Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16566808 [patent_doc_number] => 10892184 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-01-12 [patent_title] => Photobucket floor colors with selective grafting [patent_app_type] => utility [patent_app_number] => 16/317015 [patent_app_country] => US [patent_app_date] => 2016-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 30 [patent_no_of_words] => 12038 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16317015 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/317015
Photobucket floor colors with selective grafting Sep 29, 2016 Issued
Array ( [id] => 14904355 [patent_doc_number] => 20190295943 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-09-26 [patent_title] => PREFORMED INTERLAYER CONNECTIONS FOR INTEGRATED CIRCUIT DEVICES [patent_app_type] => utility [patent_app_number] => 16/316528 [patent_app_country] => US [patent_app_date] => 2016-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12080 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16316528 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/316528
Preformed interlayer connections for integrated circuit devices Sep 25, 2016 Issued
Array ( [id] => 11385923 [patent_doc_number] => 20170011978 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-01-12 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/269633 [patent_app_country] => US [patent_app_date] => 2016-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 36 [patent_no_of_words] => 16319 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15269633 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/269633
Semiconductor device Sep 18, 2016 Issued
Array ( [id] => 11353696 [patent_doc_number] => 20160372436 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-12-22 [patent_title] => 'Concentric Bump Design for the Alignment in Die Stacking' [patent_app_type] => utility [patent_app_number] => 15/255963 [patent_app_country] => US [patent_app_date] => 2016-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 4507 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15255963 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/255963
Concentric bump design for the alignment in die stacking Sep 1, 2016 Issued
Array ( [id] => 11753424 [patent_doc_number] => 09711442 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-07-18 [patent_title] => 'Semiconductor structure' [patent_app_type] => utility [patent_app_number] => 15/245200 [patent_app_country] => US [patent_app_date] => 2016-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 4058 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15245200 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/245200
Semiconductor structure Aug 23, 2016 Issued
Array ( [id] => 11571738 [patent_doc_number] => 20170110382 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-04-20 [patent_title] => 'SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 15/245243 [patent_app_country] => US [patent_app_date] => 2016-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 11263 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15245243 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/245243
Semiconductor package, method of fabricating the same, and semiconductor module Aug 23, 2016 Issued
Array ( [id] => 11918395 [patent_doc_number] => 09786586 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-10 [patent_title] => 'Semiconductor package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 15/242594 [patent_app_country] => US [patent_app_date] => 2016-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 2412 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15242594 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/242594
Semiconductor package and fabrication method thereof Aug 20, 2016 Issued
Array ( [id] => 12040429 [patent_doc_number] => 09818664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-11-14 [patent_title] => 'Electronic device comprising an encapsulating block locally of smaller thickness' [patent_app_type] => utility [patent_app_number] => 15/240482 [patent_app_country] => US [patent_app_date] => 2016-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2774 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15240482 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/240482
Electronic device comprising an encapsulating block locally of smaller thickness Aug 17, 2016 Issued
Array ( [id] => 14968989 [patent_doc_number] => 20190311973 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-10-10 [patent_title] => SYSTEMS AND METHODS FOR IMPROVED THROUGH-SILICON-VIAS [patent_app_type] => utility [patent_app_number] => 16/316504 [patent_app_country] => US [patent_app_date] => 2016-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5090 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16316504 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/316504
Systems and methods for improved through-silicon-vias Aug 17, 2016 Issued
Array ( [id] => 11904301 [patent_doc_number] => 09773741 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-09-26 [patent_title] => 'Bondable device including a hydrophilic layer' [patent_app_type] => utility [patent_app_number] => 15/239588 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 11744 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239588 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239588
Bondable device including a hydrophilic layer Aug 16, 2016 Issued
Array ( [id] => 12014536 [patent_doc_number] => 09807882 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-31 [patent_title] => 'Density-optimized module-level inductor ground structure' [patent_app_type] => utility [patent_app_number] => 15/239751 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 7984 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239751 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239751
Density-optimized module-level inductor ground structure Aug 16, 2016 Issued
Array ( [id] => 15108875 [patent_doc_number] => 10475769 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-11-12 [patent_title] => Semiconductor package and manufacturing method of the same [patent_app_type] => utility [patent_app_number] => 15/239295 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6151 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239295 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239295
Semiconductor package and manufacturing method of the same Aug 16, 2016 Issued
Array ( [id] => 12208557 [patent_doc_number] => 20180053784 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-02-22 [patent_title] => 'SYSTEM ON CHIP FULLY-DEPLETED SILICON ON INSULATOR WITH RF AND MM-WAVE INTEGRATED FUNCTIONS' [patent_app_type] => utility [patent_app_number] => 15/239230 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4719 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239230 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239230
System on chip fully-depleted silicon on insulator with rf and mm-wave integrated functions Aug 16, 2016 Issued
Array ( [id] => 11517551 [patent_doc_number] => 20170084626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-03-23 [patent_title] => 'THREE-DIMENSIONAL SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/239434 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 14359 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239434 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239434
Three-dimensional semiconductor device Aug 16, 2016 Issued
Array ( [id] => 12047375 [patent_doc_number] => 09824983 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-11-21 [patent_title] => 'Chip carrier, a device and a method' [patent_app_type] => utility [patent_app_number] => 15/232815 [patent_app_country] => US [patent_app_date] => 2016-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 41 [patent_no_of_words] => 21519 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15232815 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/232815
Chip carrier, a device and a method Aug 9, 2016 Issued
Array ( [id] => 11753426 [patent_doc_number] => 09711444 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-18 [patent_title] => 'Packaging module and substrate structure thereof' [patent_app_type] => utility [patent_app_number] => 15/231931 [patent_app_country] => US [patent_app_date] => 2016-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3406 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15231931 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/231931
Packaging module and substrate structure thereof Aug 8, 2016 Issued
Array ( [id] => 11293746 [patent_doc_number] => 20160343678 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-11-24 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/231030 [patent_app_country] => US [patent_app_date] => 2016-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7313 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15231030 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/231030
Semiconductor device Aug 7, 2016 Issued
Array ( [id] => 11928740 [patent_doc_number] => 09795718 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-24 [patent_title] => 'Biocompatible devices with dissolvable substrates and methods of forming the same' [patent_app_type] => utility [patent_app_number] => 15/229497 [patent_app_country] => US [patent_app_date] => 2016-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5901 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15229497 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/229497
Biocompatible devices with dissolvable substrates and methods of forming the same Aug 4, 2016 Issued
Array ( [id] => 11725230 [patent_doc_number] => 09698094 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-04 [patent_title] => 'Wiring board and electronic component device' [patent_app_type] => utility [patent_app_number] => 15/228059 [patent_app_country] => US [patent_app_date] => 2016-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 41 [patent_no_of_words] => 10275 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15228059 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/228059
Wiring board and electronic component device Aug 3, 2016 Issued
Array ( [id] => 11273738 [patent_doc_number] => 20160336285 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-11-17 [patent_title] => 'CHIP PACKAGING STRUCTURES' [patent_app_type] => utility [patent_app_number] => 15/221856 [patent_app_country] => US [patent_app_date] => 2016-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 6630 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15221856 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/221856
Chip packaging structures Jul 27, 2016 Issued
Menu