Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4108674 [patent_doc_number] => 06051879 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-18 [patent_title] => 'Electrical interconnection for attachment to a substrate' [patent_app_type] => 1 [patent_app_number] => 8/991891 [patent_app_country] => US [patent_app_date] => 1997-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3332 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/051/06051879.pdf [firstpage_image] =>[orig_patent_app_number] => 991891 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/991891
Electrical interconnection for attachment to a substrate Dec 15, 1997 Issued
Array ( [id] => 4196712 [patent_doc_number] => 06130484 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-10 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/989819 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2784 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/130/06130484.pdf [firstpage_image] =>[orig_patent_app_number] => 989819 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/989819
Semiconductor device Dec 11, 1997 Issued
Array ( [id] => 4103260 [patent_doc_number] => 06049124 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-11 [patent_title] => 'Semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/988231 [patent_app_country] => US [patent_app_date] => 1997-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2703 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/049/06049124.pdf [firstpage_image] =>[orig_patent_app_number] => 988231 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/988231
Semiconductor package Dec 9, 1997 Issued
Array ( [id] => 3990441 [patent_doc_number] => 05910685 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-08 [patent_title] => 'Semiconductor memory module having double-sided stacked memory chip layout' [patent_app_type] => 1 [patent_app_number] => 8/984330 [patent_app_country] => US [patent_app_date] => 1997-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 48 [patent_no_of_words] => 10104 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 317 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/910/05910685.pdf [firstpage_image] =>[orig_patent_app_number] => 984330 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/984330
Semiconductor memory module having double-sided stacked memory chip layout Dec 2, 1997 Issued
Array ( [id] => 4242878 [patent_doc_number] => 06144089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-07 [patent_title] => 'Inner-digitized bond fingers on bus bars of semiconductor device package' [patent_app_type] => 1 [patent_app_number] => 8/980151 [patent_app_country] => US [patent_app_date] => 1997-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 5001 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/144/06144089.pdf [firstpage_image] =>[orig_patent_app_number] => 980151 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/980151
Inner-digitized bond fingers on bus bars of semiconductor device package Nov 25, 1997 Issued
Array ( [id] => 4137546 [patent_doc_number] => 06034441 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-07 [patent_title] => 'Overcast semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/979063 [patent_app_country] => US [patent_app_date] => 1997-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 5705 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/034/06034441.pdf [firstpage_image] =>[orig_patent_app_number] => 979063 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/979063
Overcast semiconductor package Nov 25, 1997 Issued
Array ( [id] => 3918310 [patent_doc_number] => 06002168 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-14 [patent_title] => 'Microelectronic component with rigid interposer' [patent_app_type] => 1 [patent_app_number] => 8/978082 [patent_app_country] => US [patent_app_date] => 1997-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 6217 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/002/06002168.pdf [firstpage_image] =>[orig_patent_app_number] => 978082 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/978082
Microelectronic component with rigid interposer Nov 24, 1997 Issued
Array ( [id] => 3885784 [patent_doc_number] => 05798566 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-25 [patent_title] => 'Ceramic IC package base and ceramic cover' [patent_app_type] => 1 [patent_app_number] => 8/976501 [patent_app_country] => US [patent_app_date] => 1997-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 26 [patent_no_of_words] => 12425 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/798/05798566.pdf [firstpage_image] =>[orig_patent_app_number] => 976501 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/976501
Ceramic IC package base and ceramic cover Nov 23, 1997 Issued
Array ( [id] => 4038839 [patent_doc_number] => 05942799 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-24 [patent_title] => 'Multilayer diffusion barriers' [patent_app_type] => 1 [patent_app_number] => 8/974451 [patent_app_country] => US [patent_app_date] => 1997-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3768 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/942/05942799.pdf [firstpage_image] =>[orig_patent_app_number] => 974451 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/974451
Multilayer diffusion barriers Nov 19, 1997 Issued
Array ( [id] => 3932086 [patent_doc_number] => 05952715 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Chip type electronic part' [patent_app_type] => 1 [patent_app_number] => 8/974347 [patent_app_country] => US [patent_app_date] => 1997-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2052 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/952/05952715.pdf [firstpage_image] =>[orig_patent_app_number] => 974347 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/974347
