
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3895785
[patent_doc_number] => 05834799
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-10
[patent_title] => 'Optically transmissive preformed planar structures'
[patent_app_type] => 1
[patent_app_number] => 8/679949
[patent_app_country] => US
[patent_app_date] => 1996-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 36
[patent_no_of_words] => 15304
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/834/05834799.pdf
[firstpage_image] =>[orig_patent_app_number] => 679949
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/679949 | Optically transmissive preformed planar structures | Jul 14, 1996 | Issued |
Array
(
[id] => 3885852
[patent_doc_number] => 05798571
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-25
[patent_title] => 'Inductance reduced wire-bonding type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/674721
[patent_app_country] => US
[patent_app_date] => 1996-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4610
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/798/05798571.pdf
[firstpage_image] =>[orig_patent_app_number] => 674721
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/674721 | Inductance reduced wire-bonding type semiconductor device | Jul 1, 1996 | Issued |
Array
(
[id] => 3780494
[patent_doc_number] => 05757071
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-26
[patent_title] => 'C4 substrate contact pad which has a layer of Ni-B plating'
[patent_app_type] => 1
[patent_app_number] => 8/669619
[patent_app_country] => US
[patent_app_date] => 1996-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 11
[patent_no_of_words] => 1466
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/757/05757071.pdf
[firstpage_image] =>[orig_patent_app_number] => 669619
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/669619 | C4 substrate contact pad which has a layer of Ni-B plating | Jun 23, 1996 | Issued |
Array
(
[id] => 3845526
[patent_doc_number] => 05847461
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer'
[patent_app_type] => 1
[patent_app_number] => 8/664717
[patent_app_country] => US
[patent_app_date] => 1996-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4600
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 218
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/847/05847461.pdf
[firstpage_image] =>[orig_patent_app_number] => 664717
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/664717 | Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer | Jun 16, 1996 | Issued |
Array
(
[id] => 3745537
[patent_doc_number] => 05753971
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Power semiconductor module with terminal pins'
[patent_app_type] => 1
[patent_app_number] => 8/663743
[patent_app_country] => US
[patent_app_date] => 1996-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1101
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/753/05753971.pdf
[firstpage_image] =>[orig_patent_app_number] => 663743
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/663743 | Power semiconductor module with terminal pins | Jun 13, 1996 | Issued |
Array
(
[id] => 3746220
[patent_doc_number] => 05786636
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Semiconductor device and method of fabricating same'
[patent_app_type] => 1
[patent_app_number] => 8/663995
[patent_app_country] => US
[patent_app_date] => 1996-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 12
[patent_no_of_words] => 2657
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/786/05786636.pdf
[firstpage_image] =>[orig_patent_app_number] => 663995
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/663995 | Semiconductor device and method of fabricating same | Jun 13, 1996 | Issued |
Array
(
[id] => 3791105
[patent_doc_number] => 05736782
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-07
[patent_title] => 'Chip card with integrated IR transceiver'
[patent_app_type] => 1
[patent_app_number] => 8/662367
[patent_app_country] => US
[patent_app_date] => 1996-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1411
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/736/05736782.pdf
[firstpage_image] =>[orig_patent_app_number] => 662367
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/662367 | Chip card with integrated IR transceiver | Jun 11, 1996 | Issued |
Array
(
[id] => 3782053
[patent_doc_number] => 05818086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-06
[patent_title] => 'Reinforced ESD protection for NC-pin adjacent input pin'
[patent_app_type] => 1
[patent_app_number] => 8/661659
[patent_app_country] => US
[patent_app_date] => 1996-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 2950
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 209
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/818/05818086.pdf
[firstpage_image] =>[orig_patent_app_number] => 661659
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/661659 | Reinforced ESD protection for NC-pin adjacent input pin | Jun 10, 1996 | Issued |
Array
(
[id] => 3815686
[patent_doc_number] => 05811851
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-22
[patent_title] => 'Pre-oxidizing high-dielectric-constant material electrodes'
[patent_app_type] => 1
[patent_app_number] => 8/661501
[patent_app_country] => US
[patent_app_date] => 1996-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 4190
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/811/05811851.pdf
[firstpage_image] =>[orig_patent_app_number] => 661501
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/661501 | Pre-oxidizing high-dielectric-constant material electrodes | Jun 10, 1996 | Issued |
| 08/661859 | INTEGRATED CIRCUIT PACKAGE | Jun 10, 1996 | Abandoned |
Array
(
[id] => 3998577
[patent_doc_number] => 05892281
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Tantalum-aluminum-nitrogen material for semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/660849
[patent_app_country] => US
[patent_app_date] => 1996-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4469
