
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4108674
[patent_doc_number] => 06051879
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-18
[patent_title] => 'Electrical interconnection for attachment to a substrate'
[patent_app_type] => 1
[patent_app_number] => 8/991891
[patent_app_country] => US
[patent_app_date] => 1997-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 3332
[patent_no_of_claims] => 47
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/051/06051879.pdf
[firstpage_image] =>[orig_patent_app_number] => 991891
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/991891 | Electrical interconnection for attachment to a substrate | Dec 15, 1997 | Issued |
Array
(
[id] => 4196712
[patent_doc_number] => 06130484
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-10
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/989819
[patent_app_country] => US
[patent_app_date] => 1997-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/130/06130484.pdf
[firstpage_image] =>[orig_patent_app_number] => 989819
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/989819 | Semiconductor device | Dec 11, 1997 | Issued |
Array
(
[id] => 4103260
[patent_doc_number] => 06049124
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/988231
[patent_app_country] => US
[patent_app_date] => 1997-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 2703
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[pdf_file] => patents/06/049/06049124.pdf
[firstpage_image] =>[orig_patent_app_number] => 988231
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/988231 | Semiconductor package | Dec 9, 1997 | Issued |
Array
(
[id] => 3990441
[patent_doc_number] => 05910685
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-08
[patent_title] => 'Semiconductor memory module having double-sided stacked memory chip layout'
[patent_app_type] => 1
[patent_app_number] => 8/984330
[patent_app_country] => US
[patent_app_date] => 1997-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 48
[patent_no_of_words] => 10104
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/910/05910685.pdf
[firstpage_image] =>[orig_patent_app_number] => 984330
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/984330 | Semiconductor memory module having double-sided stacked memory chip layout | Dec 2, 1997 | Issued |
Array
(
[id] => 4242878
[patent_doc_number] => 06144089
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-07
[patent_title] => 'Inner-digitized bond fingers on bus bars of semiconductor device package'
[patent_app_type] => 1
[patent_app_number] => 8/980151
[patent_app_country] => US
[patent_app_date] => 1997-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 5001
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[pdf_file] => patents/06/144/06144089.pdf
[firstpage_image] =>[orig_patent_app_number] => 980151
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/980151 | Inner-digitized bond fingers on bus bars of semiconductor device package | Nov 25, 1997 | Issued |
Array
(
[id] => 4137546
[patent_doc_number] => 06034441
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-07
[patent_title] => 'Overcast semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/979063
[patent_app_country] => US
[patent_app_date] => 1997-11-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/034/06034441.pdf
[firstpage_image] =>[orig_patent_app_number] => 979063
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/979063 | Overcast semiconductor package | Nov 25, 1997 | Issued |
Array
(
[id] => 3918310
[patent_doc_number] => 06002168
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-14
[patent_title] => 'Microelectronic component with rigid interposer'
[patent_app_type] => 1
[patent_app_number] => 8/978082
[patent_app_country] => US
[patent_app_date] => 1997-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 6217
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[pdf_file] => patents/06/002/06002168.pdf
[firstpage_image] =>[orig_patent_app_number] => 978082
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/978082 | Microelectronic component with rigid interposer | Nov 24, 1997 | Issued |
Array
(
[id] => 3885784
[patent_doc_number] => 05798566
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-25
[patent_title] => 'Ceramic IC package base and ceramic cover'
[patent_app_type] => 1
[patent_app_number] => 8/976501
[patent_app_country] => US
[patent_app_date] => 1997-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 12425
[patent_no_of_claims] => 37
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/798/05798566.pdf
[firstpage_image] =>[orig_patent_app_number] => 976501
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/976501 | Ceramic IC package base and ceramic cover | Nov 23, 1997 | Issued |
Array
(
[id] => 4038839
[patent_doc_number] => 05942799
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-24
[patent_title] => 'Multilayer diffusion barriers'
[patent_app_type] => 1
[patent_app_number] => 8/974451
[patent_app_country] => US
[patent_app_date] => 1997-11-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/942/05942799.pdf
[firstpage_image] =>[orig_patent_app_number] => 974451
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/974451 | Multilayer diffusion barriers | Nov 19, 1997 | Issued |
Array
(
[id] => 3932086
[patent_doc_number] => 05952715
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-14
[patent_title] => 'Chip type electronic part'
[patent_app_type] => 1
[patent_app_number] => 8/974347
[patent_app_country] => US
[patent_app_date] => 1997-11-19
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 2052
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[pdf_file] => patents/05/952/05952715.pdf
[firstpage_image] =>[orig_patent_app_number] => 974347
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/974347 | Chip type electronic part | Nov 18, 1997 | Issued |
Array
(
[id] => 4038796
[patent_doc_number] => 05942796
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-24
[patent_title] => 'Package structure for high-power surface-mounted electronic devices'
[patent_app_type] => 1
[patent_app_number] => 8/971322
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[pdf_file] => patents/05/942/05942796.pdf
[firstpage_image] =>[orig_patent_app_number] => 971322
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/971322 | Package structure for high-power surface-mounted electronic devices | Nov 16, 1997 | Issued |
Array
(
[id] => 3947945
[patent_doc_number] => 05982040
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => 1
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[pdf_file] => patents/05/982/05982040.pdf
[firstpage_image] =>[orig_patent_app_number] => 970199
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Array
(
[id] => 3918497
[patent_doc_number] => 06002178
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-14
[patent_title] => 'Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)'
[patent_app_type] => 1
[patent_app_number] => 8/968981
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[pdf_file] => patents/06/002/06002178.pdf
[firstpage_image] =>[orig_patent_app_number] => 968981
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/968981 | Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP) | Nov 11, 1997 | Issued |
Array
(
[id] => 3944725
[patent_doc_number] => 05973398
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate'
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[pdf_file] => patents/05/973/05973398.pdf
[firstpage_image] =>[orig_patent_app_number] => 963813
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/963813 | Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate | Nov 3, 1997 | Issued |
Array
(
[id] => 4239536
[patent_doc_number] => 06118180
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[patent_title] => 'Semiconductor die metal layout for flip chip packaging'
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Array
(
[id] => 3985276
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[patent_title] => 'Heat spreader'
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Array
(
[id] => 4091854
[patent_doc_number] => 06018197
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-25
[patent_title] => 'Wired board with improved bonding pads'
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[firstpage_image] =>[orig_patent_app_number] => 958083
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/958083 | Wired board with improved bonding pads | Oct 26, 1997 | Issued |
Array
(
[id] => 4080271
[patent_doc_number] => 05965920
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-12
[patent_title] => 'Input protection circuit'
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[firstpage_image] =>[orig_patent_app_number] => 957331
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/957331 | Input protection circuit | Oct 23, 1997 | Issued |
| 08/959957 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Oct 23, 1997 | Abandoned |
Array
(
[id] => 4038755
[patent_doc_number] => 05942794
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/955441 | Plastic encapsulated semiconductor device and method of manufacturing the same | Oct 20, 1997 | Issued |