
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1404858
[patent_doc_number] => 06531785
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-03-11
[patent_title] => 'Semiconductor device'
[patent_app_type] => B2
[patent_app_number] => 09/988587
[patent_app_country] => US
[patent_app_date] => 2001-11-20
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[pdf_file] => patents/06/531/06531785.pdf
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Array
(
[id] => 6799527
[patent_doc_number] => 20030094691
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-22
[patent_title] => 'ENCAPSULATION OF ELECTRONIC DEVICES'
[patent_app_type] => new
[patent_app_number] => 09/989362
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/989362 | Encapsulation of electronic devices | Nov 19, 2001 | Issued |
Array
(
[id] => 8209949
[patent_doc_number] => RE043443
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[patent_issue_date] => 2012-06-05
[patent_title] => 'Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two'
[patent_app_type] => reissue
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[patent_app_country] => US
[patent_app_date] => 2001-11-16
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Array
(
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[patent_issue_date] => 2002-07-11
[patent_title] => 'Liquid epoxy resin composition and semiconductor device'
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Array
(
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[patent_issue_date] => 2003-06-10
[patent_title] => 'Controlled impedance leads in a leadframe for high frequency applications'
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Array
(
[id] => 1336865
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[patent_title] => 'Thermally enhanced semiconductor chip having integrated bonds over active circuits'
[patent_app_type] => B1
[patent_app_number] => 10/002022
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Array
(
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Array
(
[id] => 5870696
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[patent_issue_date] => 2002-04-25
[patent_title] => 'Semiconductor device package and lead frame with die overhanging lead frame pad'
[patent_app_type] => new
[patent_app_number] => 10/002252
[patent_app_country] => US
[patent_app_date] => 2001-10-26
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[firstpage_image] =>[orig_patent_app_number] => 10002252
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/002252 | Semiconductor device package and lead frame with die overhanging lead frame pad | Oct 25, 2001 | Issued |
Array
(
[id] => 6092086
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/983472 | Semiconductor device | Oct 23, 2001 | Abandoned |
Array
(
[id] => 1387283
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[patent_issue_date] => 2003-04-29
[patent_title] => 'Integrated circuit having interconnect to a substrate and method therefor'
[patent_app_type] => B1
[patent_app_number] => 09/986232
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Array
(
[id] => 6811793
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[patent_issue_date] => 2003-04-17
[patent_title] => 'INTEGRATED CIRCUIT BUS GRID HAVING WIRES WITH PRE-SELECTED VARIABLE WIDTHS'
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[patent_app_number] => 09/682772
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/682772 | Integrated circuit bus grid having wires with pre-selected variable widths | Oct 16, 2001 | Issued |
Array
(
[id] => 1468645
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Array
(
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Array
(
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Array
(
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Array
(
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Array
(
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Array
(
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Array
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Array
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