
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4054615
[patent_doc_number] => 05869905
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-09
[patent_title] => 'Molded packaging for semiconductor device and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/782259
[patent_app_country] => US
[patent_app_date] => 1997-01-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 34
[patent_no_of_words] => 5110
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/869/05869905.pdf
[firstpage_image] =>[orig_patent_app_number] => 782259
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/782259 | Molded packaging for semiconductor device and method of manufacturing the same | Jan 13, 1997 | Issued |
Array
(
[id] => 3741250
[patent_doc_number] => 05698904
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'Packaging material for electronic components'
[patent_app_type] => 1
[patent_app_number] => 8/782447
[patent_app_country] => US
[patent_app_date] => 1997-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 2330
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/698/05698904.pdf
[firstpage_image] =>[orig_patent_app_number] => 782447
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/782447 | Packaging material for electronic components | Jan 12, 1997 | Issued |
Array
(
[id] => 3780596
[patent_doc_number] => 05808365
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/781815
[patent_app_country] => US
[patent_app_date] => 1997-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 32
[patent_no_of_words] => 5739
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/808/05808365.pdf
[firstpage_image] =>[orig_patent_app_number] => 781815
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/781815 | Semiconductor device and method of manufacturing the same | Jan 8, 1997 | Issued |
Array
(
[id] => 3843463
[patent_doc_number] => 05704593
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-06
[patent_title] => 'Film carrier tape for semiconductor package and semiconductor device employing the same'
[patent_app_type] => 1
[patent_app_number] => 8/780844
[patent_app_country] => US
[patent_app_date] => 1997-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 3510
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/704/05704593.pdf
[firstpage_image] =>[orig_patent_app_number] => 780844
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/780844 | Film carrier tape for semiconductor package and semiconductor device employing the same | Jan 8, 1997 | Issued |
Array
(
[id] => 4068023
[patent_doc_number] => 05895972
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug'
[patent_app_type] => 1
[patent_app_number] => 8/778016
[patent_app_country] => US
[patent_app_date] => 1996-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 21
[patent_no_of_words] => 5528
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/895/05895972.pdf
[firstpage_image] =>[orig_patent_app_number] => 778016
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/778016 | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug | Dec 30, 1996 | Issued |
Array
(
[id] => 3746191
[patent_doc_number] => 05786634
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/773993
[patent_app_country] => US
[patent_app_date] => 1996-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 21
[patent_no_of_words] => 4528
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/786/05786634.pdf
[firstpage_image] =>[orig_patent_app_number] => 773993
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/773993 | Semiconductor device | Dec 28, 1996 | Issued |
Array
(
[id] => 4003125
[patent_doc_number] => 05923092
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/773679
[patent_app_country] => US
[patent_app_date] => 1996-12-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 3657
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 271
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/923/05923092.pdf
[firstpage_image] =>[orig_patent_app_number] => 773679
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/773679 | Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame | Dec 23, 1996 | Issued |
Array
(
[id] => 3765608
[patent_doc_number] => 05742079
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-21
[patent_title] => 'Integrated circuit with variable pad pitch'
[patent_app_type] => 1
[patent_app_number] => 8/773099
[patent_app_country] => US
[patent_app_date] => 1996-12-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1944
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 85
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/742/05742079.pdf
[firstpage_image] =>[orig_patent_app_number] => 773099
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/773099 | Integrated circuit with variable pad pitch | Dec 23, 1996 | Issued |
Array
(
[id] => 3874629
[patent_doc_number] => 05838054
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-17
[patent_title] => 'Contact pads for radiation imagers'
[patent_app_type] => 1
[patent_app_number] => 8/772453
[patent_app_country] => US
[patent_app_date] => 1996-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 2508
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/838/05838054.pdf
[firstpage_image] =>[orig_patent_app_number] => 772453
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/772453 | Contact pads for radiation imagers | Dec 22, 1996 | Issued |
Array
(
[id] => 3892720
[patent_doc_number] => 05777382
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-07
[patent_title] => 'Plastic packaging for a surface mounted integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/769917
