
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7076945
[patent_doc_number] => 20010040286
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-15
[patent_title] => 'Semiconductor device and method for the fabrication thereof'
[patent_app_type] => new
[patent_app_number] => 09/745412
[patent_app_country] => US
[patent_app_date] => 2000-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 13958
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0040/20010040286.pdf
[firstpage_image] =>[orig_patent_app_number] => 09745412
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/745412 | Semiconductor device and method for the fabrication thereof | Dec 25, 2000 | Issued |
Array
(
[id] => 6902020
[patent_doc_number] => 20010000929
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-05-10
[patent_title] => 'Flip chip with integrated flux and underfill'
[patent_app_type] => new-utility
[patent_app_number] => 09/746786
[patent_app_country] => US
[patent_app_date] => 2000-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5238
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20010000929.pdf
[firstpage_image] =>[orig_patent_app_number] => 09746786
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/746786 | Flip chip with integrated flux and underfill | Dec 20, 2000 | Abandoned |
Array
(
[id] => 7191547
[patent_doc_number] => 20050040517
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-24
[patent_title] => 'Encasing arrangement for a semicoductor component'
[patent_app_type] => utility
[patent_app_number] => 10/149892
[patent_app_country] => US
[patent_app_date] => 2000-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2892
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
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[patent_no_of_assignments] => 0
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[pdf_file] => publications/A1/0040/20050040517.pdf
[firstpage_image] =>[orig_patent_app_number] => 10149892
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/149892 | Encasing arrangement for a semiconductor component | Dec 12, 2000 | Issued |
Array
(
[id] => 6875372
[patent_doc_number] => 20010000116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-04-05
[patent_title] => 'Semiconductor device'
[patent_app_type] => new-utility
[patent_app_number] => 09/731757
[patent_app_country] => US
[patent_app_date] => 2000-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 9301
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 80
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20010000116.pdf
[firstpage_image] =>[orig_patent_app_number] => 09731757
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/731757 | Semiconductor device | Dec 7, 2000 | Issued |
Array
(
[id] => 1374950
[patent_doc_number] => 06566742
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-05-20
[patent_title] => 'Structure for mounting components'
[patent_app_type] => B1
[patent_app_number] => 09/722530
[patent_app_country] => US
[patent_app_date] => 2000-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 4914
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/566/06566742.pdf
[firstpage_image] =>[orig_patent_app_number] => 09722530
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/722530 | Structure for mounting components | Nov 27, 2000 | Issued |
Array
(
[id] => 1544342
[patent_doc_number] => 06373128
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-16
[patent_title] => 'Semiconductor assemblies with reinforced peripheral regions'
[patent_app_type] => B1
[patent_app_number] => 09/722906
[patent_app_country] => US
[patent_app_date] => 2000-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 5650
[patent_no_of_claims] => 32
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/373/06373128.pdf
[firstpage_image] =>[orig_patent_app_number] => 09722906
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/722906 | Semiconductor assemblies with reinforced peripheral regions | Nov 26, 2000 | Issued |
Array
(
[id] => 1554694
[patent_doc_number] => 06348732
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-19
[patent_title] => 'Amorphized barrier layer for integrated circuit interconnects'
[patent_app_type] => B1
[patent_app_number] => 09/715702
[patent_app_country] => US
[patent_app_date] => 2000-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3036
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/348/06348732.pdf
[firstpage_image] =>[orig_patent_app_number] => 09715702
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/715702 | Amorphized barrier layer for integrated circuit interconnects | Nov 17, 2000 | Issued |
Array
(
[id] => 1476422
[patent_doc_number] => 06388329
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-14
[patent_title] => 'Semiconductor integrated circuit having three wiring layers'
[patent_app_type] => B1
[patent_app_number] => 09/705730
[patent_app_country] => US
[patent_app_date] => 2000-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 16
[patent_no_of_words] => 7606
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/388/06388329.pdf
[firstpage_image] =>[orig_patent_app_number] => 09705730
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/705730 | Semiconductor integrated circuit having three wiring layers | Nov 5, 2000 | Issued |
Array
(
[id] => 1522307
[patent_doc_number] => 06414382
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-02
[patent_title] => 'Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument'
