![](/images/general/no_picture/200_user.png)
Jasmine Jhihan B Clark
Examiner (ID: 7485, Phone: (571)272-1726 , Office: P/2816 )
Most Active Art Unit | 2815 |
Art Unit(s) | 2815, 3621, 2899, 2503, 2816 |
Total Applications | 2981 |
Issued Applications | 2695 |
Pending Applications | 126 |
Abandoned Applications | 160 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 4209190
[patent_doc_number] => 06014320
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-11
[patent_title] => 'High density stacked circuit module'
[patent_app_type] => 1
[patent_app_number] => 9/050318
[patent_app_country] => US
[patent_app_date] => 1998-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 2132
[patent_no_of_claims] => 3
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[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/014/06014320.pdf
[firstpage_image] =>[orig_patent_app_number] => 050318
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/050318 | High density stacked circuit module | Mar 29, 1998 | Issued |
Array
(
[id] => 4011441
[patent_doc_number] => 05986894
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-16
[patent_title] => 'Microelectronic component carrier and method of its manufacture'
[patent_app_type] => 1
[patent_app_number] => 9/045379
[patent_app_country] => US
[patent_app_date] => 1998-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 3017
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/986/05986894.pdf
[firstpage_image] =>[orig_patent_app_number] => 045379
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/045379 | Microelectronic component carrier and method of its manufacture | Mar 18, 1998 | Issued |
Array
(
[id] => 3956554
[patent_doc_number] => 05982625
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Semiconductor packaging device'
[patent_app_type] => 1
[patent_app_number] => 9/044076
[patent_app_country] => US
[patent_app_date] => 1998-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 952
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/982/05982625.pdf
[firstpage_image] =>[orig_patent_app_number] => 044076
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/044076 | Semiconductor packaging device | Mar 18, 1998 | Issued |
Array
(
[id] => 4126369
[patent_doc_number] => 06046910
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-04
[patent_title] => 'Microelectronic assembly having slidable contacts and method for manufacturing the assembly'
[patent_app_type] => 1
[patent_app_number] => 9/040568
[patent_app_country] => US
[patent_app_date] => 1998-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 17
[patent_no_of_words] => 5985
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 50
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/046/06046910.pdf
[firstpage_image] =>[orig_patent_app_number] => 040568
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/040568 | Microelectronic assembly having slidable contacts and method for manufacturing the assembly | Mar 17, 1998 | Issued |
Array
(
[id] => 3936514
[patent_doc_number] => 05946195
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate'
[patent_app_type] => 1
[patent_app_number] => 9/035068
[patent_app_country] => US
[patent_app_date] => 1998-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 5143
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/946/05946195.pdf
[firstpage_image] =>[orig_patent_app_number] => 035068
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/035068 | Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate | Mar 4, 1998 | Issued |
Array
(
[id] => 4246792
[patent_doc_number] => 06118669
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-12
[patent_title] => 'Routing topology for identical connector point layouts on primary and secondary sides of a substrate'
[patent_app_type] => 1
[patent_app_number] => 9/023388
[patent_app_country] => US
[patent_app_date] => 1998-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2119
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[pdf_file] => patents/06/118/06118669.pdf
[firstpage_image] =>[orig_patent_app_number] => 023388
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/023388 | Routing topology for identical connector point layouts on primary and secondary sides of a substrate | Feb 12, 1998 | Issued |
Array
(
[id] => 4025101
[patent_doc_number] => 05963430
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-05
[patent_title] => 'Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry'
[patent_app_type] => 1
[patent_app_number] => 9/018036
[patent_app_country] => US
[patent_app_date] => 1998-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3976
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 301
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/963/05963430.pdf
[firstpage_image] =>[orig_patent_app_number] => 018036
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/018036 | Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry | Feb 2, 1998 | Issued |
Array
(
[id] => 3956653
[patent_doc_number] => 05982632
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Short power signal path integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 9/007349
[patent_app_country] => US
[patent_app_date] => 1998-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 3579
[patent_no_of_claims] => 26
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[patent_words_short_claim] => 281
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/982/05982632.pdf
[firstpage_image] =>[orig_patent_app_number] => 007349
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/007349 | Short power signal path integrated circuit package | Jan 14, 1998 | Issued |
Array
(
[id] => 4017087
[patent_doc_number] => 06005776
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-21
