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Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163
Applications
StatisticsSubscription-Only

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3624290 [patent_doc_number] => 05614732 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-03-25 [patent_title] => 'Gate insulated field effect transistors and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/293201 [patent_app_country] => US [patent_app_date] => 1994-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 27 [patent_no_of_words] => 8726 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/614/05614732.pdf [firstpage_image] =>[orig_patent_app_number] => 293201 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/293201 		Gate insulated field effect transistors and method of manufacturing the same Aug 18, 1994 Issued
Array ( [id] => 3862116 [patent_doc_number] => 05705850 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-06 [patent_title] => 'Semiconductor module' [patent_app_type] => 1 [patent_app_number] => 8/290155 [patent_app_country] => US [patent_app_date] => 1994-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 6216 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/705/05705850.pdf [firstpage_image] =>[orig_patent_app_number] => 290155 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/290155 		Semiconductor module Aug 14, 1994 Issued
08/283160 BALL LIMITING METALIZATION PROCESS FOR INTERCONNECTION Aug 2, 1994 Abandoned
Array ( [id] => 3626231 [patent_doc_number] => 05689136 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-18 [patent_title] => 'Semiconductor device and fabrication method' [patent_app_type] => 1 [patent_app_number] => 8/280935 [patent_app_country] => US [patent_app_date] => 1994-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 31 [patent_no_of_words] => 7533 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/689/05689136.pdf [firstpage_image] =>[orig_patent_app_number] => 280935 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/280935 		Semiconductor device and fabrication method Jul 26, 1994 Issued
08/280615 SEMICONDUCTOR DEVICE SEALED WITH MOLDED RESIN Jul 25, 1994 Abandoned
Array ( [id] => 3464031 [patent_doc_number] => 05442241 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-15 [patent_title] => 'Bump electrode structure to be coupled to lead wire in semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/278759 [patent_app_country] => US [patent_app_date] => 1994-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 958 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/442/05442241.pdf [firstpage_image] =>[orig_patent_app_number] => 278759 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/278759 		Bump electrode structure to be coupled to lead wire in semiconductor device Jul 21, 1994 Issued
Array ( [id] => 3106510 [patent_doc_number] => 05448111 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-09-05 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => 1 [patent_app_number] => 8/278953 [patent_app_country] => US [patent_app_date] => 1994-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 40 [patent_no_of_words] => 7278 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/448/05448111.pdf [firstpage_image] =>[orig_patent_app_number] => 278953 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/278953 		Semiconductor device and method for fabricating the same Jul 21, 1994 Issued
08/273323 SEMICONDUCTOR DEVICE, LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES Jul 10, 1994 Abandoned
08/265592 OPTICAL TRANSCEIVER MODULE Jun 23, 1994 Abandoned
08/264365 MULTICOLOR LIGHT EMITTING DEVICE Jun 22, 1994 Abandoned
Array ( [id] => 3416710 [patent_doc_number] => 05444301 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-22 [patent_title] => 'Semiconductor package and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/260571 [patent_app_country] => US [patent_app_date] => 1994-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1990 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/444/05444301.pdf [firstpage_image] =>[orig_patent_app_number] => 260571 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/260571 		Semiconductor package and method for manufacturing the same Jun 15, 1994 Issued
08/258829 SEMICONDUCTOR DEVICE Jun 12, 1994 Abandoned
Array ( [id] => 3736087 [patent_doc_number] => 05665980 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-09 [patent_title] => 'Fabrication method of superconducting quantum interference device constructed from short weak links with ultrafine metallic wires' [patent_app_type] => 1 [patent_app_number] => 8/259156 [patent_app_country] => US [patent_app_date] => 1994-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 3567 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/665/05665980.pdf [firstpage_image] =>[orig_patent_app_number] => 259156 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/259156 		Fabrication method of superconducting quantum interference device constructed from short weak links with ultrafine metallic wires Jun 12, 1994 Issued
08/257033 SEMICONDUCTOR DEVICE HAVING UPPER AND LOWER PACKAGE BODIES AND MANUFACTURING METHOD THEREOF Jun 7, 1994 Abandoned
Array ( [id] => 3802218 [patent_doc_number] => 05828126 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-27 [patent_title] => 'Chip on board package with top and bottom terminals' [patent_app_type] => 1 [patent_app_number] => 8/254143 [patent_app_country] => US [patent_app_date] => 1994-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 4353 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 223 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/828/05828126.pdf [firstpage_image] =>[orig_patent_app_number] => 254143 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/254143 		Chip on board package with top and bottom terminals Jun 5, 1994 Issued
08/253657 GETTERER FOR MULTI-LAYER WAFERS Jun 2, 1994 Abandoned
Array ( [id] => 3592239 [patent_doc_number] => 05550403 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-08-27 [patent_title] => 'Improved laminate package for an integrated circuit and integrated circuit having such a package' [patent_app_type] => 1 [patent_app_number] => 8/252692 [patent_app_country] => US [patent_app_date] => 1994-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4756 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/550/05550403.pdf [firstpage_image] =>[orig_patent_app_number] => 252692 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/252692 		Improved laminate package for an integrated circuit and integrated circuit having such a package Jun 1, 1994 Issued
08/252777 RESIN ENCAPSULATED SEMICONDUCTOR DEVICE WITH PROJECTING ELECTRODES Jun 1, 1994 Abandoned
08/251879 SEMICONDUCTOR STRUCTURES AND METHOD OF MANUFACTURING May 31, 1994 Abandoned
08/251433 ELECTRONIC SURFACE MOUNT DEVICE May 30, 1994 Abandoned
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