Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7645246 [patent_doc_number] => 06472726 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-29 [patent_title] => 'Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment' [patent_app_type] => B1 [patent_app_number] => 09/509403 [patent_app_country] => US [patent_app_date] => 2000-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 21 [patent_no_of_words] => 8543 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/472/06472726.pdf [firstpage_image] =>[orig_patent_app_number] => 09509403 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/509403
Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment Jul 6, 2000 Issued
Array ( [id] => 1550971 [patent_doc_number] => 06346743 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-02-12 [patent_title] => 'Embedded capacitor assembly in a package' [patent_app_type] => B1 [patent_app_number] => 09/606531 [patent_app_country] => US [patent_app_date] => 2000-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 6687 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/346/06346743.pdf [firstpage_image] =>[orig_patent_app_number] => 09606531 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/606531
Embedded capacitor assembly in a package Jun 29, 2000 Issued
Array ( [id] => 1433554 [patent_doc_number] => 06340844 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-22 [patent_title] => 'Semiconductor device having improved contact hole structure, and method of manufacturing the same' [patent_app_type] => B1 [patent_app_number] => 09/606153 [patent_app_country] => US [patent_app_date] => 2000-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 8390 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/340/06340844.pdf [firstpage_image] =>[orig_patent_app_number] => 09606153 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/606153
Semiconductor device having improved contact hole structure, and method of manufacturing the same Jun 28, 2000 Issued
Array ( [id] => 1459959 [patent_doc_number] => 06426559 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-30 [patent_title] => 'Miniature 3D multi-chip module' [patent_app_type] => B1 [patent_app_number] => 09/607862 [patent_app_country] => US [patent_app_date] => 2000-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2509 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426559.pdf [firstpage_image] =>[orig_patent_app_number] => 09607862 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/607862
Miniature 3D multi-chip module Jun 28, 2000 Issued
Array ( [id] => 1459976 [patent_doc_number] => 06426563 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-30 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => B1 [patent_app_number] => 09/604802 [patent_app_country] => US [patent_app_date] => 2000-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 24 [patent_no_of_words] => 6227 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426563.pdf [firstpage_image] =>[orig_patent_app_number] => 09604802 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/604802
Semiconductor device and method for manufacturing the same Jun 27, 2000 Issued
Array ( [id] => 7636045 [patent_doc_number] => 06380615 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'Chip size stack package, memory module having the same, and method of fabricating the module' [patent_app_type] => B1 [patent_app_number] => 09/604091 [patent_app_country] => US [patent_app_date] => 2000-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 3450 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380615.pdf [firstpage_image] =>[orig_patent_app_number] => 09604091 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/604091
Chip size stack package, memory module having the same, and method of fabricating the module Jun 26, 2000 Issued
Array ( [id] => 7636046 [patent_doc_number] => 06380614 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'Non-contact type IC card and process for manufacturing same' [patent_app_type] => B1 [patent_app_number] => 09/602073 [patent_app_country] => US [patent_app_date] => 2000-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 7127 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 8 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380614.pdf [firstpage_image] =>[orig_patent_app_number] => 09602073 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/602073
Non-contact type IC card and process for manufacturing same Jun 22, 2000 Issued
Array ( [id] => 4326265 [patent_doc_number] => 06331736 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-18 [patent_title] => 'Utilization of die repattern layers for die internal connections' [patent_app_type] => 1 [patent_app_number] => 9/599752 [patent_app_country] => US [patent_app_date] => 2000-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3804 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/331/06331736.pdf [firstpage_image] =>[orig_patent_app_number] => 599752 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/599752
Utilization of die repattern layers for die internal connections Jun 21, 2000 Issued
Array ( [id] => 1519005 [patent_doc_number] => 06501158 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-31 [patent_title] => 'Structure and method for securing a molding compound to a leadframe paddle' [patent_app_type] => B1 [patent_app_number] => 09/599210 [patent_app_country] => US [patent_app_date] => 2000-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3109 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/501/06501158.pdf [firstpage_image] =>[orig_patent_app_number] => 09599210 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/599210
Structure and method for securing a molding compound to a leadframe paddle Jun 21, 2000 Issued
Array ( [id] => 1497124 [patent_doc_number] => 06404043 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Panel stacking of BGA devices to form three-dimensional modules' [patent_app_type] => B1 [patent_app_number] => 09/598343 [patent_app_country] => US [patent_app_date] => 2000-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 7679 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404043.pdf [firstpage_image] =>[orig_patent_app_number] => 09598343 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/598343
