Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7076945 [patent_doc_number] => 20010040286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-15 [patent_title] => 'Semiconductor device and method for the fabrication thereof' [patent_app_type] => new [patent_app_number] => 09/745412 [patent_app_country] => US [patent_app_date] => 2000-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 13958 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20010040286.pdf [firstpage_image] =>[orig_patent_app_number] => 09745412 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/745412
Semiconductor device and method for the fabrication thereof Dec 25, 2000 Issued
Array ( [id] => 6902020 [patent_doc_number] => 20010000929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-05-10 [patent_title] => 'Flip chip with integrated flux and underfill' [patent_app_type] => new-utility [patent_app_number] => 09/746786 [patent_app_country] => US [patent_app_date] => 2000-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5238 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20010000929.pdf [firstpage_image] =>[orig_patent_app_number] => 09746786 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/746786
Flip chip with integrated flux and underfill Dec 20, 2000 Abandoned
Array ( [id] => 7191547 [patent_doc_number] => 20050040517 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-24 [patent_title] => 'Encasing arrangement for a semicoductor component' [patent_app_type] => utility [patent_app_number] => 10/149892 [patent_app_country] => US [patent_app_date] => 2000-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2892 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20050040517.pdf [firstpage_image] =>[orig_patent_app_number] => 10149892 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/149892
Encasing arrangement for a semiconductor component Dec 12, 2000 Issued
Array ( [id] => 6875372 [patent_doc_number] => 20010000116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-04-05 [patent_title] => 'Semiconductor device' [patent_app_type] => new-utility [patent_app_number] => 09/731757 [patent_app_country] => US [patent_app_date] => 2000-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 9301 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20010000116.pdf [firstpage_image] =>[orig_patent_app_number] => 09731757 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/731757
Semiconductor device Dec 7, 2000 Issued
Array ( [id] => 1374950 [patent_doc_number] => 06566742 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-20 [patent_title] => 'Structure for mounting components' [patent_app_type] => B1 [patent_app_number] => 09/722530 [patent_app_country] => US [patent_app_date] => 2000-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 4914 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/566/06566742.pdf [firstpage_image] =>[orig_patent_app_number] => 09722530 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/722530
Structure for mounting components Nov 27, 2000 Issued
Array ( [id] => 1544342 [patent_doc_number] => 06373128 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-16 [patent_title] => 'Semiconductor assemblies with reinforced peripheral regions' [patent_app_type] => B1 [patent_app_number] => 09/722906 [patent_app_country] => US [patent_app_date] => 2000-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 5650 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/373/06373128.pdf [firstpage_image] =>[orig_patent_app_number] => 09722906 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/722906
Semiconductor assemblies with reinforced peripheral regions Nov 26, 2000 Issued
Array ( [id] => 1554694 [patent_doc_number] => 06348732 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-02-19 [patent_title] => 'Amorphized barrier layer for integrated circuit interconnects' [patent_app_type] => B1 [patent_app_number] => 09/715702 [patent_app_country] => US [patent_app_date] => 2000-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3036 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/348/06348732.pdf [firstpage_image] =>[orig_patent_app_number] => 09715702 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/715702
Amorphized barrier layer for integrated circuit interconnects Nov 17, 2000 Issued
Array ( [id] => 1476422 [patent_doc_number] => 06388329 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-14 [patent_title] => 'Semiconductor integrated circuit having three wiring layers' [patent_app_type] => B1 [patent_app_number] => 09/705730 [patent_app_country] => US [patent_app_date] => 2000-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 7606 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388329.pdf [firstpage_image] =>[orig_patent_app_number] => 09705730 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/705730
Semiconductor integrated circuit having three wiring layers Nov 5, 2000 Issued
Array ( [id] => 1522307 [patent_doc_number] => 06414382 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-02 [patent_title] => 'Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument' [patent_app_type] => B1 [patent_app_number] => 09/696916 [patent_app_country] => US [patent_app_date] => 2000-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 40 [patent_no_of_words] => 18111 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/414/06414382.pdf [firstpage_image] =>[orig_patent_app_number] => 09696916 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/696916
Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument Oct 26, 2000 Issued
Array ( [id] => 1583032 [patent_doc_number] => 06424029 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-23 [patent_title] => 'Chip card' [patent_app_type] => B1 [patent_app_number] => 09/688642 [patent_app_country] => US [patent_app_date] => 2000-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3433 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/424/06424029.pdf [firstpage_image] =>[orig_patent_app_number] => 09688642 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/688642
Chip card Oct 15, 2000 Issued
