| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3616511
[patent_doc_number] => 05565707
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-15
[patent_title] => 'Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip'
[patent_app_type] => 1
[patent_app_number] => 8/332328
[patent_app_country] => US
[patent_app_date] => 1994-10-31
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/565/05565707.pdf
[firstpage_image] =>[orig_patent_app_number] => 332328
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/332328 | Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip | Oct 30, 1994 | Issued |
Array
(
[id] => 3616955
[patent_doc_number] => 05534731
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-09
[patent_title] => 'Layered low dielectric constant technology'
[patent_app_type] => 1
[patent_app_number] => 8/330871
[patent_app_country] => US
[patent_app_date] => 1994-10-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/534/05534731.pdf
[firstpage_image] =>[orig_patent_app_number] => 330871
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/330871 | Layered low dielectric constant technology | Oct 27, 1994 | Issued |
Array
(
[id] => 3557696
[patent_doc_number] => 05574313
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-12
[patent_title] => 'Hermetically sealed microwave integrated circuit package with ground plane fused to package frame'
[patent_app_type] => 1
[patent_app_number] => 8/324473
[patent_app_country] => US
[patent_app_date] => 1994-10-17
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/574/05574313.pdf
[firstpage_image] =>[orig_patent_app_number] => 324473
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/324473 | Hermetically sealed microwave integrated circuit package with ground plane fused to package frame | Oct 16, 1994 | Issued |
Array
(
[id] => 3565655
[patent_doc_number] => 05525834
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/323985
[patent_app_country] => US
[patent_app_date] => 1994-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_claims] => 26
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[pdf_file] => patents/05/525/05525834.pdf
[firstpage_image] =>[orig_patent_app_number] => 323985
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/323985 | Integrated circuit package | Oct 16, 1994 | Issued |
Array
(
[id] => 3491690
[patent_doc_number] => 05475254
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-12
[patent_title] => 'Semiconductor device with thin film resistor'
[patent_app_type] => 1
[patent_app_number] => 8/323107
[patent_app_country] => US
[patent_app_date] => 1994-10-14
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[pdf_file] => patents/05/475/05475254.pdf
[firstpage_image] =>[orig_patent_app_number] => 323107
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/323107 | Semiconductor device with thin film resistor | Oct 13, 1994 | Issued |
Array
(
[id] => 3529104
[patent_doc_number] => 05528070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-18
[patent_title] => 'Semiconductor sensor manufactured through anodic-bonding process'
[patent_app_type] => 1
[patent_app_number] => 8/321829
[patent_app_country] => US
[patent_app_date] => 1994-10-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/528/05528070.pdf
[firstpage_image] =>[orig_patent_app_number] => 321829
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/321829 | Semiconductor sensor manufactured through anodic-bonding process | Oct 5, 1994 | Issued |
Array
(
[id] => 3447197
[patent_doc_number] => 05466969
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-14
[patent_title] => 'Intelligent power device module'
[patent_app_type] => 1
[patent_app_number] => 8/314626
[patent_app_country] => US
[patent_app_date] => 1994-09-29
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/466/05466969.pdf
[firstpage_image] =>[orig_patent_app_number] => 314626
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/314626 | Intelligent power device module | Sep 28, 1994 | Issued |
Array
(
[id] => 3651805
[patent_doc_number] => 05637913
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-10
[patent_title] => 'Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two'
[patent_app_type] => 1
[patent_app_number] => 8/311021
[patent_app_country] => US
[patent_app_date] => 1994-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
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[patent_no_of_words] => 6403
[patent_no_of_claims] => 14
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[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/637/05637913.pdf
[firstpage_image] =>[orig_patent_app_number] => 311021
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/311021 | Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two | Sep 21, 1994 | Issued |
Array
(
[id] => 3568196
[patent_doc_number] => 05483095
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-09
[patent_title] => 'Optical semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/308254