Panel stacking of BGA devices to form three-dimensional modules Jun 20, 2000 Issued
Array ( [id] => 1568440 [patent_doc_number] => 06376901 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-23 [patent_title] => 'Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication' [patent_app_type] => B1 [patent_app_number] => 09/589051 [patent_app_country] => US [patent_app_date] => 2000-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4109 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/376/06376901.pdf [firstpage_image] =>[orig_patent_app_number] => 09589051 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/589051
Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication Jun 5, 2000 Issued
Array ( [id] => 1563120 [patent_doc_number] => 06362518 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-26 [patent_title] => 'Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same' [patent_app_type] => B1 [patent_app_number] => 09/583382 [patent_app_country] => US [patent_app_date] => 2000-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 35 [patent_no_of_words] => 6752 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/362/06362518.pdf [firstpage_image] =>[orig_patent_app_number] => 09583382 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/583382
Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same May 29, 2000 Issued
Array ( [id] => 1505505 [patent_doc_number] => 06465884 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-15 [patent_title] => 'Semiconductor device with variable pin locations' [patent_app_type] => B1 [patent_app_number] => 09/578082 [patent_app_country] => US [patent_app_date] => 2000-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3228 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/465/06465884.pdf [firstpage_image] =>[orig_patent_app_number] => 09578082 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/578082
Semiconductor device with variable pin locations May 23, 2000 Issued
Array ( [id] => 7643509 [patent_doc_number] => 06429532 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-06 [patent_title] => 'Pad design' [patent_app_type] => B1 [patent_app_number] => 09/567843 [patent_app_country] => US [patent_app_date] => 2000-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1429 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429532.pdf [firstpage_image] =>[orig_patent_app_number] => 09567843 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/567843
Pad design May 8, 2000 Issued
Array ( [id] => 7643526 [patent_doc_number] => 06429515 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-06 [patent_title] => 'Long wire IC package' [patent_app_type] => B1 [patent_app_number] => 09/565881 [patent_app_country] => US [patent_app_date] => 2000-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 9000 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 4 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429515.pdf [firstpage_image] =>[orig_patent_app_number] => 09565881 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/565881
Long wire IC package May 4, 2000 Issued
Array ( [id] => 5798618 [patent_doc_number] => 20020008314 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-24 [patent_title] => 'Semiconductor integrated circuit and printed wiring substrate provided with the same' [patent_app_type] => new [patent_app_number] => 09/549192 [patent_app_country] => US [patent_app_date] => 2000-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2503 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20020008314.pdf [firstpage_image] =>[orig_patent_app_number] => 09549192 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/549192
Semiconductor integrated circuit and printed wiring substrate provided with the same Apr 12, 2000 Issued
Array ( [id] => 1300289 [patent_doc_number] => 06627991 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'High performance multi-chip flip package' [patent_app_type] => B1 [patent_app_number] => 09/546053 [patent_app_country] => US [patent_app_date] => 2000-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3705 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627991.pdf [firstpage_image] =>[orig_patent_app_number] => 09546053 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/546053
High performance multi-chip flip package Apr 9, 2000 Issued
Array ( [id] => 1347549 [patent_doc_number] => 06586841 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-01 [patent_title] => 'Mechanical landing pad formed on the underside of a MEMS device' [patent_app_type] => B1 [patent_app_number] => 09/546432 [patent_app_country] => US [patent_app_date] => 2000-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 26 [patent_no_of_words] => 4234 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/586/06586841.pdf [firstpage_image] =>[orig_patent_app_number] => 09546432 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/546432
Mechanical landing pad formed on the underside of a MEMS device Apr 9, 2000 Issued
Array ( [id] => 7643534 [patent_doc_number] => 06429507 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-06 [patent_title] => 'Electrical device including a leaded cell assembly' [patent_app_type] => B1 [patent_app_number] => 09/541843 [patent_app_country] => US [patent_app_date] => 2000-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4130 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 4 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429507.pdf [firstpage_image] =>[orig_patent_app_number] => 09541843 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/541843
Electrical device including a leaded cell assembly Apr 2, 2000 Issued
Array ( [id] => 4331887 [patent_doc_number] => 06329708 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-11 [patent_title] => 'Micro ball grid array semiconductor device and semiconductor module' [patent_app_type] => 1 [patent_app_number] => 9/536763 [patent_app_country] => US [patent_app_date] => 2000-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 4052 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/329/06329708.pdf [firstpage_image] =>[orig_patent_app_number] => 536763 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/536763
Micro ball grid array semiconductor device and semiconductor module Mar 27, 2000 Issued
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