Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 3535146
[patent_doc_number] => 05528466
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-18
[patent_title] => 'Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid'
[patent_app_type] => 1
[patent_app_number] => 8/312467
[patent_app_country] => US
[patent_app_date] => 1994-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 4350
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 287
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/528/05528466.pdf
[firstpage_image] =>[orig_patent_app_number] => 312467
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/312467 | Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid | Sep 25, 1994 | Issued |
08/309433 | COMPLIANT MICROELECTRONIC MOUNTING DEVICE | Sep 19, 1994 | Abandoned |
Array
(
[id] => 3643047
[patent_doc_number] => 05631809
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-20
[patent_title] => 'Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/305397
[patent_app_country] => US
[patent_app_date] => 1994-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 27
[patent_no_of_words] => 6153
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/631/05631809.pdf
[firstpage_image] =>[orig_patent_app_number] => 305397
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/305397 | Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device | Sep 12, 1994 | Issued |
Array
(
[id] => 3529249
[patent_doc_number] => 05530625
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-25
[patent_title] => 'Electrical interface board including flat ribbon conductors positioned on edge'
[patent_app_type] => 1
[patent_app_number] => 8/301794
[patent_app_country] => US
[patent_app_date] => 1994-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 13
[patent_no_of_words] => 3957
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/530/05530625.pdf
[firstpage_image] =>[orig_patent_app_number] => 301794
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/301794 | Electrical interface board including flat ribbon conductors positioned on edge | Sep 6, 1994 | Issued |
08/300977 | RETENTION APPARATUS FOR AN ELECTRICAL COMPONENT | Sep 5, 1994 | Abandoned |
Array
(
[id] => 3617203
[patent_doc_number] => 05590030
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-31
[patent_title] => 'Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections'
[patent_app_type] => 1
[patent_app_number] => 8/291893
[patent_app_country] => US
[patent_app_date] => 1994-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 15540
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 302
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/590/05590030.pdf
[firstpage_image] =>[orig_patent_app_number] => 291893
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/291893 | Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections | Aug 16, 1994 | Issued |
Array
(
[id] => 3600421
[patent_doc_number] => 05568361
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-22
[patent_title] => 'Three-dimensional electronic circuit of interconnected modules'
[patent_app_type] => 1
[patent_app_number] => 8/279693
[patent_app_country] => US
[patent_app_date] => 1994-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5794
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/568/05568361.pdf
[firstpage_image] =>[orig_patent_app_number] => 279693
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/279693 | Three-dimensional electronic circuit of interconnected modules | Jul 24, 1994 | Issued |
Array
(
[id] => 3656279
[patent_doc_number] => 05629835
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Metal ball grid array package with improved thermal conductivity'
[patent_app_type] => 1
[patent_app_number] => 8/277387
[patent_app_country] => US
[patent_app_date] => 1994-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 20
[patent_no_of_words] => 5873
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/629/05629835.pdf
[firstpage_image] =>[orig_patent_app_number] => 277387
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/277387 | Metal ball grid array package with improved thermal conductivity | Jul 18, 1994 | Issued |
08/270848 | SYSTEM AND METHOD FOR PROVIDING UNIFORM SOLDER JOINT HEIGHT FOR PRINTED CIRCUIT BOARDS AND THEIR ASSEMBLIES | Jul 4, 1994 | Abandoned |
08/266775 | RESIN-MOLDED ELECTRONIC CIRCUIT DEVICE | Jun 28, 1994 | Abandoned |
Array
(
[id] => 3656322
[patent_doc_number] => 05629838
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Apparatus for non-conductively interconnecting integrated circuits using half capacitors'
[patent_app_type] => 1
[patent_app_number] => 8/265607
[patent_app_country] => US
[patent_app_date] => 1994-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 41
[patent_figures_cnt] => 52
[patent_no_of_words] => 27962
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/629/05629838.pdf
[firstpage_image] =>[orig_patent_app_number] => 265607
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/265607 | Apparatus for non-conductively interconnecting integrated circuits using half capacitors | Jun 23, 1994 | Issued |
