Search

Jasmine Jhihan B Clark

Examiner (ID: 7485, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 3621, 2899, 2503, 2816
Total Applications
2981
Issued Applications
2695
Pending Applications
126
Abandoned Applications
160

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3628772 [patent_doc_number] => 05642262 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-24 [patent_title] => 'High-density programmable logic device in a multi-chip module package with improved interconnect scheme' [patent_app_type] => 1 [patent_app_number] => 8/393576 [patent_app_country] => US [patent_app_date] => 1995-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3608 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/642/05642262.pdf [firstpage_image] =>[orig_patent_app_number] => 393576 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/393576
High-density programmable logic device in a multi-chip module package with improved interconnect scheme Feb 22, 1995 Issued
Array ( [id] => 3562453 [patent_doc_number] => 05519585 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-21 [patent_title] => 'Sandwiched insulative/conductive layer EMI shield structure for printed circuit board' [patent_app_type] => 1 [patent_app_number] => 8/391828 [patent_app_country] => US [patent_app_date] => 1995-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1766 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 280 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/519/05519585.pdf [firstpage_image] =>[orig_patent_app_number] => 391828 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/391828
Sandwiched insulative/conductive layer EMI shield structure for printed circuit board Feb 20, 1995 Issued
08/391246 MULTILAYER PRINTED WIRING BOARD Feb 20, 1995 Abandoned
Array ( [id] => 3890840 [patent_doc_number] => 05798909 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-25 [patent_title] => 'Single-tiered organic chip carriers for wire bond-type chips' [patent_app_type] => 1 [patent_app_number] => 8/390344 [patent_app_country] => US [patent_app_date] => 1995-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4748 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 248 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/798/05798909.pdf [firstpage_image] =>[orig_patent_app_number] => 390344 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/390344
Single-tiered organic chip carriers for wire bond-type chips Feb 14, 1995 Issued
Array ( [id] => 3517903 [patent_doc_number] => 05587884 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-12-24 [patent_title] => 'Electrical connector jack with encapsulated signal conditioning components' [patent_app_type] => 1 [patent_app_number] => 8/384086 [patent_app_country] => US [patent_app_date] => 1995-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 6598 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/587/05587884.pdf [firstpage_image] =>[orig_patent_app_number] => 384086 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/384086
Electrical connector jack with encapsulated signal conditioning components Feb 5, 1995 Issued
08/382147 BALL BUMP GRID ARRAY SEMICONDUCTOR PACKAGES Jan 31, 1995 Abandoned
Array ( [id] => 3628803 [patent_doc_number] => 05642264 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-24 [patent_title] => 'Apparatus for supporting circuit cards in slot locations' [patent_app_type] => 1 [patent_app_number] => 8/379085 [patent_app_country] => US [patent_app_date] => 1995-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 5753 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/642/05642264.pdf [firstpage_image] =>[orig_patent_app_number] => 379085 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/379085
Apparatus for supporting circuit cards in slot locations Jan 25, 1995 Issued
08/377778 HIGH PERFORMANCE INTEGRATED CIRCUIT PACKAGE Jan 23, 1995 Abandoned
Array ( [id] => 3732864 [patent_doc_number] => 05701233 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-23 [patent_title] => 'Stackable modules and multimodular assemblies' [patent_app_type] => 1 [patent_app_number] => 8/376799 [patent_app_country] => US [patent_app_date] => 1995-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 19 [patent_no_of_words] => 5874 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/701/05701233.pdf [firstpage_image] =>[orig_patent_app_number] => 376799 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/376799
Stackable modules and multimodular assemblies Jan 22, 1995 Issued
Array ( [id] => 3643008 [patent_doc_number] => 05631807 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-20 [patent_title] => 'Electronic circuit structure with aperture suspended component' [patent_app_type] => 1 [patent_app_number] => 8/376017 [patent_app_country] => US [patent_app_date] => 1995-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 7687 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/631/05631807.pdf [firstpage_image] =>[orig_patent_app_number] => 376017 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/376017
Electronic circuit structure with aperture suspended component Jan 19, 1995 Issued
Array ( [id] => 3670501 [patent_doc_number] => 05657206 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-12 [patent_title] => 'Conductive epoxy flip-chip package and method' [patent_app_type] => 1 [patent_app_number] => 8/374421 [patent_app_country] => US [patent_app_date] => 1995-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 4029 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/657/05657206.pdf [firstpage_image] =>[orig_patent_app_number] => 374421 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/374421
Conductive epoxy flip-chip package and method Jan 18, 1995 Issued
Array ( [id] => 3634609 [patent_doc_number] => 05613033 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-03-18 [patent_title] => 'Laminated module for stacking integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/374275 [patent_app_country] => US [patent_app_date] => 1995-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4021 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/613/05613033.pdf [firstpage_image] =>[orig_patent_app_number] => 374275 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/374275
Laminated module for stacking integrated circuits Jan 17, 1995 Issued
Array ( [id] => 3803288 [patent_doc_number] => 05726861 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-10 [patent_title] => 'Surface mount component height control' [patent_app_type] => 1 [patent_app_number] => 8/367967 [patent_app_country] => US [patent_app_date] => 1995-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1592 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/726/05726861.pdf [firstpage_image] =>[orig_patent_app_number] => 367967 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/367967
Surface mount component height control Jan 2, 1995 Issued
Array ( [id] => 3736209 [patent_doc_number] => 05665989 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-09 [patent_title] => 'Programmable microsystems in silicon' [patent_app_type] => 1 [patent_app_number] => 8/367556 [patent_app_country] => US [patent_app_date] => 1995-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 4687 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/665/05665989.pdf [firstpage_image] =>[orig_patent_app_number] => 367556 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/367556
Programmable microsystems in silicon Jan 2, 1995 Issued
Array ( [id] => 3690735 [patent_doc_number] => 05633785 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-27 [patent_title] => 'Integrated circuit component package with integral passive component' [patent_app_type] => 1 [patent_app_number] => 8/367460 [patent_app_country] => US [patent_app_date] => 1994-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3818 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/633/05633785.pdf [firstpage_image] =>[orig_patent_app_number] => 367460 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/367460
Integrated circuit component package with integral passive component Dec 29, 1994 Issued
08/366816 MULTI-LAYER-MULTI-CHIP PYRAMID AND CIRCUIT BOARD STRUCTURE AND METHOD OF FORMING SAME Dec 29, 1994 Abandoned
08/365914 POWER DISTRIBUTION SYSTEM FOR A MULTI-LAYER CIRCUIT BOARD Dec 28, 1994 Abandoned
08/364362 INTEGRATED SOCKET-TYPE PACKAGE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND CIRCUITS Dec 26, 1994 Abandoned
Array ( [id] => 3668364 [patent_doc_number] => 05592365 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-07 [patent_title] => 'Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch' [patent_app_type] => 1 [patent_app_number] => 8/360018 [patent_app_country] => US [patent_app_date] => 1994-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 9261 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/592/05592365.pdf [firstpage_image] =>[orig_patent_app_number] => 360018 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/360018
Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch Dec 19, 1994 Issued
Array ( [id] => 3466523 [patent_doc_number] => 05473513 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-12-05 [patent_title] => 'Photosensitive array wherein chips are not thermally matched to the substrate' [patent_app_type] => 1 [patent_app_number] => 8/359352 [patent_app_country] => US [patent_app_date] => 1994-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3133 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/473/05473513.pdf [firstpage_image] =>[orig_patent_app_number] => 359352 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/359352
Photosensitive array wherein chips are not thermally matched to the substrate Dec 18, 1994 Issued
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