Issued
Array ( [id] => 1344107 [patent_doc_number] => 06590269 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-08 [patent_title] => 'Package structure for a photosensitive chip' [patent_app_type] => B1 [patent_app_number] => 10/114201 [patent_app_country] => US [patent_app_date] => 2002-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1859 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/590/06590269.pdf [firstpage_image] =>[orig_patent_app_number] => 10114201 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/114201
Package structure for a photosensitive chip Mar 31, 2002 Issued
Array ( [id] => 1385056 [patent_doc_number] => 06559544 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-06 [patent_title] => 'Programmable interconnect for semiconductor devices' [patent_app_type] => B1 [patent_app_number] => 10/107821 [patent_app_country] => US [patent_app_date] => 2002-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1764 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/559/06559544.pdf [firstpage_image] =>[orig_patent_app_number] => 10107821 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/107821
Programmable interconnect for semiconductor devices Mar 27, 2002 Issued
Array ( [id] => 5901085 [patent_doc_number] => 20020140066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Semiconductor device having flat electrodes of a first semiconductor pellet and protruded electrodes of a second semiconductor pellet directly contacted with the flat electrodes' [patent_app_type] => new [patent_app_number] => 10/106491 [patent_app_country] => US [patent_app_date] => 2002-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5315 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140066.pdf [firstpage_image] =>[orig_patent_app_number] => 10106491 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/106491
Semiconductor device and flat electrodes Mar 26, 2002 Issued
Array ( [id] => 6446670 [patent_doc_number] => 20020149292 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-17 [patent_title] => 'Miniature device with increased insulative spacing and method for making same' [patent_app_type] => new [patent_app_number] => 10/100371 [patent_app_country] => US [patent_app_date] => 2002-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3919 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0149/20020149292.pdf [firstpage_image] =>[orig_patent_app_number] => 10100371 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/100371
Miniature device with increased insulative spacing and method for making same Mar 13, 2002 Issued
Array ( [id] => 7645236 [patent_doc_number] => 06472736 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-29 [patent_title] => 'Stacked structure for memory chips' [patent_app_type] => B1 [patent_app_number] => 10/097822 [patent_app_country] => US [patent_app_date] => 2002-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 1437 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 8 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/472/06472736.pdf [firstpage_image] =>[orig_patent_app_number] => 10097822 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/097822
Stacked structure for memory chips Mar 12, 2002 Issued
Array ( [id] => 1328064 [patent_doc_number] => 06603167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-08-05 [patent_title] => 'Capacitor with lower electrode located at the same level as an interconnect line' [patent_app_type] => B2 [patent_app_number] => 10/093531 [patent_app_country] => US [patent_app_date] => 2002-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 2631 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/603/06603167.pdf [firstpage_image] =>[orig_patent_app_number] => 10093531 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/093531
Capacitor with lower electrode located at the same level as an interconnect line Mar 10, 2002 Issued
Array ( [id] => 1421631 [patent_doc_number] => 06509637 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-21 [patent_title] => 'Low profile mounting of thick integrated circuit packages within low-profile circuit modules' [patent_app_type] => B1 [patent_app_number] => 10/094731 [patent_app_country] => US [patent_app_date] => 2002-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1670 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/509/06509637.pdf [firstpage_image] =>[orig_patent_app_number] => 10094731 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/094731
Low profile mounting of thick integrated circuit packages within low-profile circuit modules Mar 7, 2002 Issued
Array ( [id] => 6012401 [patent_doc_number] => 20020100981 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-01 [patent_title] => 'Tantalum - aluminum - nitrogen material for semiconductor devices' [patent_app_type] => new [patent_app_number] => 10/092648 [patent_app_country] => US [patent_app_date] => 2002-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4380 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0100/20020100981.pdf [firstpage_image] =>[orig_patent_app_number] => 10092648 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/092648
Tantalum-aluminum-nitrogen material for semiconductor devices Mar 6, 2002 Issued
Array ( [id] => 1422794 [patent_doc_number] => 06518670 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-11 [patent_title] => 'Electrically porous on-chip decoupling/shielding layer' [patent_app_type] => B1 [patent_app_number] => 10/091643 [patent_app_country] => US [patent_app_date] => 2002-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 29 [patent_no_of_words] => 7513 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518670.pdf [firstpage_image] =>[orig_patent_app_number] => 10091643 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/091643
Electrically porous on-chip decoupling/shielding layer Mar 5, 2002 Issued
Array ( [id] => 7301297 [patent_doc_number] => 20040113274 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Interconnect arrangement and method for fabricating an interconnect arrangement' [patent_app_type] => new [patent_app_number] => 10/469272 [patent_app_country] => US [patent_app_date] => 2004-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5737 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20040113274.pdf [firstpage_image] =>[orig_patent_app_number] => 10469272 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/469272
Interconnect arrangement and method for fabricating an interconnect arrangement Feb 28, 2002 Issued
Array ( [id] => 5708482 [patent_doc_number] => 20060049826 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-09 [patent_title] => 'Optical cross-connect system' [patent_app_type] => utility [patent_app_number] => 10/469516 [patent_app_country] => US [patent_app_date] => 2002-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 74 [patent_figures_cnt] => 74 [patent_no_of_words] => 44039 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20060049826.pdf [firstpage_image] =>[orig_patent_app_number] => 10469516 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/469516
Optical cross-connect system Feb 28, 2002 Issued
Array ( [id] => 1380631 [patent_doc_number] => 06563221 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-13 [patent_title] => 'Connection structures for integrated circuits and processes for their formation' [patent_app_type] => B1 [patent_app_number] => 10/081982 [patent_app_country] => US [patent_app_date] => 2002-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 3286 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/563/06563221.pdf [firstpage_image] =>[orig_patent_app_number] => 10081982 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/081982
Connection structures for integrated circuits and processes for their formation Feb 20, 2002 Issued
Array ( [id] => 1421358 [patent_doc_number] => 06509615 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-01-21 [patent_title] => 'Semiconductor device having dynamic threshold transistors and element isolation region and fabrication method thereof' [patent_app_type] => B2 [patent_app_number] => 10/067791 [patent_app_country] => US [patent_app_date] => 2002-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 30 [patent_no_of_words] => 9784 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/509/06509615.pdf [firstpage_image] =>[orig_patent_app_number] => 10067791 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/067791
Semiconductor device having dynamic threshold transistors and element isolation region and fabrication method thereof Feb 7, 2002 Issued
Array ( [id] => 1576228 [patent_doc_number] => 06469321 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-22 [patent_title] => 'Surface-mountable light-emitting diode structural element' [patent_app_type] => B2 [patent_app_number] => 10/072836 [patent_app_country] => US [patent_app_date] => 2002-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3951 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/469/06469321.pdf [firstpage_image] =>[orig_patent_app_number] => 10072836 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/072836
Surface-mountable light-emitting diode structural element Feb 4, 2002 Issued
Array ( [id] => 1330776 [patent_doc_number] => 06600227 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-29 [patent_title] => 'System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package' [patent_app_type] => B1 [patent_app_number] => 10/066422 [patent_app_country] => US [patent_app_date] => 2002-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4363 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/600/06600227.pdf [firstpage_image] =>[orig_patent_app_number] => 10066422 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/066422
System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package Jan 30, 2002 Issued
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