Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1583036 [patent_doc_number] => 06424030 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-07-23 [patent_title] => 'Semiconductor memory module having double-sided stacked memory chip layout' [patent_app_type] => B2 [patent_app_number] => 09/863450 [patent_app_country] => US [patent_app_date] => 2001-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 48 [patent_no_of_words] => 10527 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/424/06424030.pdf [firstpage_image] =>[orig_patent_app_number] => 09863450 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/863450
Semiconductor memory module having double-sided stacked memory chip layout May 23, 2001 Issued
Array ( [id] => 1536569 [patent_doc_number] => 06489684 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-03 [patent_title] => 'Reduction of electromigration in dual damascene connector' [patent_app_type] => B1 [patent_app_number] => 09/854992 [patent_app_country] => US [patent_app_date] => 2001-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1698 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/489/06489684.pdf [firstpage_image] =>[orig_patent_app_number] => 09854992 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/854992
Reduction of electromigration in dual damascene connector May 13, 2001 Issued
Array ( [id] => 1561836 [patent_doc_number] => 06437429 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-20 [patent_title] => 'Semiconductor package with metal pads' [patent_app_type] => B1 [patent_app_number] => 09/852641 [patent_app_country] => US [patent_app_date] => 2001-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 2989 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/437/06437429.pdf [firstpage_image] =>[orig_patent_app_number] => 09852641 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/852641
Semiconductor package with metal pads May 10, 2001 Issued
Array ( [id] => 1410713 [patent_doc_number] => 06534858 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-03-18 [patent_title] => 'Assembly and methods for packaged die on pcb with heat sink encapsulant' [patent_app_type] => B2 [patent_app_number] => 09/835541 [patent_app_country] => US [patent_app_date] => 2001-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3150 [patent_no_of_claims] => 69 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/534/06534858.pdf [firstpage_image] =>[orig_patent_app_number] => 09835541 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/835541
Assembly and methods for packaged die on pcb with heat sink encapsulant Apr 15, 2001 Issued
Array ( [id] => 1422634 [patent_doc_number] => 06518654 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-11 [patent_title] => 'Packages for semiconductor die' [patent_app_type] => B1 [patent_app_number] => 09/834415 [patent_app_country] => US [patent_app_date] => 2001-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3501 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518654.pdf [firstpage_image] =>[orig_patent_app_number] => 09834415 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/834415
Packages for semiconductor die Apr 12, 2001 Issued
Array ( [id] => 7645237 [patent_doc_number] => 06472735 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-29 [patent_title] => 'Three-dimensional memory stacking using anisotropic epoxy interconnections' [patent_app_type] => B2 [patent_app_number] => 09/826621 [patent_app_country] => US [patent_app_date] => 2001-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 8820 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/472/06472735.pdf [firstpage_image] =>[orig_patent_app_number] => 09826621 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826621
Three-dimensional memory stacking using anisotropic epoxy interconnections Apr 4, 2001 Issued
Array ( [id] => 6985614 [patent_doc_number] => 20010035579 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-01 [patent_title] => 'Resin-molded unit including an electronic circuit component' [patent_app_type] => new [patent_app_number] => 09/825420 [patent_app_country] => US [patent_app_date] => 2001-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5459 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20010035579.pdf [firstpage_image] =>[orig_patent_app_number] => 09825420 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/825420
Resin-molded unit including an electronic circuit component Apr 2, 2001 Issued
Array ( [id] => 5901094 [patent_doc_number] => 20020140075 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'POWER TRANSISTOR PACKAGE WITH INTEGRATED FLANGE FOR SURFACE MOUNT HEAT REMOVAL' [patent_app_type] => new [patent_app_number] => 09/819262 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1829 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140075.pdf [firstpage_image] =>[orig_patent_app_number] => 09819262 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/819262
Power transistor package with integrated flange for surface mount heat removal Mar 26, 2001 Issued
Array ( [id] => 1410682 [patent_doc_number] => 06534856 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-18 [patent_title] => 'Sockets for springed semiconductor devices' [patent_app_type] => B1 [patent_app_number] => 09/819143 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 16 [patent_no_of_words] => 6860 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/534/06534856.pdf [firstpage_image] =>[orig_patent_app_number] => 09819143 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/819143
Sockets for springed semiconductor devices Mar 26, 2001 Issued
Array ( [id] => 1502423 [patent_doc_number] => 06486565 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-11-26 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 09/818432 [patent_app_country] => US [patent_app_date] => 2001-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3402 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/486/06486565.pdf [firstpage_image] =>[orig_patent_app_number] => 09818432 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/818432
Semiconductor device Mar 25, 2001 Issued
