
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3980748
[patent_doc_number] => 05905305
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Condensed memory matrix'
[patent_app_type] => 1
[patent_app_number] => 8/909401
[patent_app_country] => US
[patent_app_date] => 1997-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1927
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/905/05905305.pdf
[firstpage_image] =>[orig_patent_app_number] => 909401
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/909401 | Condensed memory matrix | Aug 10, 1997 | Issued |
Array
(
[id] => 4195385
[patent_doc_number] => 06153940
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Core metal soldering knob flip-chip technology'
[patent_app_type] => 1
[patent_app_number] => 8/836804
[patent_app_country] => US
[patent_app_date] => 1997-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/153/06153940.pdf
[firstpage_image] =>[orig_patent_app_number] => 836804
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/836804 | Core metal soldering knob flip-chip technology | Aug 3, 1997 | Issued |
Array
(
[id] => 4227932
[patent_doc_number] => 06011312
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-04
[patent_title] => 'Flip-chip semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/902430
[patent_app_country] => US
[patent_app_date] => 1997-07-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3795
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[pdf_file] => patents/06/011/06011312.pdf
[firstpage_image] =>[orig_patent_app_number] => 902430
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/902430 | Flip-chip semiconductor package | Jul 28, 1997 | Issued |
Array
(
[id] => 3929753
[patent_doc_number] => 05945740
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/901765
[patent_app_country] => US
[patent_app_date] => 1997-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/945/05945740.pdf
[firstpage_image] =>[orig_patent_app_number] => 901765
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/901765 | Semiconductor device | Jul 27, 1997 | Issued |
Array
(
[id] => 3998471
[patent_doc_number] => 05892274
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Printed circuit board ground plane and high frequency semiconductor combination'
[patent_app_type] => 1
[patent_app_number] => 8/900243
[patent_app_country] => US
[patent_app_date] => 1997-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/892/05892274.pdf
[firstpage_image] =>[orig_patent_app_number] => 900243
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/900243 | Printed circuit board ground plane and high frequency semiconductor combination | Jul 23, 1997 | Issued |
Array
(
[id] => 4049474
[patent_doc_number] => 05912509
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-15
[patent_title] => 'MOS semiconductor device and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/892907
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[patent_app_date] => 1997-07-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/912/05912509.pdf
[firstpage_image] =>[orig_patent_app_number] => 892907
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/892907 | MOS semiconductor device and method of manufacturing the same | Jul 14, 1997 | Issued |
Array
(
[id] => 4195341
[patent_doc_number] => 06153937
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Semiconductor device and method of the same'
[patent_app_type] => 1
[patent_app_number] => 8/893261
[patent_app_country] => US
[patent_app_date] => 1997-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/153/06153937.pdf
[firstpage_image] =>[orig_patent_app_number] => 893261
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/893261 | Semiconductor device and method of the same | Jul 14, 1997 | Issued |
Array
(
[id] => 4230553
[patent_doc_number] => 06088213
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-11
[patent_title] => 'Bipolar electrostatic chuck and method of making same'
[patent_app_type] => 1
[patent_app_number] => 8/890733
[patent_app_country] => US
[patent_app_date] => 1997-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3421
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/088/06088213.pdf
[firstpage_image] =>[orig_patent_app_number] => 890733
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/890733 | Bipolar electrostatic chuck and method of making same | Jul 10, 1997 | Issued |
Array
(
[id] => 3794612
[patent_doc_number] => 05841177
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-24
[patent_title] => 'Multicolor light emitting device'
[patent_app_type] => 1
[patent_app_number] => 8/890927
[patent_app_country] => US
[patent_app_date] => 1997-07-10
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/841/05841177.pdf
[firstpage_image] =>[orig_patent_app_number] => 890927
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/890927 | Multicolor light emitting device | Jul 9, 1997 | Issued |
Array
(
[id] => 4176997
[patent_doc_number] => 06140708
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-31
[patent_title] => 'Chip scale package and method for manufacture thereof'
[patent_app_type] => 1
[patent_app_number] => 8/889834
[patent_app_country] => US
[patent_app_date] => 1997-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/06/140/06140708.pdf
[firstpage_image] =>[orig_patent_app_number] => 889834
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/889834 | Chip scale package and method for manufacture thereof | Jul 7, 1997 | Issued |
Array
(
[id] => 4108647
[patent_doc_number] => 06051877
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-18
[patent_title] => 'Semiconductor device and fabrication method'
[patent_app_type] => 1
[patent_app_number] => 8/888123
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[pdf_file] => patents/06/051/06051877.pdf
[firstpage_image] =>[orig_patent_app_number] => 888123
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/888123 | Semiconductor device and fabrication method | Jul 2, 1997 | Issued |
Array
(
[id] => 3845368
[patent_doc_number] => 05847452
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Post mounted heat sink method and apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/886773
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[pdf_file] => patents/05/847/05847452.pdf
[firstpage_image] =>[orig_patent_app_number] => 886773
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/886773 | Post mounted heat sink method and apparatus | Jun 29, 1997 | Issued |
Array
(
[id] => 4113704
[patent_doc_number] => 06057604
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-02
[patent_title] => 'Integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure'
[patent_app_type] => 1
[patent_app_number] => 8/885642
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[patent_app_date] => 1997-06-30
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Array
(
[id] => 3954828
[patent_doc_number] => 05955783
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'High frequency signal processing chip having signal pins distributed to minimize signal interference'
[patent_app_type] => 1
[patent_app_number] => 8/878333
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[patent_app_date] => 1997-06-18
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[pdf_file] => patents/05/955/05955783.pdf
[firstpage_image] =>[orig_patent_app_number] => 878333
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/878333 | High frequency signal processing chip having signal pins distributed to minimize signal interference | Jun 17, 1997 | Issued |
Array
(
[id] => 3964720
[patent_doc_number] => 05900672
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-04
[patent_title] => 'Barrier layer'
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[firstpage_image] =>[orig_patent_app_number] => 876915
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Array
(
[id] => 4180337
[patent_doc_number] => 06084311
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Method and apparatus for reducing resin bleed during the formation of a semiconductor device'
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[patent_app_number] => 8/862093
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[pdf_file] => patents/06/084/06084311.pdf
[firstpage_image] =>[orig_patent_app_number] => 862093
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/862093 | Method and apparatus for reducing resin bleed during the formation of a semiconductor device | May 21, 1997 | Issued |
Array
(
[id] => 3964265
[patent_doc_number] => 05900643
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[firstpage_image] =>[orig_patent_app_number] => 858845
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Array
(
[id] => 4068056
[patent_doc_number] => 05895973
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[patent_issue_date] => 1999-04-20
[patent_title] => 'Electronic component assembly for maintaining component alignment during soldering'
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Array
(
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Array
(
[id] => 4020119
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[patent_issue_date] => 1999-03-09
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[pdf_file] => patents/05/880/05880519.pdf
[firstpage_image] =>[orig_patent_app_number] => 856949
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/856949 | Moisture barrier gap fill structure and method for making the same | May 14, 1997 | Issued |