Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17825805 [patent_doc_number] => 11430760 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-30 [patent_title] => Chip package device [patent_app_type] => utility [patent_app_number] => 16/931819 [patent_app_country] => US [patent_app_date] => 2020-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3766 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16931819 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/931819
Chip package device Jul 16, 2020 Issued
Array ( [id] => 17529895 [patent_doc_number] => 11302593 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-12 [patent_title] => Electronic component package and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/928090 [patent_app_country] => US [patent_app_date] => 2020-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 37 [patent_no_of_words] => 8355 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16928090 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/928090
Electronic component package and method for manufacturing the same Jul 13, 2020 Issued
Array ( [id] => 17347100 [patent_doc_number] => 20220013431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => AUTOMOTIVE POWER DEVICES ON DIRECT BOND COPPER EMBEDDED IN PCB DRIVER BOARDS [patent_app_type] => utility [patent_app_number] => 16/925953 [patent_app_country] => US [patent_app_date] => 2020-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5441 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16925953 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/925953
Automotive power devices on direct bond copper embedded in PCB driver boards Jul 9, 2020 Issued
Array ( [id] => 17818611 [patent_doc_number] => 11424235 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-23 [patent_title] => Interposer-less multi-chip module [patent_app_type] => utility [patent_app_number] => 16/925133 [patent_app_country] => US [patent_app_date] => 2020-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 4643 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16925133 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/925133
Interposer-less multi-chip module Jul 8, 2020 Issued
Array ( [id] => 17574161 [patent_doc_number] => 11322435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-03 [patent_title] => Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 16/924736 [patent_app_country] => US [patent_app_date] => 2020-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7333 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16924736 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/924736
Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same Jul 8, 2020 Issued
Array ( [id] => 16896332 [patent_doc_number] => 11037894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-06-15 [patent_title] => Semiconductor device having metal bump and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/923406 [patent_app_country] => US [patent_app_date] => 2020-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 23 [patent_no_of_words] => 6006 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16923406 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/923406
Semiconductor device having metal bump and method of manufacturing the same Jul 7, 2020 Issued
Array ( [id] => 19488793 [patent_doc_number] => 12108536 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-01 [patent_title] => Inspection apparatus and component mounting system having the same [patent_app_type] => utility [patent_app_number] => 16/919726 [patent_app_country] => US [patent_app_date] => 2020-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 5626 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16919726 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/919726
Inspection apparatus and component mounting system having the same Jul 1, 2020 Issued
Array ( [id] => 17152531 [patent_doc_number] => 11145622 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-12 [patent_title] => Discrete polymer in fan-out packages [patent_app_type] => utility [patent_app_number] => 16/915425 [patent_app_country] => US [patent_app_date] => 2020-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 5421 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16915425 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/915425
Discrete polymer in fan-out packages Jun 28, 2020 Issued
Array ( [id] => 16617277 [patent_doc_number] => 20210035930 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-02-04 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA [patent_app_type] => utility [patent_app_number] => 16/910354 [patent_app_country] => US [patent_app_date] => 2020-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3528 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16910354 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/910354
Semiconductor package structure including antenna Jun 23, 2020 Issued
Array ( [id] => 17318929 [patent_doc_number] => 20210407979 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-30 [patent_title] => INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS [patent_app_type] => utility [patent_app_number] => 16/910486 [patent_app_country] => US [patent_app_date] => 2020-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10905 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16910486 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/910486
Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods Jun 23, 2020 Issued
Array ( [id] => 18073722 [patent_doc_number] => 11532562 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-20 [patent_title] => Routing structure and method of forming the same [patent_app_type] => utility [patent_app_number] => 16/911343 [patent_app_country] => US [patent_app_date] => 2020-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5427 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16911343 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/911343
Routing structure and method of forming the same Jun 23, 2020 Issued
Array ( [id] => 18190672 [patent_doc_number] => 11581274 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-14 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/907049 [patent_app_country] => US [patent_app_date] => 2020-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4664 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16907049 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/907049
Semiconductor device package and method of manufacturing the same Jun 18, 2020 Issued
Array ( [id] => 16545008 [patent_doc_number] => 20200411423 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-31 [patent_title] => POWER DIE PACKAGE [patent_app_type] => utility [patent_app_number] => 16/903496 [patent_app_country] => US [patent_app_date] => 2020-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3971 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16903496 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/903496
Power die package Jun 16, 2020 Issued
Array ( [id] => 17544138 [patent_doc_number] => 11309272 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-19 [patent_title] => Adhesive attaching apparatus, method of manufacturing display device using the same, and display device manufactured by the same [patent_app_type] => utility [patent_app_number] => 16/897380 [patent_app_country] => US [patent_app_date] => 2020-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5888 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16897380 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/897380
Adhesive attaching apparatus, method of manufacturing display device using the same, and display device manufactured by the same Jun 9, 2020 Issued
Array ( [id] => 17787771 [patent_doc_number] => 11410906 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-09 [patent_title] => Semiconductor package and method for fabricating a semiconductor package [patent_app_type] => utility [patent_app_number] => 16/897804 [patent_app_country] => US [patent_app_date] => 2020-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 5058 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16897804 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/897804
Semiconductor package and method for fabricating a semiconductor package Jun 9, 2020 Issued
Array ( [id] => 17574203 [patent_doc_number] => 11322477 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-03 [patent_title] => Package structure and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 16/896219 [patent_app_country] => US [patent_app_date] => 2020-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 7009 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16896219 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/896219
Package structure and method of fabricating the same Jun 8, 2020 Issued
Array ( [id] => 16332309 [patent_doc_number] => 20200303275 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-09-24 [patent_title] => Non-Vertical Through-via in Package [patent_app_type] => utility [patent_app_number] => 16/895415 [patent_app_country] => US [patent_app_date] => 2020-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5173 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16895415 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/895415
Non-vertical through-via in package Jun 7, 2020 Issued
Array ( [id] => 18520824 [patent_doc_number] => 11710719 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-25 [patent_title] => Method for manufacturing electronic device [patent_app_type] => utility [patent_app_number] => 17/268907 [patent_app_country] => US [patent_app_date] => 2020-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 9476 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17268907 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/268907
Method for manufacturing electronic device Jun 7, 2020 Issued
Array ( [id] => 17277936 [patent_doc_number] => 20210384134 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-09 [patent_title] => SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 16/896000 [patent_app_country] => US [patent_app_date] => 2020-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4473 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16896000 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/896000
Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same Jun 7, 2020 Issued
Array ( [id] => 17908604 [patent_doc_number] => 11462466 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-10-04 [patent_title] => Fan-out type semiconductor packages and methods of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/891663 [patent_app_country] => US [patent_app_date] => 2020-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 4933 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16891663 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/891663
Fan-out type semiconductor packages and methods of manufacturing the same Jun 2, 2020 Issued
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