Array ( [id] => 1053780 [patent_doc_number] => 06858919 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-22 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 09/816852 [patent_app_country] => US [patent_app_date] => 2001-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3703 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/858/06858919.pdf [firstpage_image] =>[orig_patent_app_number] => 09816852 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/816852
Semiconductor package Mar 22, 2001 Issued
Array ( [id] => 7028268 [patent_doc_number] => 20010014538 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-16 [patent_title] => 'Leadless plastic chip carrier with etch back pad singulation and die attach pad array' [patent_app_type] => new [patent_app_number] => 09/802679 [patent_app_country] => US [patent_app_date] => 2001-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4021 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0014/20010014538.pdf [firstpage_image] =>[orig_patent_app_number] => 09802679 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/802679
Leadless plastic chip carrier with etch back pad singulation and die attach pad array Mar 8, 2001 Issued
Array ( [id] => 7645238 [patent_doc_number] => 06472734 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-29 [patent_title] => 'Stacked semiconductor device and method for manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 09/799621 [patent_app_country] => US [patent_app_date] => 2001-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 4399 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 6 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/472/06472734.pdf [firstpage_image] =>[orig_patent_app_number] => 09799621 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/799621
Stacked semiconductor device and method for manufacturing the same Mar 6, 2001 Issued
Array ( [id] => 7639787 [patent_doc_number] => 06396129 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-28 [patent_title] => 'Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package' [patent_app_type] => B1 [patent_app_number] => 09/800361 [patent_app_country] => US [patent_app_date] => 2001-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3144 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/396/06396129.pdf [firstpage_image] =>[orig_patent_app_number] => 09800361 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/800361
Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package Mar 4, 2001 Issued
Array ( [id] => 6076028 [patent_doc_number] => 20020079550 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-27 [patent_title] => 'Conductive equipotential landing pads formed on the underside of a MEMS device' [patent_app_type] => new [patent_app_number] => 09/798129 [patent_app_country] => US [patent_app_date] => 2001-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 6732 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20020079550.pdf [firstpage_image] =>[orig_patent_app_number] => 09798129 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/798129
Conductive equipotential landing pads formed on the underside of a MEMS device Feb 28, 2001 Issued
Array ( [id] => 1293548 [patent_doc_number] => 06630743 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-10-07 [patent_title] => 'Copper plated PTH barrels and methods for fabricating' [patent_app_type] => B2 [patent_app_number] => 09/795332 [patent_app_country] => US [patent_app_date] => 2001-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 5373 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/630/06630743.pdf [firstpage_image] =>[orig_patent_app_number] => 09795332 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/795332
Copper plated PTH barrels and methods for fabricating Feb 26, 2001 Issued
Array ( [id] => 6891249 [patent_doc_number] => 20010017411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-30 [patent_title] => 'Semiconductor chip and semiconductor device having the chip' [patent_app_type] => new [patent_app_number] => 09/789610 [patent_app_country] => US [patent_app_date] => 2001-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8038 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20010017411.pdf [firstpage_image] =>[orig_patent_app_number] => 09789610 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/789610
Semiconductor chip and semiconductor device having the chip Feb 21, 2001 Issued
Array ( [id] => 1497226 [patent_doc_number] => 06404068 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Paste composition, and protective film and semiconductor device both obtained with the same' [patent_app_type] => B1 [patent_app_number] => 09/763192 [patent_app_country] => US [patent_app_date] => 2001-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 9365 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404068.pdf [firstpage_image] =>[orig_patent_app_number] => 09763192 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/763192
Paste composition, and protective film and semiconductor device both obtained with the same Feb 19, 2001 Issued
Array ( [id] => 1183235 [patent_doc_number] => 06737740 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-18 [patent_title] => 'High performance silicon contact for flip chip' [patent_app_type] => B2 [patent_app_number] => 09/778913 [patent_app_country] => US [patent_app_date] => 2001-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2457 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/737/06737740.pdf [firstpage_image] =>[orig_patent_app_number] => 09778913 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/778913
High performance silicon contact for flip chip Feb 7, 2001 Issued
Array ( [id] => 6887307 [patent_doc_number] => 20010008301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-07-19 [patent_title] => 'Semiconductor device' [patent_app_type] => new-utility [patent_app_number] => 09/777676 [patent_app_country] => US [patent_app_date] => 2001-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2720 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20010008301.pdf [firstpage_image] =>[orig_patent_app_number] => 09777676 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/777676
Semiconductor device Feb 6, 2001 Issued
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