[patent_title] => 'Vertical connector based packaging solution for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 9/002775
[patent_app_country] => US
[patent_app_date] => 1998-01-05
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/005/06005776.pdf
[firstpage_image] =>[orig_patent_app_number] => 002775
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/002775 | Vertical connector based packaging solution for integrated circuits | Jan 4, 1998 | Issued |
Array
(
[id] => 3924822
[patent_doc_number] => 06002594
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-14
[patent_title] => 'Flexible touchpad circuit with mounted circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/999908
[patent_app_country] => US
[patent_app_date] => 1997-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/002/06002594.pdf
[firstpage_image] =>[orig_patent_app_number] => 999908
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/999908 | Flexible touchpad circuit with mounted circuit board | Dec 18, 1997 | Issued |
Array
(
[id] => 3985863
[patent_doc_number] => 05905638
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Method and apparatus for packaging a microelectronic device with an elastomer gel'
[patent_app_type] => 1
[patent_app_number] => 8/993815
[patent_app_country] => US
[patent_app_date] => 1997-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3555
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/905/05905638.pdf
[firstpage_image] =>[orig_patent_app_number] => 993815
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/993815 | Method and apparatus for packaging a microelectronic device with an elastomer gel | Dec 17, 1997 | Issued |
08/987523 | MEMORY CARD ASSEMBLY HAVING AN INTEGRAL ANTENNA | Dec 8, 1997 | Abandoned |
Array
(
[id] => 3952728
[patent_doc_number] => 05973929
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'Printed circuit board having an embedded capacitor'
[patent_app_type] => 1
[patent_app_number] => 8/974510
[patent_app_country] => US
[patent_app_date] => 1997-11-19
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[pdf_file] => patents/05/973/05973929.pdf
[firstpage_image] =>[orig_patent_app_number] => 974510
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/974510 | Printed circuit board having an embedded capacitor | Nov 18, 1997 | Issued |
Array
(
[id] => 4144454
[patent_doc_number] => 06016256
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-18
[patent_title] => 'Multi-chip module having interconnect dies'
[patent_app_type] => 1
[patent_app_number] => 8/970379
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[pdf_file] => patents/06/016/06016256.pdf
[firstpage_image] =>[orig_patent_app_number] => 970379
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/970379 | Multi-chip module having interconnect dies | Nov 13, 1997 | Issued |
Array
(
[id] => 4026153
[patent_doc_number] => 05880934
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-09
[patent_title] => 'Data carrier having separately provided integrated circuit and induction coil'
[patent_app_type] => 1
[patent_app_number] => 8/960500
[patent_app_country] => US
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[pdf_file] => patents/05/880/05880934.pdf
[firstpage_image] =>[orig_patent_app_number] => 960500
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/960500 | Data carrier having separately provided integrated circuit and induction coil | Oct 28, 1997 | Issued |
Array
(
[id] => 4009709
[patent_doc_number] => 05923535
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Electronic device assembly'
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[pdf_file] => patents/05/923/05923535.pdf
[firstpage_image] =>[orig_patent_app_number] => 959270
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/959270 | Electronic device assembly | Oct 27, 1997 | Issued |
Array
(
[id] => 3985879
[patent_doc_number] => 05905639
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds'
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[pdf_file] => patents/05/905/05905639.pdf
[firstpage_image] =>[orig_patent_app_number] => 939835
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/939835 | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds | Sep 28, 1997 | Issued |
Array
(
[id] => 4004466
[patent_doc_number] => 05920464
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-06
[patent_title] => 'Reworkable microelectronic multi-chip module'
[patent_app_type] => 1
[patent_app_number] => 8/935267
[patent_app_country] => US
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[pdf_file] => patents/05/920/05920464.pdf
[firstpage_image] =>[orig_patent_app_number] => 935267
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/935267 | Reworkable microelectronic multi-chip module | Sep 21, 1997 | Issued |
Array
(
[id] => 3904161
[patent_doc_number] => 05835355
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-10
[patent_title] => 'Tape ball grid array package with perforated metal stiffener'
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[pdf_file] => patents/05/835/05835355.pdf
[firstpage_image] =>[orig_patent_app_number] => 934529
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/934529 | Tape ball grid array package with perforated metal stiffener | Sep 21, 1997 | Issued |
Array
(
[id] => 4036340
[patent_doc_number] => 05883789
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-16
[patent_title] => 'Method of mounting a PC board to a hybrid'
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[pdf_file] => patents/05/883/05883789.pdf
[firstpage_image] =>[orig_patent_app_number] => 934297
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/934297 | Method of mounting a PC board to a hybrid | Sep 18, 1997 | Issued |