Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19957390 [patent_doc_number] => 12327809 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-10 [patent_title] => Vertically stacked and bonded memory arrays [patent_app_type] => utility [patent_app_number] => 17/355793 [patent_app_country] => US [patent_app_date] => 2021-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 17 [patent_no_of_words] => 15642 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17355793 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/355793
Vertically stacked and bonded memory arrays Jun 22, 2021 Issued
Array ( [id] => 18827666 [patent_doc_number] => 11842956 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-12 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/355790 [patent_app_country] => US [patent_app_date] => 2021-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 11212 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17355790 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/355790
Semiconductor package Jun 22, 2021 Issued
Array ( [id] => 17158963 [patent_doc_number] => 20210320014 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-14 [patent_title] => MCM Package Isolation Through Leadframe Design and Package Saw Process [patent_app_type] => utility [patent_app_number] => 17/356404 [patent_app_country] => US [patent_app_date] => 2021-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2567 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17356404 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/356404
MCM package isolation through leadframe design and package saw process Jun 22, 2021 Issued
Array ( [id] => 18857327 [patent_doc_number] => 11854922 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semicondutor package substrate with die cavity and redistribution layer [patent_app_type] => utility [patent_app_number] => 17/353805 [patent_app_country] => US [patent_app_date] => 2021-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 4273 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17353805 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/353805
Semicondutor package substrate with die cavity and redistribution layer Jun 20, 2021 Issued
Array ( [id] => 18548282 [patent_doc_number] => 11721642 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-08 [patent_title] => Semiconductor device package connector structure and method therefor [patent_app_type] => utility [patent_app_number] => 17/350190 [patent_app_country] => US [patent_app_date] => 2021-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3231 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17350190 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/350190
Semiconductor device package connector structure and method therefor Jun 16, 2021 Issued
Array ( [id] => 19046759 [patent_doc_number] => 11935879 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Integrated passive device (IPD) components and a package and processes implementing the same [patent_app_type] => utility [patent_app_number] => 17/342925 [patent_app_country] => US [patent_app_date] => 2021-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 18073 [patent_no_of_claims] => 56 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17342925 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/342925
Integrated passive device (IPD) components and a package and processes implementing the same Jun 8, 2021 Issued
Array ( [id] => 17112020 [patent_doc_number] => 20210292617 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AND PRODUCTION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/338147 [patent_app_country] => US [patent_app_date] => 2021-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15001 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17338147 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/338147
Adhesive composition, film-like adhesive and production method thereof, and semiconductor package using film-like adhesive and production method thereof Jun 2, 2021 Issued
Array ( [id] => 17100232 [patent_doc_number] => 20210288023 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/336499 [patent_app_country] => US [patent_app_date] => 2021-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5883 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17336499 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/336499
Semiconductor device, endoscope, and method for manufacturing semiconductor device Jun 1, 2021 Issued
Array ( [id] => 17100165 [patent_doc_number] => 20210287956 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => 3DIC Packaging with Hot Spot Thermal Management Features [patent_app_type] => utility [patent_app_number] => 17/331945 [patent_app_country] => US [patent_app_date] => 2021-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5279 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17331945 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/331945
3DIC packaging with hot spot thermal management features May 26, 2021 Issued
Array ( [id] => 19260977 [patent_doc_number] => 12021043 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-25 [patent_title] => Semiconductor device and method for manufacturing semiconductor device [patent_app_type] => utility [patent_app_number] => 17/331013 [patent_app_country] => US [patent_app_date] => 2021-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 28 [patent_no_of_words] => 9750 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17331013 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/331013
Semiconductor device and method for manufacturing semiconductor device May 25, 2021 Issued
Array ( [id] => 17085480 [patent_doc_number] => 20210280487 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => SEMICONDUCTOR DIE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/327787 [patent_app_country] => US [patent_app_date] => 2021-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9526 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17327787 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/327787
Semiconductor die, manufacturing method thereof, and semiconductor package May 23, 2021 Issued
Array ( [id] => 17402919 [patent_doc_number] => 20220045010 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-10 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/328297 [patent_app_country] => US [patent_app_date] => 2021-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10436 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17328297 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/328297
Semiconductor package May 23, 2021 Issued
Array ( [id] => 17738095 [patent_doc_number] => 20220223557 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-14 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/325649 [patent_app_country] => US [patent_app_date] => 2021-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9000 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17325649 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/325649
Package structure May 19, 2021 Issued
Array ( [id] => 19079494 [patent_doc_number] => 11948871 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-02 [patent_title] => Process for thin film capacitor integration [patent_app_type] => utility [patent_app_number] => 17/325197 [patent_app_country] => US [patent_app_date] => 2021-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3325 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 300 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17325197 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/325197
Process for thin film capacitor integration May 18, 2021 Issued
Array ( [id] => 17708640 [patent_doc_number] => 20220208648 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 17/322557 [patent_app_country] => US [patent_app_date] => 2021-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12779 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17322557 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/322557
Semiconductor chip including through electrode, and semiconductor package including the same May 16, 2021 Issued
Array ( [id] => 19168465 [patent_doc_number] => 11984378 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Semiconductor package structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/319707 [patent_app_country] => US [patent_app_date] => 2021-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 8252 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17319707 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/319707
Semiconductor package structure and method for forming the same May 12, 2021 Issued
Array ( [id] => 17115636 [patent_doc_number] => 20210296233 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => SEMICONDUCTOR CHIP WITH STACKED CONDUCTOR LINES AND AIR GAPS [patent_app_type] => utility [patent_app_number] => 17/317510 [patent_app_country] => US [patent_app_date] => 2021-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9191 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317510 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/317510
Semiconductor chip with stacked conductor lines and air gaps May 10, 2021 Issued
Array ( [id] => 18721503 [patent_doc_number] => 11798859 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Electronic device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/317762 [patent_app_country] => US [patent_app_date] => 2021-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 36 [patent_no_of_words] => 6390 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317762 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/317762
Electronic device package and method of manufacturing the same May 10, 2021 Issued
Array ( [id] => 18402196 [patent_doc_number] => 11664346 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-30 [patent_title] => Semiconductor package including semiconductor chips and dummy pad [patent_app_type] => utility [patent_app_number] => 17/306625 [patent_app_country] => US [patent_app_date] => 2021-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 8443 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17306625 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/306625
Semiconductor package including semiconductor chips and dummy pad May 2, 2021 Issued
Array ( [id] => 18105563 [patent_doc_number] => 11545461 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-03 [patent_title] => Adhesive member and display device including the same [patent_app_type] => utility [patent_app_number] => 17/245167 [patent_app_country] => US [patent_app_date] => 2021-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 24 [patent_no_of_words] => 12373 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17245167 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/245167
Adhesive member and display device including the same Apr 29, 2021 Issued
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