Chip type electronic part Nov 18, 1997 Issued
Array ( [id] => 4038796 [patent_doc_number] => 05942796 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-24 [patent_title] => 'Package structure for high-power surface-mounted electronic devices' [patent_app_type] => 1 [patent_app_number] => 8/971322 [patent_app_country] => US [patent_app_date] => 1997-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3756 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/942/05942796.pdf [firstpage_image] =>[orig_patent_app_number] => 971322 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/971322
Package structure for high-power surface-mounted electronic devices Nov 16, 1997 Issued
Array ( [id] => 3947945 [patent_doc_number] => 05982040 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-09 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/970199 [patent_app_country] => US [patent_app_date] => 1997-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 16 [patent_no_of_words] => 8198 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/982/05982040.pdf [firstpage_image] =>[orig_patent_app_number] => 970199 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/970199
Semiconductor device and method for manufacturing the same Nov 13, 1997 Issued
Array ( [id] => 3918497 [patent_doc_number] => 06002178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-14 [patent_title] => 'Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)' [patent_app_type] => 1 [patent_app_number] => 8/968981 [patent_app_country] => US [patent_app_date] => 1997-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 3953 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/002/06002178.pdf [firstpage_image] =>[orig_patent_app_number] => 968981 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/968981
Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP) Nov 11, 1997 Issued
Array ( [id] => 3944725 [patent_doc_number] => 05973398 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-26 [patent_title] => 'Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate' [patent_app_type] => 1 [patent_app_number] => 8/963813 [patent_app_country] => US [patent_app_date] => 1997-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3736 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/973/05973398.pdf [firstpage_image] =>[orig_patent_app_number] => 963813 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/963813
Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate Nov 3, 1997 Issued
Array ( [id] => 4239536 [patent_doc_number] => 06118180 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-12 [patent_title] => 'Semiconductor die metal layout for flip chip packaging' [patent_app_type] => 1 [patent_app_number] => 8/963553 [patent_app_country] => US [patent_app_date] => 1997-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 4746 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/118/06118180.pdf [firstpage_image] =>[orig_patent_app_number] => 963553 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/963553
Semiconductor die metal layout for flip chip packaging Nov 2, 1997 Issued
Array ( [id] => 3985276 [patent_doc_number] => 05949138 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Heat spreader' [patent_app_type] => 1 [patent_app_number] => 8/962159 [patent_app_country] => US [patent_app_date] => 1997-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2545 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/949/05949138.pdf [firstpage_image] =>[orig_patent_app_number] => 962159 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/962159
Heat spreader Oct 30, 1997 Issued
Array ( [id] => 4091854 [patent_doc_number] => 06018197 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-25 [patent_title] => 'Wired board with improved bonding pads' [patent_app_type] => 1 [patent_app_number] => 8/958083 [patent_app_country] => US [patent_app_date] => 1997-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 23 [patent_no_of_words] => 5153 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/018/06018197.pdf [firstpage_image] =>[orig_patent_app_number] => 958083 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/958083
Wired board with improved bonding pads Oct 26, 1997 Issued
Array ( [id] => 4080271 [patent_doc_number] => 05965920 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-12 [patent_title] => 'Input protection circuit' [patent_app_type] => 1 [patent_app_number] => 8/957331 [patent_app_country] => US [patent_app_date] => 1997-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 1509 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/965/05965920.pdf [firstpage_image] =>[orig_patent_app_number] => 957331 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/957331
Input protection circuit Oct 23, 1997 Issued
08/959957 INTEGRATED CIRCUIT PACKAGE AND METHOD Oct 23, 1997 Abandoned
Array ( [id] => 4038755 [patent_doc_number] => 05942794 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-24 [patent_title] => 'Plastic encapsulated semiconductor device and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/955441 [patent_app_country] => US [patent_app_date] => 1997-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 12780 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/942/05942794.pdf [firstpage_image] =>[orig_patent_app_number] => 955441 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/955441
Plastic encapsulated semiconductor device and method of manufacturing the same Oct 20, 1997 Issued
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