
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 17825805
[patent_doc_number] => 11430760
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-08-30
[patent_title] => Chip package device
[patent_app_type] => utility
[patent_app_number] => 16/931819
[patent_app_country] => US
[patent_app_date] => 2020-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3766
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 128
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16931819
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/931819 | Chip package device | Jul 16, 2020 | Issued |
Array
(
[id] => 17529895
[patent_doc_number] => 11302593
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-04-12
[patent_title] => Electronic component package and method for manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/928090
[patent_app_country] => US
[patent_app_date] => 2020-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 37
[patent_no_of_words] => 8355
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 218
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16928090
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/928090 | Electronic component package and method for manufacturing the same | Jul 13, 2020 | Issued |
Array
(
[id] => 17347100
[patent_doc_number] => 20220013431
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-13
[patent_title] => AUTOMOTIVE POWER DEVICES ON DIRECT BOND COPPER EMBEDDED IN PCB DRIVER BOARDS
[patent_app_type] => utility
[patent_app_number] => 16/925953
[patent_app_country] => US
[patent_app_date] => 2020-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5441
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 154
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16925953
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/925953 | Automotive power devices on direct bond copper embedded in PCB driver boards | Jul 9, 2020 | Issued |
Array
(
[id] => 17818611
[patent_doc_number] => 11424235
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-08-23
[patent_title] => Interposer-less multi-chip module
[patent_app_type] => utility
[patent_app_number] => 16/925133
[patent_app_country] => US
[patent_app_date] => 2020-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 14
[patent_no_of_words] => 4643
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 37
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16925133
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/925133 | Interposer-less multi-chip module | Jul 8, 2020 | Issued |
Array
(
[id] => 17574161
[patent_doc_number] => 11322435
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-05-03
[patent_title] => Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same
[patent_app_type] => utility
[patent_app_number] => 16/924736
[patent_app_country] => US
[patent_app_date] => 2020-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 7333
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16924736
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/924736 | Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same | Jul 8, 2020 | Issued |
Array
(
[id] => 16896332
[patent_doc_number] => 11037894
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-06-15
[patent_title] => Semiconductor device having metal bump and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/923406
[patent_app_country] => US
[patent_app_date] => 2020-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 23
[patent_no_of_words] => 6006
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16923406
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/923406 | Semiconductor device having metal bump and method of manufacturing the same | Jul 7, 2020 | Issued |
Array
(
[id] => 19488793
[patent_doc_number] => 12108536
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-01
[patent_title] => Inspection apparatus and component mounting system having the same
[patent_app_type] => utility
[patent_app_number] => 16/919726
[patent_app_country] => US
[patent_app_date] => 2020-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 5626
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 189
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16919726
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/919726 | Inspection apparatus and component mounting system having the same | Jul 1, 2020 | Issued |
Array
(
[id] => 17152531
[patent_doc_number] => 11145622
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-10-12
[patent_title] => Discrete polymer in fan-out packages
[patent_app_type] => utility
[patent_app_number] => 16/915425
[patent_app_country] => US
[patent_app_date] => 2020-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 5421
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16915425
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/915425 | Discrete polymer in fan-out packages | Jun 28, 2020 | Issued |
Array
(
[id] => 16617277
[patent_doc_number] => 20210035930
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-02-04
[patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA
[patent_app_type] => utility
[patent_app_number] => 16/910354
[patent_app_country] => US
[patent_app_date] => 2020-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3528
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16910354
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/910354 | Semiconductor package structure including antenna | Jun 23, 2020 | Issued |
Array
(
[id] => 17318929
[patent_doc_number] => 20210407979
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-30
[patent_title] => INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS
[patent_app_type] => utility
[patent_app_number] => 16/910486
[patent_app_country] => US
[patent_app_date] => 2020-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10905
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -23
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16910486
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/910486 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods | Jun 23, 2020 | Issued |
Array
(
[id] => 18073722
[patent_doc_number] => 11532562
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-12-20
[patent_title] => Routing structure and method of forming the same
[patent_app_type] => utility
[patent_app_number] => 16/911343
[patent_app_country] => US
[patent_app_date] => 2020-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5427
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 40
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16911343
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/911343 | Routing structure and method of forming the same | Jun 23, 2020 | Issued |
Array
(
[id] => 18190672
[patent_doc_number] => 11581274
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-02-14
[patent_title] => Semiconductor device package and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/907049
[patent_app_country] => US
[patent_app_date] => 2020-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4664
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16907049
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/907049 | Semiconductor device package and method of manufacturing the same | Jun 18, 2020 | Issued |
Array
(
[id] => 16545008
[patent_doc_number] => 20200411423
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-12-31
[patent_title] => POWER DIE PACKAGE
[patent_app_type] => utility
[patent_app_number] => 16/903496
[patent_app_country] => US
[patent_app_date] => 2020-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3971
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16903496
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/903496 | Power die package | Jun 16, 2020 | Issued |
Array
(
[id] => 17544138
[patent_doc_number] => 11309272
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-04-19
[patent_title] => Adhesive attaching apparatus, method of manufacturing display device using the same, and display device manufactured by the same
[patent_app_type] => utility
[patent_app_number] => 16/897380
[patent_app_country] => US
[patent_app_date] => 2020-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5888
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16897380
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/897380 | Adhesive attaching apparatus, method of manufacturing display device using the same, and display device manufactured by the same | Jun 9, 2020 | Issued |
Array
(
[id] => 17787771
[patent_doc_number] => 11410906
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-08-09
[patent_title] => Semiconductor package and method for fabricating a semiconductor package
[patent_app_type] => utility
[patent_app_number] => 16/897804
[patent_app_country] => US
[patent_app_date] => 2020-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 5058
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16897804
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/897804 | Semiconductor package and method for fabricating a semiconductor package | Jun 9, 2020 | Issued |
Array
(
[id] => 17574203
[patent_doc_number] => 11322477
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-05-03
[patent_title] => Package structure and method of fabricating the same
[patent_app_type] => utility
[patent_app_number] => 16/896219
[patent_app_country] => US
[patent_app_date] => 2020-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 22
[patent_no_of_words] => 7009
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16896219
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/896219 | Package structure and method of fabricating the same | Jun 8, 2020 | Issued |
Array
(
[id] => 16332309
[patent_doc_number] => 20200303275
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-09-24
[patent_title] => Non-Vertical Through-via in Package
[patent_app_type] => utility
[patent_app_number] => 16/895415
[patent_app_country] => US
[patent_app_date] => 2020-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5173
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16895415
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/895415 | Non-vertical through-via in package | Jun 7, 2020 | Issued |
Array
(
[id] => 18520824
[patent_doc_number] => 11710719
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-07-25
[patent_title] => Method for manufacturing electronic device
[patent_app_type] => utility
[patent_app_number] => 17/268907
[patent_app_country] => US
[patent_app_date] => 2020-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 9476
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17268907
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/268907 | Method for manufacturing electronic device | Jun 7, 2020 | Issued |
Array
(
[id] => 17277936
[patent_doc_number] => 20210384134
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-09
[patent_title] => SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/896000
[patent_app_country] => US
[patent_app_date] => 2020-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4473
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16896000
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/896000 | Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same | Jun 7, 2020 | Issued |
Array
(
[id] => 17908604
[patent_doc_number] => 11462466
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-10-04
[patent_title] => Fan-out type semiconductor packages and methods of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/891663
[patent_app_country] => US
[patent_app_date] => 2020-06-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 22
[patent_no_of_words] => 4933
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16891663
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/891663 | Fan-out type semiconductor packages and methods of manufacturing the same | Jun 2, 2020 | Issued |