[patent_app_type] => B1
[patent_app_number] => 09/696916
[patent_app_country] => US
[patent_app_date] => 2000-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 40
[patent_no_of_words] => 18111
[patent_no_of_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/414/06414382.pdf
[firstpage_image] =>[orig_patent_app_number] => 09696916
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/696916 | Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument | Oct 26, 2000 | Issued |
Array
(
[id] => 1583032
[patent_doc_number] => 06424029
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-23
[patent_title] => 'Chip card'
[patent_app_type] => B1
[patent_app_number] => 09/688642
[patent_app_country] => US
[patent_app_date] => 2000-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 3433
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/424/06424029.pdf
[firstpage_image] =>[orig_patent_app_number] => 09688642
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/688642 | Chip card | Oct 15, 2000 | Issued |
Array
(
[id] => 1300194
[patent_doc_number] => 06627976
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-30
[patent_title] => 'Leadframe for semiconductor package and mold for molding the same'
[patent_app_type] => B1
[patent_app_number] => 09/687331
[patent_app_country] => US
[patent_app_date] => 2000-10-13
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/627/06627976.pdf
[firstpage_image] =>[orig_patent_app_number] => 09687331
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/687331 | Leadframe for semiconductor package and mold for molding the same | Oct 12, 2000 | Issued |
Array
(
[id] => 1384886
[patent_doc_number] => 06559533
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-05-06
[patent_title] => 'High-frequency package and the method for manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/662702
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[pdf_file] => patents/06/559/06559533.pdf
[firstpage_image] =>[orig_patent_app_number] => 09662702
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/662702 | High-frequency package and the method for manufacturing the same | Sep 14, 2000 | Issued |
Array
(
[id] => 1422861
[patent_doc_number] => 06518677
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-11
[patent_title] => 'Semiconductor flip-chip package and method for the fabrication thereof'
[patent_app_type] => B1
[patent_app_number] => 09/662641
[patent_app_country] => US
[patent_app_date] => 2000-09-15
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[firstpage_image] =>[orig_patent_app_number] => 09662641
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/662641 | Semiconductor flip-chip package and method for the fabrication thereof | Sep 14, 2000 | Issued |
Array
(
[id] => 1497183
[patent_doc_number] => 06404057
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Tantalum - aluminum - nitrogen material for semiconductor devices'
[patent_app_type] => B1
[patent_app_number] => 09/645907
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/404/06404057.pdf
[firstpage_image] =>[orig_patent_app_number] => 09645907
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/645907 | Tantalum - aluminum - nitrogen material for semiconductor devices | Aug 24, 2000 | Issued |
Array
(
[id] => 1547535
[patent_doc_number] => 06445060
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Coated semiconductor die/leadframe assembly and method for coating the assembly'
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[pdf_file] => patents/06/445/06445060.pdf
[firstpage_image] =>[orig_patent_app_number] => 09644257
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/644257 | Coated semiconductor die/leadframe assembly and method for coating the assembly | Aug 21, 2000 | Issued |
Array
(
[id] => 1583112
[patent_doc_number] => 06424048
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-23
[patent_title] => 'Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them'
[patent_app_type] => B1
[patent_app_number] => 09/601411
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 09601411
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/601411 | Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them | Aug 13, 2000 | Issued |
Array
(
[id] => 7647011
[patent_doc_number] => 06476507
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-05
[patent_title] => 'Resin sealing method and resin sealing apparatus'
[patent_app_type] => B1
[patent_app_number] => 09/633071
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 09633071
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/633071 | Resin sealing method and resin sealing apparatus | Aug 3, 2000 | Issued |
Array
(
[id] => 1459983
[patent_doc_number] => 06426566
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[patent_issue_date] => 2002-07-30
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/601033 | Anisotropic conductor film, semiconductor chip, and method of packaging | Jul 25, 2000 | Issued |
Array
(
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[patent_title] => 'Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/601041 | Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device | Jul 25, 2000 | Issued |
Array
(
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/380/06380616.pdf
[firstpage_image] =>[orig_patent_app_number] => 09617652
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/617652 | Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component | Jul 16, 2000 | Issued |