Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 3628772
[patent_doc_number] => 05642262
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-24
[patent_title] => 'High-density programmable logic device in a multi-chip module package with improved interconnect scheme'
[patent_app_type] => 1
[patent_app_number] => 8/393576
[patent_app_country] => US
[patent_app_date] => 1995-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 3608
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/642/05642262.pdf
[firstpage_image] =>[orig_patent_app_number] => 393576
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/393576 | High-density programmable logic device in a multi-chip module package with improved interconnect scheme | Feb 22, 1995 | Issued |
Array
(
[id] => 3562453
[patent_doc_number] => 05519585
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Sandwiched insulative/conductive layer EMI shield structure for printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/391828
[patent_app_country] => US
[patent_app_date] => 1995-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 1766
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 280
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/519/05519585.pdf
[firstpage_image] =>[orig_patent_app_number] => 391828
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/391828 | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board | Feb 20, 1995 | Issued |
08/391246 | MULTILAYER PRINTED WIRING BOARD | Feb 20, 1995 | Abandoned |
Array
(
[id] => 3890840
[patent_doc_number] => 05798909
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-25
[patent_title] => 'Single-tiered organic chip carriers for wire bond-type chips'
[patent_app_type] => 1
[patent_app_number] => 8/390344
[patent_app_country] => US
[patent_app_date] => 1995-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 4748
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 248
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/798/05798909.pdf
[firstpage_image] =>[orig_patent_app_number] => 390344
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/390344 | Single-tiered organic chip carriers for wire bond-type chips | Feb 14, 1995 | Issued |
Array
(
[id] => 3517903
[patent_doc_number] => 05587884
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-24
[patent_title] => 'Electrical connector jack with encapsulated signal conditioning components'
[patent_app_type] => 1
[patent_app_number] => 8/384086
[patent_app_country] => US
[patent_app_date] => 1995-02-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 6598
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/587/05587884.pdf
[firstpage_image] =>[orig_patent_app_number] => 384086
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/384086 | Electrical connector jack with encapsulated signal conditioning components | Feb 5, 1995 | Issued |
08/382147 | BALL BUMP GRID ARRAY SEMICONDUCTOR PACKAGES | Jan 31, 1995 | Abandoned |
Array
(
[id] => 3628803
[patent_doc_number] => 05642264
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-24
[patent_title] => 'Apparatus for supporting circuit cards in slot locations'
[patent_app_type] => 1
[patent_app_number] => 8/379085
[patent_app_country] => US
[patent_app_date] => 1995-01-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 5753
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/642/05642264.pdf
[firstpage_image] =>[orig_patent_app_number] => 379085
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/379085 | Apparatus for supporting circuit cards in slot locations | Jan 25, 1995 | Issued |
08/377778 | HIGH PERFORMANCE INTEGRATED CIRCUIT PACKAGE | Jan 23, 1995 | Abandoned |
Array
(
[id] => 3732864
[patent_doc_number] => 05701233
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Stackable modules and multimodular assemblies'
[patent_app_type] => 1
[patent_app_number] => 8/376799
[patent_app_country] => US
[patent_app_date] => 1995-01-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 19
[patent_no_of_words] => 5874
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 191
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/701/05701233.pdf
[firstpage_image] =>[orig_patent_app_number] => 376799
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/376799 | Stackable modules and multimodular assemblies | Jan 22, 1995 | Issued |
Array
(
[id] => 3643008
[patent_doc_number] => 05631807
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-20
[patent_title] => 'Electronic circuit structure with aperture suspended component'
[patent_app_type] => 1
[patent_app_number] => 8/376017
[patent_app_country] => US
[patent_app_date] => 1995-01-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 7687
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/631/05631807.pdf
[firstpage_image] =>[orig_patent_app_number] => 376017
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/376017 | Electronic circuit structure with aperture suspended component | Jan 19, 1995 | Issued |
Array
(
[id] => 3670501
[patent_doc_number] => 05657206
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-12
[patent_title] => 'Conductive epoxy flip-chip package and method'
[patent_app_type] => 1
[patent_app_number] => 8/374421
[patent_app_country] => US
[patent_app_date] => 1995-01-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 10
[patent_no_of_words] => 4029
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/657/05657206.pdf
[firstpage_image] =>[orig_patent_app_number] => 374421
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/374421 | Conductive epoxy flip-chip package and method | Jan 18, 1995 | Issued |
Array
(
[id] => 3634609
[patent_doc_number] => 05613033
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-18
[patent_title] => 'Laminated module for stacking integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/374275
[patent_app_country] => US
[patent_app_date] => 1995-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4021
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 256
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/613/05613033.pdf
[firstpage_image] =>[orig_patent_app_number] => 374275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/374275 | Laminated module for stacking integrated circuits | Jan 17, 1995 | Issued |
Array
(
[id] => 3803288
[patent_doc_number] => 05726861
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-10
[patent_title] => 'Surface mount component height control'
[patent_app_type] => 1
[patent_app_number] => 8/367967
[patent_app_country] => US
[patent_app_date] => 1995-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1592
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/726/05726861.pdf
[firstpage_image] =>[orig_patent_app_number] => 367967
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367967 | Surface mount component height control | Jan 2, 1995 | Issued |
Array
(
[id] => 3736209
[patent_doc_number] => 05665989
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Programmable microsystems in silicon'
[patent_app_type] => 1
[patent_app_number] => 8/367556
[patent_app_country] => US
[patent_app_date] => 1995-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 4687
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/665/05665989.pdf
[firstpage_image] =>[orig_patent_app_number] => 367556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367556 | Programmable microsystems in silicon | Jan 2, 1995 | Issued |
Array
(
[id] => 3690735
[patent_doc_number] => 05633785
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Integrated circuit component package with integral passive component'
[patent_app_type] => 1
[patent_app_number] => 8/367460
[patent_app_country] => US
[patent_app_date] => 1994-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 3818
[patent_no_of_claims] => 24
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633785.pdf
[firstpage_image] =>[orig_patent_app_number] => 367460
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367460 | Integrated circuit component package with integral passive component | Dec 29, 1994 | Issued |
08/366816 | MULTI-LAYER-MULTI-CHIP PYRAMID AND CIRCUIT BOARD STRUCTURE AND METHOD OF FORMING SAME | Dec 29, 1994 | Abandoned |
08/365914 | POWER DISTRIBUTION SYSTEM FOR A MULTI-LAYER CIRCUIT BOARD | Dec 28, 1994 | Abandoned |
08/364362 | INTEGRATED SOCKET-TYPE PACKAGE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND CIRCUITS | Dec 26, 1994 | Abandoned |
Array
(
[id] => 3668364
[patent_doc_number] => 05592365
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-07
[patent_title] => 'Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch'
[patent_app_type] => 1
[patent_app_number] => 8/360018
[patent_app_country] => US
[patent_app_date] => 1994-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 24
[patent_no_of_words] => 9261
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/592/05592365.pdf
[firstpage_image] =>[orig_patent_app_number] => 360018
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/360018 | Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch | Dec 19, 1994 | Issued |
Array
(
[id] => 3466523
[patent_doc_number] => 05473513
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-05
[patent_title] => 'Photosensitive array wherein chips are not thermally matched to the substrate'
[patent_app_type] => 1
[patent_app_number] => 8/359352
[patent_app_country] => US
[patent_app_date] => 1994-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3133
[patent_no_of_claims] => 19
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/473/05473513.pdf
[firstpage_image] =>[orig_patent_app_number] => 359352
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/359352 | Photosensitive array wherein chips are not thermally matched to the substrate | Dec 18, 1994 | Issued |