Jasmine Jhihan B. Clark

Array ( [id] => 16528852 [patent_doc_number] => 20200402933 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-24 [patent_title] => PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS OF FORMING PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION [patent_app_type] => utility [patent_app_number] => 17/010479 [patent_app_country] => US [patent_app_date] => 2020-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10737 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17010479 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16528871 [patent_doc_number] => 20200402952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-24 [patent_title] => SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTROMAGNETIC SHIELDING CHARACTERISTICS [patent_app_type] => utility [patent_app_number] => 17/009886 [patent_app_country] => US [patent_app_date] => 2020-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9931 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17009886 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18054075 [patent_doc_number] => 11527469 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-13 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/007532 [patent_app_country] => US [patent_app_date] => 2020-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4103 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17007532 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17448276 [patent_doc_number] => 20220068781 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-03 [patent_title] => WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/006688 [patent_app_country] => US [patent_app_date] => 2020-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12004 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17006688 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16516043 [patent_doc_number] => 20200395301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-17 [patent_title] => MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES CONNECTED WITH A MICROELECTRONIC BRIDGE EMBEDDED IN A MICROELECTRONIC SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/005002 [patent_app_country] => US [patent_app_date] => 2020-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6159 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 240 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17005002 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18000946 [patent_doc_number] => 11502057 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-15 [patent_title] => Semiconductor device and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/005186 [patent_app_country] => US [patent_app_date] => 2020-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 23 [patent_no_of_words] => 8665 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17005186 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17925898 [patent_doc_number] => 11469161 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-10-11 [patent_title] => Lead frame-based semiconductor package [patent_app_type] => utility [patent_app_number] => 17/004070 [patent_app_country] => US [patent_app_date] => 2020-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 5631 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17004070 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16765543 [patent_doc_number] => 20210111125 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-04-15 [patent_title] => MULTI-CHIP PACKAGE AND MANUFACTURE METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/005310 [patent_app_country] => US [patent_app_date] => 2020-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17005310 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17623236 [patent_doc_number] => 11342300 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-24 [patent_title] => Electronic device and manufacturing method thereof and manufacturing method of driver IC [patent_app_type] => utility [patent_app_number] => 17/001701 [patent_app_country] => US [patent_app_date] => 2020-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 30 [patent_no_of_words] => 5569 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17001701 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17862894 [patent_doc_number] => 11444055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-09-13 [patent_title] => Manufacturing method of semiconductor apparatus and semiconductor apparatus [patent_app_type] => utility [patent_app_number] => 17/002189 [patent_app_country] => US [patent_app_date] => 2020-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 22 [patent_no_of_words] => 9271 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17002189 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17803499 [patent_doc_number] => 11417812 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-16 [patent_title] => Semiconductor light emitting device [patent_app_type] => utility [patent_app_number] => 16/997626 [patent_app_country] => US [patent_app_date] => 2020-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 21808 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 299 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16997626 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17745682 [patent_doc_number] => 11393764 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-19 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 16/994139 [patent_app_country] => US [patent_app_date] => 2020-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 10314 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16994139 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16959140 [patent_doc_number] => 11063023 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-07-13 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 16/992972 [patent_app_country] => US [patent_app_date] => 2020-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6182 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16992972 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16796138 [patent_doc_number] => 20210125955 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-04-29 [patent_title] => STACKED SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 16/992895 [patent_app_country] => US [patent_app_date] => 2020-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13926 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16992895 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18331799 [patent_doc_number] => 11637055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-25 [patent_title] => Semiconductor device package [patent_app_type] => utility [patent_app_number] => 16/984120 [patent_app_country] => US [patent_app_date] => 2020-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 43 [patent_no_of_words] => 7191 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16984120 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17878574 [patent_doc_number] => 11450598 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-09-20 [patent_title] => Package including a substrate with high resolution rectangular cross-section interconnects [patent_app_type] => utility [patent_app_number] => 16/941472 [patent_app_country] => US [patent_app_date] => 2020-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 27 [patent_no_of_words] => 15393 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16941472 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18088586 [patent_doc_number] => 11538725 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-27 [patent_title] => Semiconductor module arrangement [patent_app_type] => utility [patent_app_number] => 16/937701 [patent_app_country] => US [patent_app_date] => 2020-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 7140 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16937701 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18874764 [patent_doc_number] => 11862587 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-02 [patent_title] => Semiconductor package structure and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/937493 [patent_app_country] => US [patent_app_date] => 2020-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 41 [patent_figures_cnt] => 65 [patent_no_of_words] => 12116 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16937493 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18190687 [patent_doc_number] => 11581289 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-14 [patent_title] => Multi-chip package [patent_app_type] => utility [patent_app_number] => 16/935081 [patent_app_country] => US [patent_app_date] => 2020-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5325 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16935081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18000961 [patent_doc_number] => 11502072 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-15 [patent_title] => Integrated circuit package and method [patent_app_type] => utility [patent_app_number] => 16/934870 [patent_app_country] => US [patent_app_date] => 2020-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 8228 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16934870 [rel_patent_id] =>[rel_patent_doc_number] =>)