08/265299 | HIGH INPUT/OUTPUT DENSITY MLC FLAT PACK | Jun 23, 1994 | Abandoned |
08/264388 | IC CARD AND METHOD OF FABRICATING SAME | Jun 22, 1994 | Abandoned |
Array
(
[id] => 3457492
[patent_doc_number] => 05386346
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-31
[patent_title] => 'Circuit card assembly with shielding assembly for reducing EMI emissions'
[patent_app_type] => 1
[patent_app_number] => 8/262375
[patent_app_country] => US
[patent_app_date] => 1994-06-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 3489
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/386/05386346.pdf
[firstpage_image] =>[orig_patent_app_number] => 262375
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/262375 | Circuit card assembly with shielding assembly for reducing EMI emissions | Jun 19, 1994 | Issued |
Array
(
[id] => 3496426
[patent_doc_number] => 05475566
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-12
[patent_title] => 'Interlocking housing and case assembly having a circuit board disposed parallel to a front panel'
[patent_app_type] => 1
[patent_app_number] => 8/262182
[patent_app_country] => US
[patent_app_date] => 1994-06-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2245
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 199
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/475/05475566.pdf
[firstpage_image] =>[orig_patent_app_number] => 262182
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/262182 | Interlocking housing and case assembly having a circuit board disposed parallel to a front panel | Jun 19, 1994 | Issued |
Array
(
[id] => 3462075
[patent_doc_number] => 05379191
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-03
[patent_title] => 'Compact adapter package providing peripheral to area translation for an integrated circuit chip'
[patent_app_type] => 1
[patent_app_number] => 8/257235
[patent_app_country] => US
[patent_app_date] => 1994-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 15
[patent_no_of_words] => 4192
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 410
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/379/05379191.pdf
[firstpage_image] =>[orig_patent_app_number] => 257235
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/257235 | Compact adapter package providing peripheral to area translation for an integrated circuit chip | Jun 8, 1994 | Issued |
Array
(
[id] => 3562352
[patent_doc_number] => 05519578
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Folded printed wiring board structure with electromagnetic shield'
[patent_app_type] => 1
[patent_app_number] => 8/254781
[patent_app_country] => US
[patent_app_date] => 1994-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3267
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 288
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/519/05519578.pdf
[firstpage_image] =>[orig_patent_app_number] => 254781
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/254781 | Folded printed wiring board structure with electromagnetic shield | Jun 5, 1994 | Issued |
Array
(
[id] => 3466538
[patent_doc_number] => 05473514
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-05
[patent_title] => 'Semiconductor device having an interconnecting circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/253589
[patent_app_country] => US
[patent_app_date] => 1994-06-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 38
[patent_no_of_words] => 6132
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/473/05473514.pdf
[firstpage_image] =>[orig_patent_app_number] => 253589
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/253589 | Semiconductor device having an interconnecting circuit board | Jun 2, 1994 | Issued |
Array
(
[id] => 3470967
[patent_doc_number] => 05469333
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-21
[patent_title] => 'Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads'
[patent_app_type] => 1
[patent_app_number] => 8/252488
[patent_app_country] => US
[patent_app_date] => 1994-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 4882
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 230
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/469/05469333.pdf
[firstpage_image] =>[orig_patent_app_number] => 252488
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/252488 | Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads | May 31, 1994 | Issued |
Array
(
[id] => 3600185
[patent_doc_number] => 05488541
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-30
[patent_title] => 'VME bus compatible backplane and shelf arrangement'
[patent_app_type] => 1
[patent_app_number] => 8/251994
[patent_app_country] => US
[patent_app_date] => 1994-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2510
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 166
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/488/05488541.pdf
[firstpage_image] =>[orig_patent_app_number] => 251994
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/251994 | VME bus compatible backplane and shelf arrangement | May 31, 1994 | Issued |