Jasmine Jhihan B. Clark

Array ( [id] => 3748435 [patent_doc_number] => 05801445 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-01 [patent_title] => 'Semiconductor device and method of manufacturing same' [patent_app_type] => 1 [patent_app_number] => 8/818729 [patent_app_country] => US [patent_app_date] => 1997-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 24 [patent_no_of_words] => 4817 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/801/05801445.pdf [firstpage_image] =>[orig_patent_app_number] => 818729 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3929645 [patent_doc_number] => 05945732 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/815537 [patent_app_country] => US [patent_app_date] => 1997-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1982 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/945/05945732.pdf [firstpage_image] =>[orig_patent_app_number] => 815537 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3896302 [patent_doc_number] => 05834833 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Electrical component having a selective cut-off conductor' [patent_app_type] => 1 [patent_app_number] => 8/811525 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 3046 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834833.pdf [firstpage_image] =>[orig_patent_app_number] => 811525 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3767096 [patent_doc_number] => 05844319 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Microelectronic assembly with collar surrounding integrated circuit component on a substrate' [patent_app_type] => 1 [patent_app_number] => 8/808773 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1967 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844319.pdf [firstpage_image] =>[orig_patent_app_number] => 808773 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3892763 [patent_doc_number] => 05777385 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-07 [patent_title] => 'Ceramic ball grid array (CBGA) package structure having a heat spreader for integrated-circuit chips' [patent_app_type] => 1 [patent_app_number] => 8/811459 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2141 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/777/05777385.pdf [firstpage_image] =>[orig_patent_app_number] => 811459 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3767124 [patent_doc_number] => 05844321 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Semiconductor device comprising a chip which is provided with a via opening and is soldered on a support, and method of realizing this device' [patent_app_type] => 1 [patent_app_number] => 8/808591 [patent_app_country] => US [patent_app_date] => 1997-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 6270 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844321.pdf [firstpage_image] =>[orig_patent_app_number] => 808591 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3834985 [patent_doc_number] => 05760479 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-02 [patent_title] => 'Flip-chip die attachment for a high temperature die to substrate bond' [patent_app_type] => 1 [patent_app_number] => 8/808373 [patent_app_country] => US [patent_app_date] => 1997-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 6 [patent_no_of_words] => 2631 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/760/05760479.pdf [firstpage_image] =>[orig_patent_app_number] => 808373 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3929587 [patent_doc_number] => 05945728 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Lead frame capacitor and capacitively coupled isolator circuit' [patent_app_type] => 1 [patent_app_number] => 8/807197 [patent_app_country] => US [patent_app_date] => 1997-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4123 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/945/05945728.pdf [firstpage_image] =>[orig_patent_app_number] => 807197 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3845436 [patent_doc_number] => 05847456 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/802315 [patent_app_country] => US [patent_app_date] => 1997-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 25 [patent_no_of_words] => 4720 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847456.pdf [firstpage_image] =>[orig_patent_app_number] => 802315 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4009877 [patent_doc_number] => 05859445 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-12 [patent_title] => 'Electro-optical device including thin film transistors having spoiling impurities added thereto' [patent_app_type] => 1 [patent_app_number] => 8/799369 [patent_app_country] => US [patent_app_date] => 1997-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 27 [patent_no_of_words] => 8716 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/859/05859445.pdf [firstpage_image] =>[orig_patent_app_number] => 799369 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3766763 [patent_doc_number] => 05852328 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-22 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/795427 [patent_app_country] => US [patent_app_date] => 1997-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 3431 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/852/05852328.pdf [firstpage_image] =>[orig_patent_app_number] => 795427 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3904058 [patent_doc_number] => 05751060 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Electronic package' [patent_app_type] => 1 [patent_app_number] => 8/795181 [patent_app_country] => US [patent_app_date] => 1997-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5743 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751060.pdf [firstpage_image] =>[orig_patent_app_number] => 795181 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4244487 [patent_doc_number] => 06091144 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-18 [patent_title] => 'Semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/790853 [patent_app_country] => US [patent_app_date] => 1997-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4952 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/091/06091144.pdf [firstpage_image] =>[orig_patent_app_number] => 790853 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3799873 [patent_doc_number] => 05780930 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-14 [patent_title] => 'Method for direct attachment of an on-chip bypass capacitor in an integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/792088 [patent_app_country] => US [patent_app_date] => 1997-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3727 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/780/05780930.pdf [firstpage_image] =>[orig_patent_app_number] => 792088 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3857820 [patent_doc_number] => 05767574 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-16 [patent_title] => 'Semiconductor lead frame' [patent_app_type] => 1 [patent_app_number] => 8/792211 [patent_app_country] => US [patent_app_date] => 1997-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2322 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/767/05767574.pdf [firstpage_image] =>[orig_patent_app_number] => 792211 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3879966 [patent_doc_number] => 05825059 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Semiconductor device and an interconnection structure of same' [patent_app_type] => 1 [patent_app_number] => 8/791271 [patent_app_country] => US [patent_app_date] => 1997-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 24 [patent_no_of_words] => 6054 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825059.pdf [firstpage_image] =>[orig_patent_app_number] => 791271 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3998154 [patent_doc_number] => 05892250 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-06 [patent_title] => 'Semiconductor integrated circuit chip' [patent_app_type] => 1 [patent_app_number] => 8/787773 [patent_app_country] => US [patent_app_date] => 1997-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4818 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/892/05892250.pdf [firstpage_image] =>[orig_patent_app_number] => 787773 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3885741 [patent_doc_number] => 05798563 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-25 [patent_title] => 'Polytetrafluoroethylene thin film chip carrier' [patent_app_type] => 1 [patent_app_number] => 8/790245 [patent_app_country] => US [patent_app_date] => 1997-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3262 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/798/05798563.pdf [firstpage_image] =>[orig_patent_app_number] => 790245 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3844874 [patent_doc_number] => 05847420 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Semiconductor integrated circuit having three wiring layers' [patent_app_type] => 1 [patent_app_number] => 8/789241 [patent_app_country] => US [patent_app_date] => 1997-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 7423 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847420.pdf [firstpage_image] =>[orig_patent_app_number] => 789241 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3837056 [patent_doc_number] => 05814871 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-29 [patent_title] => 'Optical semiconductor assembly having a conductive float pad' [patent_app_type] => 1 [patent_app_number] => 8/789663 [patent_app_country] => US [patent_app_date] => 1997-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 20 [patent_no_of_words] => 3653 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/814/05814871.pdf [firstpage_image] =>[orig_patent_app_number] => 789663 [rel_patent_id] =>[rel_patent_doc_number] =>)