
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4027328
[patent_doc_number] => 05925933
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-20
[patent_title] => 'Interconnect structure using Al.sub.2 -Cu for an integrated circuit chip'
[patent_app_type] => 1
[patent_app_number] => 8/729561
[patent_app_country] => US
[patent_app_date] => 1996-10-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/925/05925933.pdf
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Array
(
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[patent_doc_number] => 05894160
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[patent_kind] => NA
[patent_issue_date] => 1999-04-13
[patent_title] => 'Method of forming a landing pad structure in an integrated circuit'
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[patent_app_date] => 1996-10-03
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Array
(
[id] => 3878812
[patent_doc_number] => 05763901
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-09
[patent_title] => 'Semiconductor light-emitting device and method for manufacturing the device'
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[patent_app_date] => 1996-10-02
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Array
(
[id] => 4020054
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-09
[patent_title] => 'Circuit isolation utilizing MeV implantation'
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[patent_app_number] => 8/720595
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[patent_app_date] => 1996-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[firstpage_image] =>[orig_patent_app_number] => 720595
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/720595 | Circuit isolation utilizing MeV implantation | Sep 29, 1996 | Issued |
Array
(
[id] => 3780496
[patent_doc_number] => 05808358
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[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Packaging electrical circuits'
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Array
(
[id] => 3987967
[patent_doc_number] => 05861680
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[patent_kind] => NA
[patent_issue_date] => 1999-01-19
[patent_title] => 'Photonic device and process for fabricating the same'
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Array
(
[id] => 3866137
[patent_doc_number] => 05796171
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[patent_kind] => NA
[patent_issue_date] => 1998-08-18
[patent_title] => 'Progressive staggered bonding pads'
[patent_app_type] => 1
[patent_app_number] => 8/712981
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[patent_app_date] => 1996-09-16
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[pdf_file] => patents/05/796/05796171.pdf
[firstpage_image] =>[orig_patent_app_number] => 712981
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Array
(
[id] => 3947989
[patent_doc_number] => 05982042
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Semiconductor wafer including semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/712611
[patent_app_country] => US
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[pdf_file] => patents/05/982/05982042.pdf
[firstpage_image] =>[orig_patent_app_number] => 712611
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/712611 | Semiconductor wafer including semiconductor device | Sep 12, 1996 | Issued |
Array
(
[id] => 4148146
[patent_doc_number] => 06031283
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/708857
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[patent_app_date] => 1996-09-09
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[firstpage_image] =>[orig_patent_app_number] => 708857
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Array
(
[id] => 3862194
[patent_doc_number] => 05705855
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[patent_issue_date] => 1998-01-06
[patent_title] => 'Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/709421
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[pdf_file] => patents/05/705/05705855.pdf
[firstpage_image] =>[orig_patent_app_number] => 709421
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Array
(
[id] => 3788702
[patent_doc_number] => 05821608
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Laterally situated stress/strain relieving lead for a semiconductor chip package'
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Array
(
[id] => 4038914
[patent_doc_number] => 05942804
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[patent_title] => 'Circuit structure having a matrix of active devices'
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Array
(
[id] => 3834972
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Array
(
[id] => 4062321
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[patent_title] => 'Low dielectric constant insulation layer for integrated circuit structure and method of making same'
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Array
(
[id] => 4139718
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Array
(
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Array
(
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Array
(
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Array
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Array
(
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