
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3845788
[patent_doc_number] => 05744868
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-28
[patent_title] => 'Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy'
[patent_app_type] => 1
[patent_app_number] => 8/639275
[patent_app_country] => US
[patent_app_date] => 1996-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3373
[patent_no_of_claims] => 8
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/744/05744868.pdf
[firstpage_image] =>[orig_patent_app_number] => 639275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/639275 | Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy | Apr 24, 1996 | Issued |
Array
(
[id] => 3750616
[patent_doc_number] => 05717232
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-10
[patent_title] => 'Semiconductor device sealed with molded resin'
[patent_app_type] => 1
[patent_app_number] => 8/632836
[patent_app_country] => US
[patent_app_date] => 1996-04-16
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 3542
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[pdf_file] => patents/05/717/05717232.pdf
[firstpage_image] =>[orig_patent_app_number] => 632836
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/632836 | Semiconductor device sealed with molded resin | Apr 15, 1996 | Issued |
Array
(
[id] => 3904043
[patent_doc_number] => 05751059
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-12
[patent_title] => 'Pyroelectric sensor'
[patent_app_type] => 1
[patent_app_number] => 8/631816
[patent_app_country] => US
[patent_app_date] => 1996-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/05/751/05751059.pdf
[firstpage_image] =>[orig_patent_app_number] => 631816
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/631816 | Pyroelectric sensor | Apr 11, 1996 | Issued |
Array
(
[id] => 3745522
[patent_doc_number] => 05753970
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'System having semiconductor die mounted in die-receiving area having different shape than die'
[patent_app_type] => 1
[patent_app_number] => 8/626467
[patent_app_country] => US
[patent_app_date] => 1996-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/626467 | System having semiconductor die mounted in die-receiving area having different shape than die | Apr 1, 1996 | Issued |
Array
(
[id] => 3998724
[patent_doc_number] => 05892292
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Getterer for multi-layer wafers and method for making same'
[patent_app_type] => 1
[patent_app_number] => 8/624050
[patent_app_country] => US
[patent_app_date] => 1996-03-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/892/05892292.pdf
[firstpage_image] =>[orig_patent_app_number] => 624050
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/624050 | Getterer for multi-layer wafers and method for making same | Mar 28, 1996 | Issued |
Array
(
[id] => 1441971
[patent_doc_number] => 06335549
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-01
[patent_title] => 'EEPROM with high channel hot carrier injection efficiency'
[patent_app_type] => B1
[patent_app_number] => 08/622327
[patent_app_country] => US
[patent_app_date] => 1996-03-26
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[pdf_file] => patents/06/335/06335549.pdf
[firstpage_image] =>[orig_patent_app_number] => 08622327
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/622327 | EEPROM with high channel hot carrier injection efficiency | Mar 25, 1996 | Issued |
Array
(
[id] => 3866043
[patent_doc_number] => 05796164
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[patent_kind] => NA
[patent_issue_date] => 1998-08-18
[patent_title] => 'Packaging and interconnect system for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/621563
[patent_app_country] => US
[patent_app_date] => 1996-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/05/796/05796164.pdf
[firstpage_image] =>[orig_patent_app_number] => 621563
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/621563 | Packaging and interconnect system for integrated circuits | Mar 24, 1996 | Issued |
Array
(
[id] => 4108819
[patent_doc_number] => 06100596
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-08
[patent_title] => 'Connectorized substrate and method of connectorizing a substrate'
[patent_app_type] => 1
[patent_app_number] => 8/616471
[patent_app_country] => US
[patent_app_date] => 1996-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/100/06100596.pdf
[firstpage_image] =>[orig_patent_app_number] => 616471
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/616471 | Connectorized substrate and method of connectorizing a substrate | Mar 18, 1996 | Issued |
Array
(
[id] => 3765881
[patent_doc_number] => 05742098
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-21
[patent_title] => 'Semiconductor component with plastic sheath and method for producing the same'
[patent_app_type] => 1
[patent_app_number] => 8/616319
[patent_app_country] => US
[patent_app_date] => 1996-03-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/742/05742098.pdf
[firstpage_image] =>[orig_patent_app_number] => 616319
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/616319 | Semiconductor component with plastic sheath and method for producing the same | Mar 14, 1996 | Issued |
Array
(
[id] => 4054572
[patent_doc_number] => 05869902
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[patent_kind] => NA
[patent_issue_date] => 1999-02-09
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/612792
[patent_app_country] => US
[patent_app_date] => 1996-03-11
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[pdf_file] => patents/05/869/05869902.pdf
[firstpage_image] =>[orig_patent_app_number] => 612792
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Array
(
[id] => 3692179
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Array
(
[id] => 4123803
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[patent_title] => 'Micromachined chip scale package'
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Array
(
[id] => 3865065
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[patent_title] => 'Semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/608565 | Semiconductor device | Feb 27, 1996 | Issued |
Array
(
[id] => 4080681
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[patent_issue_date] => 1999-10-12
[patent_title] => 'Semiconductor device having doubled pads'
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[firstpage_image] =>[orig_patent_app_number] => 607233
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/607233 | Semiconductor device having doubled pads | Feb 25, 1996 | Issued |
Array
(
[id] => 3748277
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/607213 | Resin-sealed semiconductor device | Feb 25, 1996 | Issued |
Array
(
[id] => 3953370
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[patent_issue_date] => 1999-12-07
[patent_title] => 'Radiation enhanced chip encapsulant'
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[firstpage_image] =>[orig_patent_app_number] => 606125
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/606125 | Radiation enhanced chip encapsulant | Feb 22, 1996 | Issued |
Array
(
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Array
(
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 600261
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/600261 | Resin-sealed type semiconductor device | Feb 11, 1996 | Issued |