
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7645246
[patent_doc_number] => 06472726
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-29
[patent_title] => 'Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment'
[patent_app_type] => B1
[patent_app_number] => 09/509403
[patent_app_country] => US
[patent_app_date] => 2000-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 21
[patent_no_of_words] => 8543
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 5
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/472/06472726.pdf
[firstpage_image] =>[orig_patent_app_number] => 09509403
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/509403 | Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment | Jul 6, 2000 | Issued |
Array
(
[id] => 1550971
[patent_doc_number] => 06346743
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-12
[patent_title] => 'Embedded capacitor assembly in a package'
[patent_app_type] => B1
[patent_app_number] => 09/606531
[patent_app_country] => US
[patent_app_date] => 2000-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 6687
[patent_no_of_claims] => 43
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/346/06346743.pdf
[firstpage_image] =>[orig_patent_app_number] => 09606531
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/606531 | Embedded capacitor assembly in a package | Jun 29, 2000 | Issued |
Array
(
[id] => 1433554
[patent_doc_number] => 06340844
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-22
[patent_title] => 'Semiconductor device having improved contact hole structure, and method of manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/606153
[patent_app_country] => US
[patent_app_date] => 2000-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 8390
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/340/06340844.pdf
[firstpage_image] =>[orig_patent_app_number] => 09606153
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/606153 | Semiconductor device having improved contact hole structure, and method of manufacturing the same | Jun 28, 2000 | Issued |
Array
(
[id] => 1459959
[patent_doc_number] => 06426559
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Miniature 3D multi-chip module'
[patent_app_type] => B1
[patent_app_number] => 09/607862
[patent_app_country] => US
[patent_app_date] => 2000-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2509
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/426/06426559.pdf
[firstpage_image] =>[orig_patent_app_number] => 09607862
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/607862 | Miniature 3D multi-chip module | Jun 28, 2000 | Issued |
Array
(
[id] => 1459976
[patent_doc_number] => 06426563
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/604802
[patent_app_country] => US
[patent_app_date] => 2000-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 24
[patent_no_of_words] => 6227
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/426/06426563.pdf
[firstpage_image] =>[orig_patent_app_number] => 09604802
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/604802 | Semiconductor device and method for manufacturing the same | Jun 27, 2000 | Issued |
Array
(
[id] => 7636045
[patent_doc_number] => 06380615
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-30
[patent_title] => 'Chip size stack package, memory module having the same, and method of fabricating the module'
[patent_app_type] => B1
[patent_app_number] => 09/604091
[patent_app_country] => US
[patent_app_date] => 2000-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 20
[patent_no_of_words] => 3450
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 5
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/380/06380615.pdf
[firstpage_image] =>[orig_patent_app_number] => 09604091
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/604091 | Chip size stack package, memory module having the same, and method of fabricating the module | Jun 26, 2000 | Issued |
Array
(
[id] => 7636046
[patent_doc_number] => 06380614
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-30
[patent_title] => 'Non-contact type IC card and process for manufacturing same'
[patent_app_type] => B1
[patent_app_number] => 09/602073
[patent_app_country] => US
[patent_app_date] => 2000-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 18
[patent_no_of_words] => 7127
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 8
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/380/06380614.pdf
[firstpage_image] =>[orig_patent_app_number] => 09602073
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/602073 | Non-contact type IC card and process for manufacturing same | Jun 22, 2000 | Issued |
Array
(
[id] => 4326265
[patent_doc_number] => 06331736
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-18
[patent_title] => 'Utilization of die repattern layers for die internal connections'
[patent_app_type] => 1
[patent_app_number] => 9/599752
[patent_app_country] => US
[patent_app_date] => 2000-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 3804
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 160
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/331/06331736.pdf
[firstpage_image] =>[orig_patent_app_number] => 599752
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/599752 | Utilization of die repattern layers for die internal connections | Jun 21, 2000 | Issued |
Array
(
[id] => 1519005
[patent_doc_number] => 06501158
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-31
[patent_title] => 'Structure and method for securing a molding compound to a leadframe paddle'
[patent_app_type] => B1
[patent_app_number] => 09/599210
[patent_app_country] => US
[patent_app_date] => 2000-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 3109
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/501/06501158.pdf
[firstpage_image] =>[orig_patent_app_number] => 09599210
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/599210 | Structure and method for securing a molding compound to a leadframe paddle | Jun 21, 2000 | Issued |
Array
(
[id] => 1497124
[patent_doc_number] => 06404043
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Panel stacking of BGA devices to form three-dimensional modules'
[patent_app_type] => B1
[patent_app_number] => 09/598343
[patent_app_country] => US
[patent_app_date] => 2000-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 7679
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/404/06404043.pdf
[firstpage_image] =>[orig_patent_app_number] => 09598343
