| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[patent_doc_number] => 05801440
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[patent_kind] => NA
[patent_issue_date] => 1998-09-01
[patent_title] => 'Chip package board having utility rings'
[patent_app_type] => 1
[patent_app_number] => 8/541423
[patent_app_country] => US
[patent_app_date] => 1995-10-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/541423 | Chip package board having utility rings | Oct 9, 1995 | Issued |
| 08/536155 | METAL STACK FOR INTEGRATED CIRCUIT HAVING TWO THIN LAYERS OF TITANIUM WITH DEDICATED CHAMBER DEPOSITIONS | Sep 28, 1995 | Abandoned |
| 08/534124 | COATED SEMICONDUCTOR DIE/LEADFRAME ASSEMBLY AND METHOD FOR COATING THE ASSEMBLY | Sep 25, 1995 | Abandoned |
Array
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[patent_doc_number] => 05541446
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[patent_kind] => NA
[patent_issue_date] => 1996-07-30
[patent_title] => 'Integrated circuit package with improved heat dissipation'
[patent_app_type] => 1
[patent_app_number] => 8/534095
[patent_app_country] => US
[patent_app_date] => 1995-09-26
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[firstpage_image] =>[orig_patent_app_number] => 534095
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/534095 | Integrated circuit package with improved heat dissipation | Sep 25, 1995 | Issued |
| 08/525071 | MULTICOLOR LIGHT EMITTING DEVICE | Sep 7, 1995 | Abandoned |
Array
(
[id] => 3745604
[patent_doc_number] => 05753974
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Electronic device assembly'
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[patent_app_number] => 8/521837
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[patent_app_date] => 1995-08-31
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Array
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[patent_doc_number] => 05668404
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Semiconductor device and production method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/520229
[patent_app_country] => US
[patent_app_date] => 1995-08-28
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[firstpage_image] =>[orig_patent_app_number] => 520229
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Array
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Array
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Array
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[firstpage_image] =>[orig_patent_app_number] => 516645
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/516645 | Semiconductor assemblies with reinforced peripheral regions | Aug 17, 1995 | Issued |
Array
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[id] => 3629992
[patent_doc_number] => 05621244
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[patent_kind] => NA
[patent_issue_date] => 1997-04-15
[patent_title] => 'Fin assembly for an integrated circuit'
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[patent_app_number] => 8/515942
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[pdf_file] => patents/05/621/05621244.pdf
[firstpage_image] =>[orig_patent_app_number] => 515942
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/515942 | Fin assembly for an integrated circuit | Aug 15, 1995 | Issued |
Array
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[id] => 3730027
[patent_doc_number] => 05701035
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[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Electrode structure and method for fabricating the same'
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[firstpage_image] =>[orig_patent_app_number] => 504101
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Array
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[id] => 4022301
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[patent_kind] => NA
[patent_issue_date] => 1999-05-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/502587 | Electronic component and electronic component connecting structure | Jul 13, 1995 | Issued |
Array
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[firstpage_image] =>[orig_patent_app_number] => 501331
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/501331 | Hybrid multichip module and methods of fabricating same | Jul 11, 1995 | Issued |
Array
(
[id] => 3496479
[patent_doc_number] => 05536969
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-16
[patent_title] => 'IC carrier'
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[firstpage_image] =>[orig_patent_app_number] => 495299
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/495299 | IC carrier | Jun 27, 1995 | Issued |
| 08/495832 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE DEVICE | Jun 27, 1995 | Abandoned |
Array
(
[id] => 3586253
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[firstpage_image] =>[orig_patent_app_number] => 493945
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/493945 | Electronic surface mount device | Jun 22, 1995 | Issued |
Array
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Array
(
[id] => 3654484
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/493427 | Resin-sealed semiconductor device | Jun 21, 1995 | Issued |
Array
(
[id] => 3556666
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