Array ( [id] => 1300194 [patent_doc_number] => 06627976 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'Leadframe for semiconductor package and mold for molding the same' [patent_app_type] => B1 [patent_app_number] => 09/687331 [patent_app_country] => US [patent_app_date] => 2000-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 28 [patent_no_of_words] => 5911 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627976.pdf [firstpage_image] =>[orig_patent_app_number] => 09687331 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/687331
Leadframe for semiconductor package and mold for molding the same Oct 12, 2000 Issued
Array ( [id] => 1384886 [patent_doc_number] => 06559533 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-06 [patent_title] => 'High-frequency package and the method for manufacturing the same' [patent_app_type] => B1 [patent_app_number] => 09/662702 [patent_app_country] => US [patent_app_date] => 2000-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3286 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/559/06559533.pdf [firstpage_image] =>[orig_patent_app_number] => 09662702 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/662702
High-frequency package and the method for manufacturing the same Sep 14, 2000 Issued
Array ( [id] => 1422861 [patent_doc_number] => 06518677 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-11 [patent_title] => 'Semiconductor flip-chip package and method for the fabrication thereof' [patent_app_type] => B1 [patent_app_number] => 09/662641 [patent_app_country] => US [patent_app_date] => 2000-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 11098 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518677.pdf [firstpage_image] =>[orig_patent_app_number] => 09662641 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/662641
Semiconductor flip-chip package and method for the fabrication thereof Sep 14, 2000 Issued
Array ( [id] => 1497183 [patent_doc_number] => 06404057 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Tantalum - aluminum - nitrogen material for semiconductor devices' [patent_app_type] => B1 [patent_app_number] => 09/645907 [patent_app_country] => US [patent_app_date] => 2000-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4310 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 14 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404057.pdf [firstpage_image] =>[orig_patent_app_number] => 09645907 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/645907
Tantalum - aluminum - nitrogen material for semiconductor devices Aug 24, 2000 Issued
Array ( [id] => 1547535 [patent_doc_number] => 06445060 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Coated semiconductor die/leadframe assembly and method for coating the assembly' [patent_app_type] => B1 [patent_app_number] => 09/644257 [patent_app_country] => US [patent_app_date] => 2000-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2029 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/445/06445060.pdf [firstpage_image] =>[orig_patent_app_number] => 09644257 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/644257
Coated semiconductor die/leadframe assembly and method for coating the assembly Aug 21, 2000 Issued
Array ( [id] => 1583112 [patent_doc_number] => 06424048 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-23 [patent_title] => 'Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them' [patent_app_type] => B1 [patent_app_number] => 09/601411 [patent_app_country] => US [patent_app_date] => 2000-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 67 [patent_no_of_words] => 7768 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/424/06424048.pdf [firstpage_image] =>[orig_patent_app_number] => 09601411 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/601411
Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them Aug 13, 2000 Issued
Array ( [id] => 7647011 [patent_doc_number] => 06476507 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-05 [patent_title] => 'Resin sealing method and resin sealing apparatus' [patent_app_type] => B1 [patent_app_number] => 09/633071 [patent_app_country] => US [patent_app_date] => 2000-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7889 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 14 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/476/06476507.pdf [firstpage_image] =>[orig_patent_app_number] => 09633071 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/633071
Resin sealing method and resin sealing apparatus Aug 3, 2000 Issued
Array ( [id] => 1459983 [patent_doc_number] => 06426566 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-30 [patent_title] => 'Anisotropic conductor film, semiconductor chip, and method of packaging' [patent_app_type] => B1 [patent_app_number] => 09/601033 [patent_app_country] => US [patent_app_date] => 2000-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 6522 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426566.pdf [firstpage_image] =>[orig_patent_app_number] => 09601033 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/601033
Anisotropic conductor film, semiconductor chip, and method of packaging Jul 25, 2000 Issued
Array ( [id] => 1522344 [patent_doc_number] => 06414397 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-02 [patent_title] => 'Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/601041 [patent_app_country] => US [patent_app_date] => 2000-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 7321 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/414/06414397.pdf [firstpage_image] =>[orig_patent_app_number] => 09601041 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/601041
Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device Jul 25, 2000 Issued
Array ( [id] => 7636044 [patent_doc_number] => 06380616 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component' [patent_app_type] => B1 [patent_app_number] => 09/617652 [patent_app_country] => US [patent_app_date] => 2000-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 9186 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 9 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380616.pdf [firstpage_image] =>[orig_patent_app_number] => 09617652 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/617652
Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component Jul 16, 2000 Issued
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