
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4140779
[patent_doc_number] => 06016005
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-18
[patent_title] => 'Multilayer, high density micro circuit module and method of manufacturing same'
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[patent_app_number] => 9/021050
[patent_app_country] => US
[patent_app_date] => 1998-02-09
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[pdf_file] => patents/06/016/06016005.pdf
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Array
(
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[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Thermal bus bar design for an electronic cartridge'
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Array
(
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[patent_issue_date] => 2000-05-23
[patent_title] => 'Semiconductor device and a method of manufacturing the same'
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Array
(
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[patent_issue_date] => 2000-02-29
[patent_title] => 'Multi-layered conducting devices and methods for manufacturing the same'
[patent_app_type] => 1
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[patent_app_date] => 1998-01-30
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Array
(
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Array
(
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[patent_issue_date] => 2000-10-31
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Array
(
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Array
(
[id] => 4163527
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[patent_title] => 'Thermally-enhanced flip chip IC package with extruded heatspreader'
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Array
(
[id] => 3954241
[patent_doc_number] => 05977624
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[patent_issue_date] => 1999-11-02
[patent_title] => 'Semiconductor package and assembly for fabricating the same'
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Array
(
[id] => 4070707
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[patent_title] => 'Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines'
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[patent_app_number] => 9/006813
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Array
(
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Array
(
[id] => 4184338
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Array
(
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Array
(
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Array
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Array
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Array
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Array
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Array
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Array
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