Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4161823 [patent_doc_number] => 06104087 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Microelectronic assemblies with multiple leads' [patent_app_type] => 1 [patent_app_number] => 9/138858 [patent_app_country] => US [patent_app_date] => 1998-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 30 [patent_no_of_words] => 13075 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/104/06104087.pdf [firstpage_image] =>[orig_patent_app_number] => 138858 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/138858
Microelectronic assemblies with multiple leads Aug 23, 1998 Issued
Array ( [id] => 4009760 [patent_doc_number] => 06005291 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-21 [patent_title] => 'Semiconductor device and process for production thereof' [patent_app_type] => 1 [patent_app_number] => 9/138011 [patent_app_country] => US [patent_app_date] => 1998-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 32 [patent_no_of_words] => 6129 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/005/06005291.pdf [firstpage_image] =>[orig_patent_app_number] => 138011 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/138011
Semiconductor device and process for production thereof Aug 20, 1998 Issued
Array ( [id] => 4243149 [patent_doc_number] => 06144108 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-07 [patent_title] => 'Semiconductor device and method of fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/125523 [patent_app_country] => US [patent_app_date] => 1998-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 5045 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/144/06144108.pdf [firstpage_image] =>[orig_patent_app_number] => 125523 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/125523
Semiconductor device and method of fabricating the same Aug 19, 1998 Issued
Array ( [id] => 4212549 [patent_doc_number] => 06028353 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-22 [patent_title] => 'Chip bead element and manufacturing method thereof' [patent_app_type] => 1 [patent_app_number] => 9/132512 [patent_app_country] => US [patent_app_date] => 1998-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 40 [patent_no_of_words] => 8599 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/028/06028353.pdf [firstpage_image] =>[orig_patent_app_number] => 132512 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/132512
Chip bead element and manufacturing method thereof Aug 10, 1998 Issued
Array ( [id] => 3953224 [patent_doc_number] => 05998857 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-07 [patent_title] => 'Semiconductor packaging structure with the bar on chip' [patent_app_type] => 1 [patent_app_number] => 9/132241 [patent_app_country] => US [patent_app_date] => 1998-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 1203 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/998/05998857.pdf [firstpage_image] =>[orig_patent_app_number] => 132241 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/132241
Semiconductor packaging structure with the bar on chip Aug 10, 1998 Issued
Array ( [id] => 4095114 [patent_doc_number] => 06133634 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-17 [patent_title] => 'High performance flip chip package' [patent_app_type] => 1 [patent_app_number] => 9/129663 [patent_app_country] => US [patent_app_date] => 1998-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2261 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/133/06133634.pdf [firstpage_image] =>[orig_patent_app_number] => 129663 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/129663
High performance flip chip package Aug 4, 1998 Issued
Array ( [id] => 4195327 [patent_doc_number] => 06153936 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Method for forming via hole and semiconductor structure formed thereby' [patent_app_type] => 1 [patent_app_number] => 9/127882 [patent_app_country] => US [patent_app_date] => 1998-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 3324 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/153/06153936.pdf [firstpage_image] =>[orig_patent_app_number] => 127882 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/127882
Method for forming via hole and semiconductor structure formed thereby Jul 30, 1998 Issued
Array ( [id] => 4148172 [patent_doc_number] => 06031285 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-29 [patent_title] => 'Heat sink for semiconductors and manufacturing process thereof' [patent_app_type] => 1 [patent_app_number] => 9/120453 [patent_app_country] => US [patent_app_date] => 1998-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 23 [patent_no_of_words] => 12574 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/031/06031285.pdf [firstpage_image] =>[orig_patent_app_number] => 120453 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/120453
Heat sink for semiconductors and manufacturing process thereof Jul 22, 1998 Issued
Array ( [id] => 4163657 [patent_doc_number] => 06114770 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-05 [patent_title] => 'Low profile semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/121272 [patent_app_country] => US [patent_app_date] => 1998-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2848 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/114/06114770.pdf [firstpage_image] =>[orig_patent_app_number] => 121272 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/121272
Low profile semiconductor package Jul 21, 1998 Issued
Array ( [id] => 4140171 [patent_doc_number] => 06121689 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-19 [patent_title] => 'Semiconductor flip-chip package and method for the fabrication thereof' [patent_app_type] => 1 [patent_app_number] => 9/120172 [patent_app_country] => US [patent_app_date] => 1998-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 11082 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/121/06121689.pdf [firstpage_image] =>[orig_patent_app_number] => 120172 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/120172
Semiconductor flip-chip package and method for the fabrication thereof Jul 20, 1998 Issued
