| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3559425
[patent_doc_number] => 05543664
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-06
[patent_title] => 'Ultra high density integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/375747
[patent_app_country] => US
[patent_app_date] => 1995-01-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 30
[patent_no_of_words] => 7757
[patent_no_of_claims] => 11
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[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/543/05543664.pdf
[firstpage_image] =>[orig_patent_app_number] => 375747
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/375747 | Ultra high density integrated circuit package | Jan 19, 1995 | Issued |
| 08/375105 | ZIRCONIA-ADDED ALUMINA SUBSTRATE WITH DIRECT BONDING OF COPPER | Jan 18, 1995 | Abandoned |
Array
(
[id] => 3668604
[patent_doc_number] => 05598021
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-28
[patent_title] => 'MOS structure with hot carrier reduction'
[patent_app_type] => 1
[patent_app_number] => 8/374195
[patent_app_country] => US
[patent_app_date] => 1995-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 3325
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/598/05598021.pdf
[firstpage_image] =>[orig_patent_app_number] => 374195
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/374195 | MOS structure with hot carrier reduction | Jan 17, 1995 | Issued |
| 08/372481 | INTEGRATED CIRCUIT FOR DIRECTLY ATTACHING TO A GLASS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | Jan 12, 1995 | Abandoned |
Array
(
[id] => 3698605
[patent_doc_number] => 05679976
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-21
[patent_title] => 'Molded electric parts and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/367191
[patent_app_country] => US
[patent_app_date] => 1995-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 16
[patent_no_of_words] => 3934
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/679/05679976.pdf
[firstpage_image] =>[orig_patent_app_number] => 367191
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367191 | Molded electric parts and method of manufacturing the same | Jan 12, 1995 | Issued |
Array
(
[id] => 3602937
[patent_doc_number] => 05559371
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-24
[patent_title] => 'Arrangement for premounting disk-shaped cell semiconductors contactable by pressure'
[patent_app_type] => 1
[patent_app_number] => 8/367295
[patent_app_country] => US
[patent_app_date] => 1995-01-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1303
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 185
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/559/05559371.pdf
[firstpage_image] =>[orig_patent_app_number] => 367295
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367295 | Arrangement for premounting disk-shaped cell semiconductors contactable by pressure | Jan 11, 1995 | Issued |
Array
(
[id] => 3521398
[patent_doc_number] => 05506424
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-09
[patent_title] => 'Spherical bearing optical mount'
[patent_app_type] => 1
[patent_app_number] => 8/369417
[patent_app_country] => US
[patent_app_date] => 1995-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 3074
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 173
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/506/05506424.pdf
[firstpage_image] =>[orig_patent_app_number] => 369417
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/369417 | Spherical bearing optical mount | Jan 5, 1995 | Issued |
Array
(
[id] => 3565738
[patent_doc_number] => 05525839
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Method of packing an IC die in a molded plastic employing an ultra-thin die coating process'
[patent_app_type] => 1
[patent_app_number] => 8/366699
[patent_app_country] => US
[patent_app_date] => 1994-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 3328
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 103
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/525/05525839.pdf
[firstpage_image] =>[orig_patent_app_number] => 366699
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/366699 | Method of packing an IC die in a molded plastic employing an ultra-thin die coating process | Dec 29, 1994 | Issued |
Array
(
[id] => 3741123
[patent_doc_number] => 05698896
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head'
[patent_app_type] => 1
[patent_app_number] => 8/364195
[patent_app_country] => US
[patent_app_date] => 1994-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 21
[patent_no_of_words] => 15768
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 15
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/698/05698896.pdf
[firstpage_image] =>[orig_patent_app_number] => 364195
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/364195 | High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head | Dec 26, 1994 | Issued |
Array
(
[id] => 3633331
[patent_doc_number] => 05686757
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-11
[patent_title] => 'Film carrier tape for use in tape automated bonding'
[patent_app_type] => 1
[patent_app_number] => 8/364551
[patent_app_country] => US
[patent_app_date] => 1994-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 2553
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/686/05686757.pdf
[firstpage_image] =>[orig_patent_app_number] => 364551
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/364551 | Film carrier tape for use in tape automated bonding | Dec 26, 1994 | Issued |
Array
(
[id] => 3594299
[patent_doc_number] => 05585667
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-17
[patent_title] => 'Lead frame for handling crossing bonding wires'
[patent_app_type] => 1
[patent_app_number] => 8/363399
[patent_app_country] => US
[patent_app_date] => 1994-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3036
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 4
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/585/05585667.pdf
[firstpage_image] =>[orig_patent_app_number] => 363399
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/363399 | Lead frame for handling crossing bonding wires | Dec 22, 1994 | Issued |
Array
(
[id] => 3733183
[patent_doc_number] => 05670824
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-23
[patent_title] => 'Vertically integrated component assembly incorporating active and passive components'
[patent_app_type] => 1
[patent_app_number] => 8/363426
[patent_app_country] => US
[patent_app_date] => 1994-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 4126
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/670/05670824.pdf
[firstpage_image] =>[orig_patent_app_number] => 363426
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/363426 | Vertically integrated component assembly incorporating active and passive components | Dec 21, 1994 | Issued |
| 08/361145 | INTEGRATED CIRCUIT PACKAGE | Dec 20, 1994 | Abandoned |
Array
(
[id] => 3734855
[patent_doc_number] => 05635738
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-03
[patent_title] => 'Infrared solid-state image sensing apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/360079
[patent_app_country] => US
[patent_app_date] => 1994-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 42
[patent_no_of_words] => 16876
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/635/05635738.pdf
[firstpage_image] =>[orig_patent_app_number] => 360079
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/360079 | Infrared solid-state image sensing apparatus | Dec 19, 1994 | Issued |
Array
(
[id] => 3653444
[patent_doc_number] => 05640053
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-17
[patent_title] => 'Inverse open frame alignment mark and method of fabrication'
[patent_app_type] => 1
[patent_app_number] => 8/354631
[patent_app_country] => US
[patent_app_date] => 1994-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 21
[patent_no_of_words] => 5823
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/640/05640053.pdf
[firstpage_image] =>[orig_patent_app_number] => 354631
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/354631 | Inverse open frame alignment mark and method of fabrication | Dec 12, 1994 | Issued |
| 08/353439 | METHOD FOR DIRECT ATTACHMENT OF AN ON-CHIP BYPASS CAPACITOR IN AN INTEGRATED CIRCUIT | Dec 8, 1994 | Abandoned |
| 08/350665 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | Dec 6, 1994 | Abandoned |
| 08/342491 | MICROELECTRONIC PACKAGE COMPRISING TIN-COPPER SOLDER BUMP INTERCONNECTIONS, AND METHOD FOR FORMING SAME | Nov 20, 1994 | Abandoned |
Array
(
[id] => 3542190
[patent_doc_number] => 05495125
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-02-27
[patent_title] => 'Molded semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/343971
[patent_app_country] => US
[patent_app_date] => 1994-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/495/05495125.pdf
[firstpage_image] =>[orig_patent_app_number] => 343971
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/343971 | Molded semiconductor device | Nov 17, 1994 | Issued |
Array
(
[id] => 3498832
[patent_doc_number] => 05508560
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-16
[patent_title] => 'Semiconductor module'
[patent_app_type] => 1
[patent_app_number] => 8/336319
[patent_app_country] => US
[patent_app_date] => 1994-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1246
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[pdf_file] => patents/05/508/05508560.pdf
[firstpage_image] =>[orig_patent_app_number] => 336319
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/336319 | Semiconductor module | Nov 7, 1994 | Issued |