Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1404858 [patent_doc_number] => 06531785 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-03-11 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 09/988587 [patent_app_country] => US [patent_app_date] => 2001-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 21 [patent_no_of_words] => 9306 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/531/06531785.pdf [firstpage_image] =>[orig_patent_app_number] => 09988587 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/988587
Semiconductor device Nov 19, 2001 Issued
Array ( [id] => 6799527 [patent_doc_number] => 20030094691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-22 [patent_title] => 'ENCAPSULATION OF ELECTRONIC DEVICES' [patent_app_type] => new [patent_app_number] => 09/989362 [patent_app_country] => US [patent_app_date] => 2001-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3047 [patent_no_of_claims] => 56 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0094/20030094691.pdf [firstpage_image] =>[orig_patent_app_number] => 09989362 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/989362
Encapsulation of electronic devices Nov 19, 2001 Issued
Array ( [id] => 8209949 [patent_doc_number] => RE043443 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2012-06-05 [patent_title] => 'Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two' [patent_app_type] => reissue [patent_app_number] => 09/987978 [patent_app_country] => US [patent_app_date] => 2001-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 36 [patent_no_of_words] => 6596 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/043/RE043443.pdf [firstpage_image] =>[orig_patent_app_number] => 09987978 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/987978
Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two Nov 15, 2001 Issued
Array ( [id] => 5964643 [patent_doc_number] => 20020089071 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-11 [patent_title] => 'Liquid epoxy resin composition and semiconductor device' [patent_app_type] => new [patent_app_number] => 09/987155 [patent_app_country] => US [patent_app_date] => 2001-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 6648 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20020089071.pdf [firstpage_image] =>[orig_patent_app_number] => 09987155 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/987155
Liquid epoxy resin composition and semiconductor device Nov 12, 2001 Issued
Array ( [id] => 1360554 [patent_doc_number] => 06576983 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-06-10 [patent_title] => 'Controlled impedance leads in a leadframe for high frequency applications' [patent_app_type] => B1 [patent_app_number] => 10/012792 [patent_app_country] => US [patent_app_date] => 2001-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4039 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/576/06576983.pdf [firstpage_image] =>[orig_patent_app_number] => 10012792 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/012792
Controlled impedance leads in a leadframe for high frequency applications Nov 12, 2001 Issued
Array ( [id] => 1336865 [patent_doc_number] => 06597065 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-22 [patent_title] => 'Thermally enhanced semiconductor chip having integrated bonds over active circuits' [patent_app_type] => B1 [patent_app_number] => 10/002022 [patent_app_country] => US [patent_app_date] => 2001-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 5513 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/597/06597065.pdf [firstpage_image] =>[orig_patent_app_number] => 10002022 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/002022
Thermally enhanced semiconductor chip having integrated bonds over active circuits Oct 30, 2001 Issued
Array ( [id] => 6594773 [patent_doc_number] => 20020063340 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-30 [patent_title] => 'Semiconductor device and method for producing the same' [patent_app_type] => new [patent_app_number] => 09/984191 [patent_app_country] => US [patent_app_date] => 2001-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 7562 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20020063340.pdf [firstpage_image] =>[orig_patent_app_number] => 09984191 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/984191
Semiconductor device and method for producing the same Oct 28, 2001 Issued
Array ( [id] => 5870696 [patent_doc_number] => 20020047198 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-25 [patent_title] => 'Semiconductor device package and lead frame with die overhanging lead frame pad' [patent_app_type] => new [patent_app_number] => 10/002252 [patent_app_country] => US [patent_app_date] => 2001-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1305 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20020047198.pdf [firstpage_image] =>[orig_patent_app_number] => 10002252 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/002252
Semiconductor device package and lead frame with die overhanging lead frame pad Oct 25, 2001 Issued
Array ( [id] => 6092086 [patent_doc_number] => 20020050637 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-02 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 09/983472 [patent_app_country] => US [patent_app_date] => 2001-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2298 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20020050637.pdf [firstpage_image] =>[orig_patent_app_number] => 09983472 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/983472
Semiconductor device Oct 23, 2001 Abandoned
Array ( [id] => 1387283 [patent_doc_number] => 06555915 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-29 [patent_title] => 'Integrated circuit having interconnect to a substrate and method therefor' [patent_app_type] => B1 [patent_app_number] => 09/986232 [patent_app_country] => US [patent_app_date] => 2001-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2115 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555915.pdf [firstpage_image] =>[orig_patent_app_number] => 09986232 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/986232
Integrated circuit having interconnect to a substrate and method therefor Oct 21, 2001 Issued
