Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4140779 [patent_doc_number] => 06016005 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-18 [patent_title] => 'Multilayer, high density micro circuit module and method of manufacturing same' [patent_app_type] => 1 [patent_app_number] => 9/021050 [patent_app_country] => US [patent_app_date] => 1998-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2875 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/016/06016005.pdf [firstpage_image] =>[orig_patent_app_number] => 021050 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/021050
Multilayer, high density micro circuit module and method of manufacturing same Feb 8, 1998 Issued
Array ( [id] => 3950544 [patent_doc_number] => 05990549 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Thermal bus bar design for an electronic cartridge' [patent_app_type] => 1 [patent_app_number] => 9/019570 [patent_app_country] => US [patent_app_date] => 1998-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1256 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/990/05990549.pdf [firstpage_image] =>[orig_patent_app_number] => 019570 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/019570
Thermal bus bar design for an electronic cartridge Feb 5, 1998 Issued
Array ( [id] => 4105342 [patent_doc_number] => 06066894 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-23 [patent_title] => 'Semiconductor device and a method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/016731 [patent_app_country] => US [patent_app_date] => 1998-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 54 [patent_no_of_words] => 11702 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/066/06066894.pdf [firstpage_image] =>[orig_patent_app_number] => 016731 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/016731
Semiconductor device and a method of manufacturing the same Jan 29, 1998 Issued
Array ( [id] => 4148064 [patent_doc_number] => 06031277 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-29 [patent_title] => 'Multi-layered conducting devices and methods for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/015933 [patent_app_country] => US [patent_app_date] => 1998-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 3391 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/031/06031277.pdf [firstpage_image] =>[orig_patent_app_number] => 015933 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/015933
Multi-layered conducting devices and methods for manufacturing the same Jan 29, 1998 Issued
Array ( [id] => 4087249 [patent_doc_number] => 06054771 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-25 [patent_title] => 'Interconnection system in a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/014892 [patent_app_country] => US [patent_app_date] => 1998-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 2309 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/054/06054771.pdf [firstpage_image] =>[orig_patent_app_number] => 014892 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/014892
Interconnection system in a semiconductor device Jan 27, 1998 Issued
Array ( [id] => 4176835 [patent_doc_number] => 06140696 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-31 [patent_title] => 'Vertically mountable semiconductor device and methods' [patent_app_type] => 1 [patent_app_number] => 9/014053 [patent_app_country] => US [patent_app_date] => 1998-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 2582 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/140/06140696.pdf [firstpage_image] =>[orig_patent_app_number] => 014053 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/014053
Vertically mountable semiconductor device and methods Jan 26, 1998 Issued
Array ( [id] => 4026800 [patent_doc_number] => 05925898 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-20 [patent_title] => 'Optoelectronic transducer and production methods' [patent_app_type] => 1 [patent_app_number] => 9/013292 [patent_app_country] => US [patent_app_date] => 1998-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3507 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/925/05925898.pdf [firstpage_image] =>[orig_patent_app_number] => 013292 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/013292
Optoelectronic transducer and production methods Jan 25, 1998 Issued
Array ( [id] => 4163527 [patent_doc_number] => 06114761 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-05 [patent_title] => 'Thermally-enhanced flip chip IC package with extruded heatspreader' [patent_app_type] => 1 [patent_app_number] => 9/009580 [patent_app_country] => US [patent_app_date] => 1998-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4350 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/114/06114761.pdf [firstpage_image] =>[orig_patent_app_number] => 009580 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/009580
Thermally-enhanced flip chip IC package with extruded heatspreader Jan 19, 1998 Issued
Array ( [id] => 3954241 [patent_doc_number] => 05977624 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Semiconductor package and assembly for fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/008552 [patent_app_country] => US [patent_app_date] => 1998-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 30 [patent_no_of_words] => 4903 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/977/05977624.pdf [firstpage_image] =>[orig_patent_app_number] => 008552 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/008552
Semiconductor package and assembly for fabricating the same Jan 15, 1998 Issued
Array ( [id] => 4070707 [patent_doc_number] => 06008534 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-28 [patent_title] => 'Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines' [patent_app_type] => 1 [patent_app_number] => 9/006813 [patent_app_country] => US [patent_app_date] => 1998-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 4040 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/008/06008534.pdf [firstpage_image] =>[orig_patent_app_number] => 006813 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/006813
Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines Jan 13, 1998 Issued