[patent_app_country] => US
[patent_app_date] => 1996-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2344
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/777/05777382.pdf
[firstpage_image] =>[orig_patent_app_number] => 769917
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/769917 | Plastic packaging for a surface mounted integrated circuit | Dec 18, 1996 | Issued |
Array
(
[id] => 3745648
[patent_doc_number] => 05753977
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Semiconductor device and lead frame therefor'
[patent_app_type] => 1
[patent_app_number] => 8/768909
[patent_app_country] => US
[patent_app_date] => 1996-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[patent_no_of_words] => 6149
[patent_no_of_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/753/05753977.pdf
[firstpage_image] =>[orig_patent_app_number] => 768909
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/768909 | Semiconductor device and lead frame therefor | Dec 17, 1996 | Issued |
Array
(
[id] => 3668953
[patent_doc_number] => 05668406
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Semiconductor device having shielding structure made of electrically conductive paste'
[patent_app_type] => 1
[patent_app_number] => 8/767635
[patent_app_country] => US
[patent_app_date] => 1996-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/668/05668406.pdf
[firstpage_image] =>[orig_patent_app_number] => 767635
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/767635 | Semiconductor device having shielding structure made of electrically conductive paste | Dec 16, 1996 | Issued |
Array
(
[id] => 3746206
[patent_doc_number] => 05786635
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Electronic package with compressible heatsink structure'
[patent_app_type] => 1
[patent_app_number] => 8/767465
[patent_app_country] => US
[patent_app_date] => 1996-12-16
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/786/05786635.pdf
[firstpage_image] =>[orig_patent_app_number] => 767465
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/767465 | Electronic package with compressible heatsink structure | Dec 15, 1996 | Issued |
Array
(
[id] => 3845608
[patent_doc_number] => 05847466
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Semiconductor device and manufacturing method for the same'
[patent_app_type] => 1
[patent_app_number] => 8/759441
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/847/05847466.pdf
[firstpage_image] =>[orig_patent_app_number] => 759441
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/759441 | Semiconductor device and manufacturing method for the same | Dec 4, 1996 | Issued |
Array
(
[id] => 3933368
[patent_doc_number] => 05877551
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-02
[patent_title] => 'Semiconductor package having a ground or power ring and a metal substrate'
[patent_app_type] => 1
[patent_app_number] => 8/752193
[patent_app_country] => US
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[pdf_file] => patents/05/877/05877551.pdf
[firstpage_image] =>[orig_patent_app_number] => 752193
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/752193 | Semiconductor package having a ground or power ring and a metal substrate | Nov 17, 1996 | Issued |
Array
(
[id] => 3782126
[patent_doc_number] => 05818091
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-06
[patent_title] => 'Semiconductor device with selectively patterned connection pad layer for increasing a contact margin'
[patent_app_type] => 1
[patent_app_number] => 8/747378
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[patent_app_date] => 1996-11-12
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[pdf_file] => patents/05/818/05818091.pdf
[firstpage_image] =>[orig_patent_app_number] => 747378
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/747378 | Semiconductor device with selectively patterned connection pad layer for increasing a contact margin | Nov 11, 1996 | Issued |
Array
(
[id] => 3748179
[patent_doc_number] => 05801429
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-01
[patent_title] => 'Semiconductor device'
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[pdf_file] => patents/05/801/05801429.pdf
[firstpage_image] =>[orig_patent_app_number] => 746415
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/746415 | Semiconductor device | Nov 11, 1996 | Issued |
| 08/745971 | HIGH TOLERANCE CAVITIES IN CHIP PACKAGES | Nov 7, 1996 | Abandoned |
Array
(
[id] => 3874757
[patent_doc_number] => 05838063
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-17
[patent_title] => 'Method of increasing package reliability using package lids with plane CTE gradients'
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[patent_app_number] => 8/744843
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[firstpage_image] =>[orig_patent_app_number] => 744843
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/744843 | Method of increasing package reliability using package lids with plane CTE gradients | Nov 7, 1996 | Issued |
Array
(
[id] => 3950622
[patent_doc_number] => 05990555
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Electronic circuit device with multi-layer wiring'
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[patent_app_number] => 8/733742
[patent_app_country] => US
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[pdf_file] => patents/05/990/05990555.pdf
[firstpage_image] =>[orig_patent_app_number] => 733742
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/733742 | Electronic circuit device with multi-layer wiring | Oct 17, 1996 | Issued |