Array ( [id] => 4414228 [patent_doc_number] => 06265759 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Laterally situated stress/strain relieving lead for a semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 9/120006 [patent_app_country] => US [patent_app_date] => 1998-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 4934 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 22 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/265/06265759.pdf [firstpage_image] =>[orig_patent_app_number] => 120006 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/120006
Laterally situated stress/strain relieving lead for a semiconductor chip package Jul 20, 1998 Issued
Array ( [id] => 4203717 [patent_doc_number] => 06013951 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-11 [patent_title] => 'Semiconductor device having an improved lead connection structure and manufacturing method thereof' [patent_app_type] => 1 [patent_app_number] => 9/116242 [patent_app_country] => US [patent_app_date] => 1998-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 5111 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/013/06013951.pdf [firstpage_image] =>[orig_patent_app_number] => 116242 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/116242
Semiconductor device having an improved lead connection structure and manufacturing method thereof Jul 15, 1998 Issued
Array ( [id] => 4087138 [patent_doc_number] => 06054763 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-25 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/115261 [patent_app_country] => US [patent_app_date] => 1998-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4180 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/054/06054763.pdf [firstpage_image] =>[orig_patent_app_number] => 115261 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/115261
Semiconductor device Jul 13, 1998 Issued
Array ( [id] => 4239461 [patent_doc_number] => 06075292 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented' [patent_app_type] => 1 [patent_app_number] => 9/114171 [patent_app_country] => US [patent_app_date] => 1998-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 31 [patent_no_of_words] => 9580 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/075/06075292.pdf [firstpage_image] =>[orig_patent_app_number] => 114171 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/114171
Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented Jul 12, 1998 Issued
Array ( [id] => 4355575 [patent_doc_number] => 06215175 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-10 [patent_title] => 'Semiconductor package having metal foil die mounting plate' [patent_app_type] => 1 [patent_app_number] => 9/111100 [patent_app_country] => US [patent_app_date] => 1998-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3276 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/215/06215175.pdf [firstpage_image] =>[orig_patent_app_number] => 111100 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/111100
Semiconductor package having metal foil die mounting plate Jul 5, 1998 Issued
Array ( [id] => 4180295 [patent_doc_number] => 06084308 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-04 [patent_title] => 'Chip-on-chip integrated circuit package and method for making the same' [patent_app_type] => 1 [patent_app_number] => 9/107801 [patent_app_country] => US [patent_app_date] => 1998-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 4 [patent_no_of_words] => 4866 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/084/06084308.pdf [firstpage_image] =>[orig_patent_app_number] => 107801 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/107801
Chip-on-chip integrated circuit package and method for making the same Jun 29, 1998 Issued
Array ( [id] => 4145544 [patent_doc_number] => 06060772 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-09 [patent_title] => 'Power semiconductor module with a plurality of semiconductor chips' [patent_app_type] => 1 [patent_app_number] => 9/106351 [patent_app_country] => US [patent_app_date] => 1998-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3916 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/060/06060772.pdf [firstpage_image] =>[orig_patent_app_number] => 106351 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/106351
Power semiconductor module with a plurality of semiconductor chips Jun 28, 1998 Issued
Array ( [id] => 4145600 [patent_doc_number] => 06060776 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-09 [patent_title] => 'Rectifier diode' [patent_app_type] => 1 [patent_app_number] => 9/091973 [patent_app_country] => US [patent_app_date] => 1998-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3229 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/060/06060776.pdf [firstpage_image] =>[orig_patent_app_number] => 091973 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/091973
Rectifier diode Jun 25, 1998 Issued
Array ( [id] => 4070637 [patent_doc_number] => 06008529 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-28 [patent_title] => 'Laser diode package' [patent_app_type] => 1 [patent_app_number] => 9/104762 [patent_app_country] => US [patent_app_date] => 1998-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 1695 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/008/06008529.pdf [firstpage_image] =>[orig_patent_app_number] => 104762 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/104762
Laser diode package Jun 24, 1998 Issued
Array ( [id] => 4253644 [patent_doc_number] => 06137176 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-24 [patent_title] => 'Semiconductor device and method of fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/104403 [patent_app_country] => US [patent_app_date] => 1998-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 11592 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/137/06137176.pdf [firstpage_image] =>[orig_patent_app_number] => 104403 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/104403
Semiconductor device and method of fabricating the same Jun 24, 1998 Issued
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