Array ( [id] => 4222624 [patent_doc_number] => 06111313 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-29 [patent_title] => 'Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit' [patent_app_type] => 1 [patent_app_number] => 9/005491 [patent_app_country] => US [patent_app_date] => 1998-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3808 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/111/06111313.pdf [firstpage_image] =>[orig_patent_app_number] => 005491 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/005491
Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit Jan 11, 1998 Issued
Array ( [id] => 4184338 [patent_doc_number] => 06037655 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-14 [patent_title] => 'Linear image sensor package assembly' [patent_app_type] => 1 [patent_app_number] => 9/005611 [patent_app_country] => US [patent_app_date] => 1998-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2267 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/037/06037655.pdf [firstpage_image] =>[orig_patent_app_number] => 005611 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/005611
Linear image sensor package assembly Jan 11, 1998 Issued
Array ( [id] => 3909295 [patent_doc_number] => 05898217 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-27 [patent_title] => 'Semiconductor device including a substrate having clustered interconnects' [patent_app_type] => 1 [patent_app_number] => 9/002610 [patent_app_country] => US [patent_app_date] => 1998-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2525 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 240 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/898/05898217.pdf [firstpage_image] =>[orig_patent_app_number] => 002610 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/002610
Semiconductor device including a substrate having clustered interconnects Jan 4, 1998 Issued
Array ( [id] => 3918401 [patent_doc_number] => 06002174 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-14 [patent_title] => 'Barrier materials for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 9/002203 [patent_app_country] => US [patent_app_date] => 1997-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 5170 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/002/06002174.pdf [firstpage_image] =>[orig_patent_app_number] => 002203 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/002203
Barrier materials for semiconductor devices Dec 30, 1997 Issued
Array ( [id] => 1495511 [patent_doc_number] => 06342731 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-29 [patent_title] => 'Vertically mountable semiconductor device, assembly, and methods' [patent_app_type] => B1 [patent_app_number] => 09/002160 [patent_app_country] => US [patent_app_date] => 1997-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 4752 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/342/06342731.pdf [firstpage_image] =>[orig_patent_app_number] => 09002160 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/002160
Vertically mountable semiconductor device, assembly, and methods Dec 30, 1997 Issued
Array ( [id] => 4105369 [patent_doc_number] => 06066896 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-23 [patent_title] => 'Semiconductor integrated circuit device and its manufacturing method' [patent_app_type] => 1 [patent_app_number] => 9/000551 [patent_app_country] => US [patent_app_date] => 1997-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 25 [patent_no_of_words] => 6397 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/066/06066896.pdf [firstpage_image] =>[orig_patent_app_number] => 000551 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/000551
Semiconductor integrated circuit device and its manufacturing method Dec 29, 1997 Issued
Array ( [id] => 1368883 [patent_doc_number] => 06570247 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-27 [patent_title] => 'Integrated circuit device having an embedded heat slug' [patent_app_type] => B1 [patent_app_number] => 09/001704 [patent_app_country] => US [patent_app_date] => 1997-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2047 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/570/06570247.pdf [firstpage_image] =>[orig_patent_app_number] => 09001704 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/001704
Integrated circuit device having an embedded heat slug Dec 29, 1997 Issued
Array ( [id] => 3954108 [patent_doc_number] => 05977615 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/997651 [patent_app_country] => US [patent_app_date] => 1997-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 34 [patent_no_of_words] => 13667 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/977/05977615.pdf [firstpage_image] =>[orig_patent_app_number] => 997651 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/997651
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device Dec 22, 1997 Issued
Array ( [id] => 4056441 [patent_doc_number] => 05969418 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-19 [patent_title] => 'Method of attaching a chip to a flexible substrate' [patent_app_type] => 1 [patent_app_number] => 8/996352 [patent_app_country] => US [patent_app_date] => 1997-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 3204 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/969/05969418.pdf [firstpage_image] =>[orig_patent_app_number] => 996352 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/996352
Method of attaching a chip to a flexible substrate Dec 21, 1997 Issued
Array ( [id] => 4038508 [patent_doc_number] => 05994780 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-30 [patent_title] => 'Semiconductor device with multiple contact sizes' [patent_app_type] => 1 [patent_app_number] => 8/991052 [patent_app_country] => US [patent_app_date] => 1997-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1458 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/994/05994780.pdf [firstpage_image] =>[orig_patent_app_number] => 991052 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/991052
Semiconductor device with multiple contact sizes Dec 15, 1997 Issued
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