[patent_app_country] => US
[patent_app_date] => 1994-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4219
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/483/05483095.pdf
[firstpage_image] =>[orig_patent_app_number] => 308254
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/308254 | Optical semiconductor device | Sep 18, 1994 | Issued |
| 08/308739 | SURFACE MOUNT PACKAGE WITH IMPROVED HEAT TRANSFER | Sep 18, 1994 | Abandoned |
| 08/302953 | FILM CARRIER TAPE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE EMPLOYING SAME | Sep 11, 1994 | Abandoned |
Array
(
[id] => 3518063
[patent_doc_number] => 05512780
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-30
[patent_title] => 'Inorganic chip-to-package interconnection circuit'
[patent_app_type] => 1
[patent_app_number] => 8/303466
[patent_app_country] => US
[patent_app_date] => 1994-09-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2589
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/512/05512780.pdf
[firstpage_image] =>[orig_patent_app_number] => 303466
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/303466 | Inorganic chip-to-package interconnection circuit | Sep 8, 1994 | Issued |
Array
(
[id] => 3580026
[patent_doc_number] => 05523626
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-04
[patent_title] => 'Semiconductor device and fabrication process therefor'
[patent_app_type] => 1
[patent_app_number] => 8/301621
[patent_app_country] => US
[patent_app_date] => 1994-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/523/05523626.pdf
[firstpage_image] =>[orig_patent_app_number] => 301621
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/301621 | Semiconductor device and fabrication process therefor | Sep 6, 1994 | Issued |
Array
(
[id] => 3525780
[patent_doc_number] => 05489800
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-02-06
[patent_title] => 'Dual channel small outline optocoupler package and method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/298697
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[patent_app_date] => 1994-08-31
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[pdf_file] => patents/05/489/05489800.pdf
[firstpage_image] =>[orig_patent_app_number] => 298697
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/298697 | Dual channel small outline optocoupler package and method thereof | Aug 30, 1994 | Issued |
Array
(
[id] => 3568253
[patent_doc_number] => 05483099
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-09
[patent_title] => 'Standardized power and ground design for pin grid array packages'
[patent_app_type] => 1
[patent_app_number] => 8/298925
[patent_app_country] => US
[patent_app_date] => 1994-08-31
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/483/05483099.pdf
[firstpage_image] =>[orig_patent_app_number] => 298925
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/298925 | Standardized power and ground design for pin grid array packages | Aug 30, 1994 | Issued |
| 08/297489 | INTEGRATED CIRCUIT PACKAGE WITH IMPROVED HEAT DISSIPATION | Aug 28, 1994 | Abandoned |
Array
(
[id] => 3694162
[patent_doc_number] => 05604365
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-18
[patent_title] => 'Semiconductor integrated circuit device and a manufacturing method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/297039
[patent_app_country] => US
[patent_app_date] => 1994-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 33
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[pdf_file] => patents/05/604/05604365.pdf
[firstpage_image] =>[orig_patent_app_number] => 297039
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/297039 | Semiconductor integrated circuit device and a manufacturing method thereof | Aug 28, 1994 | Issued |
| 08/295535 | PACKAGING MATERIAL FOR ELECTRONIC COMPONENTS | Aug 24, 1994 | Abandoned |
Array
(
[id] => 3585775
[patent_doc_number] => 05498901
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-12
[patent_title] => 'Lead frame having layered conductive planes'
[patent_app_type] => 1
[patent_app_number] => 8/294323
[patent_app_country] => US
[patent_app_date] => 1994-08-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/498/05498901.pdf
[firstpage_image] =>[orig_patent_app_number] => 294323
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/294323 | Lead frame having layered conductive planes | Aug 22, 1994 | Issued |
Array
(
[id] => 3119391
[patent_doc_number] => 05410178
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-25
[patent_title] => 'Semiconductor films'
[patent_app_type] => 1
[patent_app_number] => 8/293903
[patent_app_country] => US
[patent_app_date] => 1994-08-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/410/05410178.pdf
[firstpage_image] =>[orig_patent_app_number] => 293903
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/293903 | Semiconductor films | Aug 21, 1994 | Issued |