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/598343 | Panel stacking of BGA devices to form three-dimensional modules | Jun 20, 2000 | Issued |
Array
(
[id] => 1568440
[patent_doc_number] => 06376901
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication'
[patent_app_type] => B1
[patent_app_number] => 09/589051
[patent_app_country] => US
[patent_app_date] => 2000-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 4109
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 45
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/376/06376901.pdf
[firstpage_image] =>[orig_patent_app_number] => 09589051
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/589051 | Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication | Jun 5, 2000 | Issued |
Array
(
[id] => 1563120
[patent_doc_number] => 06362518
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-26
[patent_title] => 'Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/583382
[patent_app_country] => US
[patent_app_date] => 2000-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 35
[patent_no_of_words] => 6752
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/362/06362518.pdf
[firstpage_image] =>[orig_patent_app_number] => 09583382
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/583382 | Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same | May 29, 2000 | Issued |
Array
(
[id] => 1505505
[patent_doc_number] => 06465884
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'Semiconductor device with variable pin locations'
[patent_app_type] => B1
[patent_app_number] => 09/578082
[patent_app_country] => US
[patent_app_date] => 2000-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3228
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/465/06465884.pdf
[firstpage_image] =>[orig_patent_app_number] => 09578082
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/578082 | Semiconductor device with variable pin locations | May 23, 2000 | Issued |
Array
(
[id] => 7643509
[patent_doc_number] => 06429532
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Pad design'
[patent_app_type] => B1
[patent_app_number] => 09/567843
[patent_app_country] => US
[patent_app_date] => 2000-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1429
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 5
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/429/06429532.pdf
[firstpage_image] =>[orig_patent_app_number] => 09567843
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/567843 | Pad design | May 8, 2000 | Issued |
Array
(
[id] => 7643526
[patent_doc_number] => 06429515
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Long wire IC package'
[patent_app_type] => B1
[patent_app_number] => 09/565881
[patent_app_country] => US
[patent_app_date] => 2000-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 9000
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 4
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/429/06429515.pdf
[firstpage_image] =>[orig_patent_app_number] => 09565881
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/565881 | Long wire IC package | May 4, 2000 | Issued |
Array
(
[id] => 5798618
[patent_doc_number] => 20020008314
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-24
[patent_title] => 'Semiconductor integrated circuit and printed wiring substrate provided with the same'
[patent_app_type] => new
[patent_app_number] => 09/549192
[patent_app_country] => US
[patent_app_date] => 2000-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2503
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0008/20020008314.pdf
[firstpage_image] =>[orig_patent_app_number] => 09549192
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/549192 | Semiconductor integrated circuit and printed wiring substrate provided with the same | Apr 12, 2000 | Issued |
Array
(
[id] => 1300289
[patent_doc_number] => 06627991
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-30
[patent_title] => 'High performance multi-chip flip package'
[patent_app_type] => B1
[patent_app_number] => 09/546053
[patent_app_country] => US
[patent_app_date] => 2000-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 3705
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/627/06627991.pdf
[firstpage_image] =>[orig_patent_app_number] => 09546053
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/546053 | High performance multi-chip flip package | Apr 9, 2000 | Issued |
Array
(
[id] => 1347549
[patent_doc_number] => 06586841
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-01
[patent_title] => 'Mechanical landing pad formed on the underside of a MEMS device'
[patent_app_type] => B1
[patent_app_number] => 09/546432
[patent_app_country] => US
[patent_app_date] => 2000-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 26
[patent_no_of_words] => 4234
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 53
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/586/06586841.pdf
[firstpage_image] =>[orig_patent_app_number] => 09546432
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/546432 | Mechanical landing pad formed on the underside of a MEMS device | Apr 9, 2000 | Issued |
Array
(
[id] => 7643534
[patent_doc_number] => 06429507
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Electrical device including a leaded cell assembly'
[patent_app_type] => B1
[patent_app_number] => 09/541843
[patent_app_country] => US
[patent_app_date] => 2000-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4130
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 4
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/429/06429507.pdf
[firstpage_image] =>[orig_patent_app_number] => 09541843
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/541843 | Electrical device including a leaded cell assembly | Apr 2, 2000 | Issued |
Array
(
[id] => 4331887
[patent_doc_number] => 06329708
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-11
[patent_title] => 'Micro ball grid array semiconductor device and semiconductor module'
[patent_app_type] => 1
[patent_app_number] => 9/536763
[patent_app_country] => US
[patent_app_date] => 2000-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 13
[patent_no_of_words] => 4052
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/329/06329708.pdf
[firstpage_image] =>[orig_patent_app_number] => 536763
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/536763 | Micro ball grid array semiconductor device and semiconductor module | Mar 27, 2000 | Issued |