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 15
[patent_words_short_claim] => 39
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/892/05892281.pdf
[firstpage_image] =>[orig_patent_app_number] => 660849
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/660849 | Tantalum-aluminum-nitrogen material for semiconductor devices | Jun 9, 1996 | Issued |
Array
(
[id] => 3736477
[patent_doc_number] => 05666009
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Wire bonding structure for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/661144
[patent_app_country] => US
[patent_app_date] => 1996-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 3397
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/666/05666009.pdf
[firstpage_image] =>[orig_patent_app_number] => 661144
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/661144 | Wire bonding structure for a semiconductor device | Jun 9, 1996 | Issued |
Array
(
[id] => 3740675
[patent_doc_number] => 05698866
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'Uniform illuminator for phototherapy'
[patent_app_type] => 1
[patent_app_number] => 8/654059
[patent_app_country] => US
[patent_app_date] => 1996-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 23
[patent_no_of_words] => 9633
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/698/05698866.pdf
[firstpage_image] =>[orig_patent_app_number] => 654059
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/654059 | Uniform illuminator for phototherapy | May 27, 1996 | Issued |
Array
(
[id] => 4309986
[patent_doc_number] => 06188137
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-13
[patent_title] => 'Ohmic electrode structure, semiconductor device including such ohmic electrode structure, and method for producing such semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/652303
[patent_app_country] => US
[patent_app_date] => 1996-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 7794
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/188/06188137.pdf
[firstpage_image] =>[orig_patent_app_number] => 652303
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/652303 | Ohmic electrode structure, semiconductor device including such ohmic electrode structure, and method for producing such semiconductor device | May 22, 1996 | Issued |
Array
(
[id] => 3652189
[patent_doc_number] => 05629562
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Conductive contact structure for two conductors'
[patent_app_type] => 1
[patent_app_number] => 8/649473
[patent_app_country] => US
[patent_app_date] => 1996-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 2532
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[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 155
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/629/05629562.pdf
[firstpage_image] =>[orig_patent_app_number] => 649473
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/649473 | Conductive contact structure for two conductors | May 16, 1996 | Issued |
Array
(
[id] => 3831180
[patent_doc_number] => 05783866
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-21
[patent_title] => 'Low cost ball grid array device and method of manufacture thereof'
[patent_app_type] => 1
[patent_app_number] => 8/649395
[patent_app_country] => US
[patent_app_date] => 1996-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/783/05783866.pdf
[firstpage_image] =>[orig_patent_app_number] => 649395
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/649395 | Low cost ball grid array device and method of manufacture thereof | May 16, 1996 | Issued |
Array
(
[id] => 3780523
[patent_doc_number] => 05808360
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Microbump interconnect for bore semiconductor dice'
[patent_app_type] => 1
[patent_app_number] => 8/647749
[patent_app_country] => US
[patent_app_date] => 1996-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/808/05808360.pdf
[firstpage_image] =>[orig_patent_app_number] => 647749
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/647749 | Microbump interconnect for bore semiconductor dice | May 14, 1996 | Issued |
Array
(
[id] => 3799915
[patent_doc_number] => 05780933
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-14
[patent_title] => 'Substrate for semiconductor device and semiconductor device using the same'
[patent_app_type] => 1
[patent_app_number] => 8/644897
[patent_app_country] => US
[patent_app_date] => 1996-05-10
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/780/05780933.pdf
[firstpage_image] =>[orig_patent_app_number] => 644897
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/644897 | Substrate for semiconductor device and semiconductor device using the same | May 9, 1996 | Issued |
Array
(
[id] => 3852982
[patent_doc_number] => 05719444
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-17
[patent_title] => 'Packaging and cooling system for power semi-conductor'
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[patent_app_number] => 8/638985
[patent_app_country] => US
[patent_app_date] => 1996-04-26
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[pdf_file] => patents/05/719/05719444.pdf
[firstpage_image] =>[orig_patent_app_number] => 638985
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/638985 | Packaging and cooling system for power semi-conductor | Apr 25, 1996 | Issued |
Array
(
[id] => 3879563
[patent_doc_number] => 05763954
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-09
[patent_title] => 'Semiconductor device having multilayered metal interconnection structure and manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/639325
[patent_app_country] => US
[patent_app_date] => 1996-04-25
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/763/05763954.pdf
[firstpage_image] =>[orig_patent_app_number] => 639325
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/639325 | Semiconductor device having multilayered metal interconnection structure and manufacturing method thereof | Apr 24, 1996 | Issued |