
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4161823
[patent_doc_number] => 06104087
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-15
[patent_title] => 'Microelectronic assemblies with multiple leads'
[patent_app_type] => 1
[patent_app_number] => 9/138858
[patent_app_country] => US
[patent_app_date] => 1998-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 30
[patent_no_of_words] => 13075
[patent_no_of_claims] => 29
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[patent_words_short_claim] => 21
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/104/06104087.pdf
[firstpage_image] =>[orig_patent_app_number] => 138858
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/138858 | Microelectronic assemblies with multiple leads | Aug 23, 1998 | Issued |
Array
(
[id] => 4009760
[patent_doc_number] => 06005291
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-21
[patent_title] => 'Semiconductor device and process for production thereof'
[patent_app_type] => 1
[patent_app_number] => 9/138011
[patent_app_country] => US
[patent_app_date] => 1998-08-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 6129
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[pdf_file] => patents/06/005/06005291.pdf
[firstpage_image] =>[orig_patent_app_number] => 138011
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/138011 | Semiconductor device and process for production thereof | Aug 20, 1998 | Issued |
Array
(
[id] => 4243149
[patent_doc_number] => 06144108
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-07
[patent_title] => 'Semiconductor device and method of fabricating the same'
[patent_app_type] => 1
[patent_app_number] => 9/125523
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[patent_app_date] => 1998-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/06/144/06144108.pdf
[firstpage_image] =>[orig_patent_app_number] => 125523
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/125523 | Semiconductor device and method of fabricating the same | Aug 19, 1998 | Issued |
Array
(
[id] => 4212549
[patent_doc_number] => 06028353
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-22
[patent_title] => 'Chip bead element and manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 9/132512
[patent_app_country] => US
[patent_app_date] => 1998-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 40
[patent_no_of_words] => 8599
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[pdf_file] => patents/06/028/06028353.pdf
[firstpage_image] =>[orig_patent_app_number] => 132512
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/132512 | Chip bead element and manufacturing method thereof | Aug 10, 1998 | Issued |
Array
(
[id] => 3953224
[patent_doc_number] => 05998857
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-07
[patent_title] => 'Semiconductor packaging structure with the bar on chip'
[patent_app_type] => 1
[patent_app_number] => 9/132241
[patent_app_country] => US
[patent_app_date] => 1998-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/998/05998857.pdf
[firstpage_image] =>[orig_patent_app_number] => 132241
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/132241 | Semiconductor packaging structure with the bar on chip | Aug 10, 1998 | Issued |
Array
(
[id] => 4095114
[patent_doc_number] => 06133634
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-17
[patent_title] => 'High performance flip chip package'
[patent_app_type] => 1
[patent_app_number] => 9/129663
[patent_app_country] => US
[patent_app_date] => 1998-08-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/133/06133634.pdf
[firstpage_image] =>[orig_patent_app_number] => 129663
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/129663 | High performance flip chip package | Aug 4, 1998 | Issued |
Array
(
[id] => 4195327
[patent_doc_number] => 06153936
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Method for forming via hole and semiconductor structure formed thereby'
[patent_app_type] => 1
[patent_app_number] => 9/127882
[patent_app_country] => US
[patent_app_date] => 1998-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 3324
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[pdf_file] => patents/06/153/06153936.pdf
[firstpage_image] =>[orig_patent_app_number] => 127882
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/127882 | Method for forming via hole and semiconductor structure formed thereby | Jul 30, 1998 | Issued |
Array
(
[id] => 4148172
[patent_doc_number] => 06031285
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Heat sink for semiconductors and manufacturing process thereof'
[patent_app_type] => 1
[patent_app_number] => 9/120453
[patent_app_country] => US
[patent_app_date] => 1998-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 23
[patent_no_of_words] => 12574
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[pdf_file] => patents/06/031/06031285.pdf
[firstpage_image] =>[orig_patent_app_number] => 120453
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/120453 | Heat sink for semiconductors and manufacturing process thereof | Jul 22, 1998 | Issued |
Array
(
[id] => 4163657
[patent_doc_number] => 06114770
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-05
[patent_title] => 'Low profile semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/121272
[patent_app_country] => US
[patent_app_date] => 1998-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/114/06114770.pdf
[firstpage_image] =>[orig_patent_app_number] => 121272
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/121272 | Low profile semiconductor package | Jul 21, 1998 | Issued |
Array
(
[id] => 4140171
[patent_doc_number] => 06121689
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'Semiconductor flip-chip package and method for the fabrication thereof'
[patent_app_type] => 1
[patent_app_number] => 9/120172
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[patent_app_date] => 1998-07-21
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[pdf_file] => patents/06/121/06121689.pdf
[firstpage_image] =>[orig_patent_app_number] => 120172
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/120172 | Semiconductor flip-chip package and method for the fabrication thereof | Jul 20, 1998 | Issued |
Array
(
[id] => 4414228
[patent_doc_number] => 06265759
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Laterally situated stress/strain relieving lead for a semiconductor chip package'
[patent_app_type] => 1
[patent_app_number] => 9/120006
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[pdf_file] => patents/06/265/06265759.pdf
[firstpage_image] =>[orig_patent_app_number] => 120006
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/120006 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Jul 20, 1998 | Issued |
Array
(
[id] => 4203717
[patent_doc_number] => 06013951
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-11
[patent_title] => 'Semiconductor device having an improved lead connection structure and manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 9/116242
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Array
(
[id] => 4087138
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[patent_title] => 'Semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/115261 | Semiconductor device | Jul 13, 1998 | Issued |
Array
(
[id] => 4239461
[patent_doc_number] => 06075292
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented'
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[patent_app_number] => 9/114171
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[pdf_file] => patents/06/075/06075292.pdf
[firstpage_image] =>[orig_patent_app_number] => 114171
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/114171 | Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented | Jul 12, 1998 | Issued |
Array
(
[id] => 4355575
[patent_doc_number] => 06215175
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[patent_kind] => NA
[patent_issue_date] => 2001-04-10
[patent_title] => 'Semiconductor package having metal foil die mounting plate'
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[firstpage_image] =>[orig_patent_app_number] => 111100
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/111100 | Semiconductor package having metal foil die mounting plate | Jul 5, 1998 | Issued |
Array
(
[id] => 4180295
[patent_doc_number] => 06084308
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Chip-on-chip integrated circuit package and method for making the same'
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[firstpage_image] =>[orig_patent_app_number] => 107801
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Array
(
[id] => 4145544
[patent_doc_number] => 06060772
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[patent_issue_date] => 2000-05-09
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[firstpage_image] =>[orig_patent_app_number] => 106351
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/106351 | Power semiconductor module with a plurality of semiconductor chips | Jun 28, 1998 | Issued |
Array
(
[id] => 4145600
[patent_doc_number] => 06060776
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[firstpage_image] =>[orig_patent_app_number] => 091973
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/091973 | Rectifier diode | Jun 25, 1998 | Issued |
Array
(
[id] => 4070637
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/104762 | Laser diode package | Jun 24, 1998 | Issued |
Array
(
[id] => 4253644
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[firstpage_image] =>[orig_patent_app_number] => 104403
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/104403 | Semiconductor device and method of fabricating the same | Jun 24, 1998 | Issued |