
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1583036
[patent_doc_number] => 06424030
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-07-23
[patent_title] => 'Semiconductor memory module having double-sided stacked memory chip layout'
[patent_app_type] => B2
[patent_app_number] => 09/863450
[patent_app_country] => US
[patent_app_date] => 2001-05-24
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/424/06424030.pdf
[firstpage_image] =>[orig_patent_app_number] => 09863450
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Array
(
[id] => 1536569
[patent_doc_number] => 06489684
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-03
[patent_title] => 'Reduction of electromigration in dual damascene connector'
[patent_app_type] => B1
[patent_app_number] => 09/854992
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[patent_app_date] => 2001-05-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/854992 | Reduction of electromigration in dual damascene connector | May 13, 2001 | Issued |
Array
(
[id] => 1561836
[patent_doc_number] => 06437429
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-20
[patent_title] => 'Semiconductor package with metal pads'
[patent_app_type] => B1
[patent_app_number] => 09/852641
[patent_app_country] => US
[patent_app_date] => 2001-05-11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/852641 | Semiconductor package with metal pads | May 10, 2001 | Issued |
Array
(
[id] => 1410713
[patent_doc_number] => 06534858
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-03-18
[patent_title] => 'Assembly and methods for packaged die on pcb with heat sink encapsulant'
[patent_app_type] => B2
[patent_app_number] => 09/835541
[patent_app_country] => US
[patent_app_date] => 2001-04-16
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 1422634
[patent_doc_number] => 06518654
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[patent_kind] => B1
[patent_issue_date] => 2003-02-11
[patent_title] => 'Packages for semiconductor die'
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[patent_app_number] => 09/834415
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/834415 | Packages for semiconductor die | Apr 12, 2001 | Issued |
Array
(
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[patent_issue_date] => 2002-10-29
[patent_title] => 'Three-dimensional memory stacking using anisotropic epoxy interconnections'
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Array
(
[id] => 6985614
[patent_doc_number] => 20010035579
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[patent_issue_date] => 2001-11-01
[patent_title] => 'Resin-molded unit including an electronic circuit component'
[patent_app_type] => new
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Array
(
[id] => 5901094
[patent_doc_number] => 20020140075
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'POWER TRANSISTOR PACKAGE WITH INTEGRATED FLANGE FOR SURFACE MOUNT HEAT REMOVAL'
[patent_app_type] => new
[patent_app_number] => 09/819262
[patent_app_country] => US
[patent_app_date] => 2001-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 09819262
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/819262 | Power transistor package with integrated flange for surface mount heat removal | Mar 26, 2001 | Issued |
Array
(
[id] => 1410682
[patent_doc_number] => 06534856
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-18
[patent_title] => 'Sockets for springed semiconductor devices'
[patent_app_type] => B1
[patent_app_number] => 09/819143
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/819143 | Sockets for springed semiconductor devices | Mar 26, 2001 | Issued |
Array
(
[id] => 1502423
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[patent_issue_date] => 2002-11-26
[patent_title] => 'Semiconductor device'
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[patent_app_number] => 09/818432
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Array
(
[id] => 1053780
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[patent_title] => 'Semiconductor package'
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Array
(
[id] => 7028268
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[patent_title] => 'Leadless plastic chip carrier with etch back pad singulation and die attach pad array'
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Array
(
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Array
(
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Array
(
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Array
(
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[patent_title] => 'Copper plated PTH barrels and methods for fabricating'
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Array
(
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Array
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Array
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