| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3546099
[patent_doc_number] => 05495394
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-02-27
[patent_title] => 'Three dimensional die packaging in multi-chip modules'
[patent_app_type] => 1
[patent_app_number] => 8/361062
[patent_app_country] => US
[patent_app_date] => 1994-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 2053
[patent_no_of_claims] => 5
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[patent_words_short_claim] => 390
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/495/05495394.pdf
[firstpage_image] =>[orig_patent_app_number] => 361062
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/361062 | Three dimensional die packaging in multi-chip modules | Dec 18, 1994 | Issued |
Array
(
[id] => 3552849
[patent_doc_number] => 05555159
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-10
[patent_title] => 'Add-on module for variable speed drives'
[patent_app_type] => 1
[patent_app_number] => 8/357382
[patent_app_country] => US
[patent_app_date] => 1994-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1385
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/555/05555159.pdf
[firstpage_image] =>[orig_patent_app_number] => 357382
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357382 | Add-on module for variable speed drives | Dec 15, 1994 | Issued |
| 08/355946 | ENGINEERING CHANGE ANTICIPATION METHOD AND APPARATUS | Dec 13, 1994 | Abandoned |
| 08/352144 | CAP PROVIDING FLAT SURFACE FOR DCA AND SOLDER BALL ATTACH AND FOR SEALING PLATED THROUGH HOLES, MULTI-LAYER ELECTRONIC STRUCTURES INCLUDING THE CAP, AND A PROCESS OF FORMING THE CAP AND FOR FORMING MULTI-LAYER ELECTRONIC STRUCTURES INCLUDING THE CAP | Nov 30, 1994 | Abandoned |
| 08/347739 | METHOD, FLIP-CHIP MODULE, AND COMMUNICATOR FOR PROVIDING THREE-DIMENSIONAL PACKAGING OF INTEGRATED CIRCUITS | Nov 30, 1994 | Abandoned |
Array
(
[id] => 3540195
[patent_doc_number] => 05583749
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-10
[patent_title] => 'Baseboard and daughtercard apparatus for reconfigurable computing systems'
[patent_app_type] => 1
[patent_app_number] => 8/348280
[patent_app_country] => US
[patent_app_date] => 1994-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 8
[patent_no_of_words] => 3008
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/583/05583749.pdf
[firstpage_image] =>[orig_patent_app_number] => 348280
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/348280 | Baseboard and daughtercard apparatus for reconfigurable computing systems | Nov 29, 1994 | Issued |
| 08/346411 | DETACHABLE MODULE/BALL GRID ARRAY PACKAGE | Nov 28, 1994 | Abandoned |
Array
(
[id] => 3628818
[patent_doc_number] => 05642265
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-24
[patent_title] => 'Ball grid array package with detachable module'
[patent_app_type] => 1
[patent_app_number] => 8/346499
[patent_app_country] => US
[patent_app_date] => 1994-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 3251
[patent_no_of_claims] => 14
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/642/05642265.pdf
[firstpage_image] =>[orig_patent_app_number] => 346499
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/346499 | Ball grid array package with detachable module | Nov 28, 1994 | Issued |
Array
(
[id] => 3987863
[patent_doc_number] => 05917707
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-29
[patent_title] => 'Flexible contact structure with an electrically conductive shell'
[patent_app_type] => 1
[patent_app_number] => 8/340144
[patent_app_country] => US
[patent_app_date] => 1994-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 38
[patent_no_of_words] => 15707
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/917/05917707.pdf
[firstpage_image] =>[orig_patent_app_number] => 340144
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/340144 | Flexible contact structure with an electrically conductive shell | Nov 14, 1994 | Issued |
Array
(
[id] => 3520071
[patent_doc_number] => 05563773
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Semiconductor module having multiple insulation and wiring layers'
[patent_app_type] => 1
[patent_app_number] => 8/334104
[patent_app_country] => US
[patent_app_date] => 1994-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 4321
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 160
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563773.pdf
[firstpage_image] =>[orig_patent_app_number] => 334104
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/334104 | Semiconductor module having multiple insulation and wiring layers | Nov 3, 1994 | Issued |
| 08/330764 | MODULE SYSTEMS AND MODULE MANUFACTURING PROCESSES | Oct 27, 1994 | Abandoned |
Array
(
[id] => 3562395
[patent_doc_number] => 05519581
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Mounting of toroidal inductors'
[patent_app_type] => 1
[patent_app_number] => 8/327072
[patent_app_country] => US
[patent_app_date] => 1994-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 874
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/519/05519581.pdf
[firstpage_image] =>[orig_patent_app_number] => 327072
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/327072 | Mounting of toroidal inductors | Oct 20, 1994 | Issued |
| 08/326534 | SEMICONDUCTOR UNIT HAVING SEMICONDUCTOR DEVICE AND MULTILAYER SUBSTRATE | Oct 19, 1994 | Abandoned |
Array
(
[id] => 3697110
[patent_doc_number] => 05691885
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-25
[patent_title] => 'Three-dimensional interconnect having modules with vertical top and bottom connectors'
[patent_app_type] => 1
[patent_app_number] => 8/323382
[patent_app_country] => US
[patent_app_date] => 1994-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 7422
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/691/05691885.pdf
[firstpage_image] =>[orig_patent_app_number] => 323382
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/323382 | Three-dimensional interconnect having modules with vertical top and bottom connectors | Oct 13, 1994 | Issued |
| 08/321869 | APPARATUS INCLUDING A PEAK-SHAPED DIELECTRIC DAM AND A METHOD OF MANUFACTURING THE PEAK-SHAPED DIELECTRIC DAM | Oct 13, 1994 | Abandoned |
| 08/322769 | PLASTIC ENCAPSULATION OF IC DEVICE BY TWO LEVEL EPOXY ENCAPSULATION | Oct 12, 1994 | Abandoned |
Array
(
[id] => 3559806
[patent_doc_number] => 05572409
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-05
[patent_title] => 'Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/319860
[patent_app_country] => US
[patent_app_date] => 1994-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 64
[patent_figures_cnt] => 93
[patent_no_of_words] => 27926
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 246
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/572/05572409.pdf
[firstpage_image] =>[orig_patent_app_number] => 319860
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/319860 | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board | Oct 6, 1994 | Issued |
Array
(
[id] => 3566221
[patent_doc_number] => 05502631
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-26
[patent_title] => 'Circuit elements that are ultrasonically welded together'
[patent_app_type] => 1
[patent_app_number] => 8/320110
[patent_app_country] => US
[patent_app_date] => 1994-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 2984
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/502/05502631.pdf
[firstpage_image] =>[orig_patent_app_number] => 320110
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/320110 | Circuit elements that are ultrasonically welded together | Oct 6, 1994 | Issued |
Array
(
[id] => 3703877
[patent_doc_number] => 05596486
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-21
[patent_title] => 'Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement'
[patent_app_type] => 1
[patent_app_number] => 8/318507
[patent_app_country] => US
[patent_app_date] => 1994-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 28
[patent_no_of_words] => 6988
[patent_no_of_claims] => 84
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/596/05596486.pdf
[firstpage_image] =>[orig_patent_app_number] => 318507
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/318507 | Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement | Oct 4, 1994 | Issued |
Array
(
[id] => 3857430
[patent_doc_number] => 05719749
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-17
[patent_title] => 'Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/685425
[patent_app_country] => US
[patent_app_date] => 1994-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 5798
[patent_no_of_claims] => 31
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/719/05719749.pdf
[firstpage_image] =>[orig_patent_app_number] => 685425
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/685425 | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board | Sep 25, 1994 | Issued |