Array ( [id] => 6811793 [patent_doc_number] => 20030071343 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-17 [patent_title] => 'INTEGRATED CIRCUIT BUS GRID HAVING WIRES WITH PRE-SELECTED VARIABLE WIDTHS' [patent_app_type] => new [patent_app_number] => 09/682772 [patent_app_country] => US [patent_app_date] => 2001-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4233 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20030071343.pdf [firstpage_image] =>[orig_patent_app_number] => 09682772 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/682772
Integrated circuit bus grid having wires with pre-selected variable widths Oct 16, 2001 Issued
Array ( [id] => 1468645 [patent_doc_number] => 06459163 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-01 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => B1 [patent_app_number] => 09/974871 [patent_app_country] => US [patent_app_date] => 2001-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3970 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/459/06459163.pdf [firstpage_image] =>[orig_patent_app_number] => 09974871 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/974871
Semiconductor device and method for fabricating the same Oct 11, 2001 Issued
Array ( [id] => 5918088 [patent_doc_number] => 20020113308 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-22 [patent_title] => 'SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE' [patent_app_type] => new [patent_app_number] => 09/973151 [patent_app_country] => US [patent_app_date] => 2001-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4258 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20020113308.pdf [firstpage_image] =>[orig_patent_app_number] => 09973151 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/973151
Semiconductor package with heat dissipating structure Oct 8, 2001 Issued
Array ( [id] => 6577911 [patent_doc_number] => 20020041033 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-11 [patent_title] => 'Semiconductor device and method of production of same' [patent_app_type] => new [patent_app_number] => 09/973111 [patent_app_country] => US [patent_app_date] => 2001-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 7606 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20020041033.pdf [firstpage_image] =>[orig_patent_app_number] => 09973111 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/973111
Semiconductor device and method of production of same Oct 8, 2001 Issued
Array ( [id] => 1387311 [patent_doc_number] => 06555917 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-29 [patent_title] => 'Semiconductor package having stacked semiconductor chips and method of making the same' [patent_app_type] => B1 [patent_app_number] => 09/974541 [patent_app_country] => US [patent_app_date] => 2001-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 3671 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555917.pdf [firstpage_image] =>[orig_patent_app_number] => 09974541 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/974541
Semiconductor package having stacked semiconductor chips and method of making the same Oct 8, 2001 Issued
Array ( [id] => 5856457 [patent_doc_number] => 20020121705 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-05 [patent_title] => 'FLIP CHIP SEMICONDUCTOR PACKAGE' [patent_app_type] => new [patent_app_number] => 09/973611 [patent_app_country] => US [patent_app_date] => 2001-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2851 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20020121705.pdf [firstpage_image] =>[orig_patent_app_number] => 09973611 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/973611
Flip chip semiconductor package Oct 8, 2001 Issued
Array ( [id] => 6107161 [patent_doc_number] => 20020171113 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-21 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE DEVICE' [patent_app_type] => new [patent_app_number] => 09/970771 [patent_app_country] => US [patent_app_date] => 2001-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5678 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 246 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0171/20020171113.pdf [firstpage_image] =>[orig_patent_app_number] => 09970771 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/970771
Semiconductor device Oct 4, 2001 Issued
Array ( [id] => 7627869 [patent_doc_number] => 06806569 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-19 [patent_title] => 'Multi-frequency power delivery system' [patent_app_type] => B2 [patent_app_number] => 09/964811 [patent_app_country] => US [patent_app_date] => 2001-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4519 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 6 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/806/06806569.pdf [firstpage_image] =>[orig_patent_app_number] => 09964811 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/964811
Multi-frequency power delivery system Sep 27, 2001 Issued
Array ( [id] => 1207153 [patent_doc_number] => 06717251 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-06 [patent_title] => 'Stacked type semiconductor device' [patent_app_type] => B2 [patent_app_number] => 09/961332 [patent_app_country] => US [patent_app_date] => 2001-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 7931 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/717/06717251.pdf [firstpage_image] =>[orig_patent_app_number] => 09961332 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/961332
Stacked type semiconductor device Sep 24, 2001 Issued
Array ( [id] => 1424587 [patent_doc_number] => 06515365 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-04 [patent_title] => 'Semiconductor device having a ground plane and manufacturing method thereof' [patent_app_type] => B2 [patent_app_number] => 09/957020 [patent_app_country] => US [patent_app_date] => 2001-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 22 [patent_no_of_words] => 3913 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/515/06515365.pdf [firstpage_image] =>[orig_patent_app_number] => 09957020 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/957020
Semiconductor device having a ground plane and manufacturing method thereof Sep 20, 2001 Issued
Menu