Jasmine Jhihan B. Clark

Array ( [id] => 10372251 [patent_doc_number] => 20150257256 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-09-10 [patent_title] => 'Wiring Substrate and Semiconductor Device' [patent_app_type] => utility [patent_app_number] => 14/633342 [patent_app_country] => US [patent_app_date] => 2015-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 11949 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14633342 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10365048 [patent_doc_number] => 20150250053 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-09-03 [patent_title] => 'WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/633525 [patent_app_country] => US [patent_app_date] => 2015-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 9153 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14633525 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 12314421 [patent_doc_number] => 09941192 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-04-10 [patent_title] => Semiconductor device having repairable penetration electrode [patent_app_type] => utility [patent_app_number] => 15/318093 [patent_app_country] => US [patent_app_date] => 2015-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 12374 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15318093 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10358570 [patent_doc_number] => 20150243575 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-27 [patent_title] => 'Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)' [patent_app_type] => utility [patent_app_number] => 14/627347 [patent_app_country] => US [patent_app_date] => 2015-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 22432 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14627347 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10649176 [patent_doc_number] => 09365410 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-14 [patent_title] => 'Method for producing a micromechanical component, and micromechanical component' [patent_app_type] => utility [patent_app_number] => 14/624071 [patent_app_country] => US [patent_app_date] => 2015-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4686 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 240 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14624071 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10360469 [patent_doc_number] => 20150245473 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-27 [patent_title] => 'Wiring Substrate, Semiconductor Device, and Method of Manufacturing Wiring Substrate' [patent_app_type] => utility [patent_app_number] => 14/623689 [patent_app_country] => US [patent_app_date] => 2015-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 22343 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14623689 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10645379 [patent_doc_number] => 09362254 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2016-06-07 [patent_title] => 'Wire bonding method and chip structure' [patent_app_type] => utility [patent_app_number] => 14/620947 [patent_app_country] => US [patent_app_date] => 2015-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3514 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14620947 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11787532 [patent_doc_number] => 09396994 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-07-19 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/598080 [patent_app_country] => US [patent_app_date] => 2015-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 4830 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14598080 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 12005549 [patent_doc_number] => 20170309704 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-10-26 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 15/511650 [patent_app_country] => US [patent_app_date] => 2015-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3567 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15511650 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11796705 [patent_doc_number] => 09406553 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-08-02 [patent_title] => 'Semiconductor devices and methods of fabricating the same' [patent_app_type] => utility [patent_app_number] => 14/595662 [patent_app_country] => US [patent_app_date] => 2015-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5982 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14595662 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10241001 [patent_doc_number] => 20150125996 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-07 [patent_title] => 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/595638 [patent_app_country] => US [patent_app_date] => 2015-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5623 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14595638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10066867 [patent_doc_number] => 09105727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-08-11 [patent_title] => 'Semiconductor element and display device using the same' [patent_app_type] => utility [patent_app_number] => 14/582242 [patent_app_country] => US [patent_app_date] => 2014-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 49 [patent_no_of_words] => 12332 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14582242 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10597373 [patent_doc_number] => 09318467 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Multi-die wirebond packages with elongated windows' [patent_app_type] => utility [patent_app_number] => 14/563240 [patent_app_country] => US [patent_app_date] => 2014-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 10060 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14563240 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11132284 [patent_doc_number] => 20160329259 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-11-10 [patent_title] => 'CIRCUIT CARRIER INCLUDING A SILICONE POLYMER COATING' [patent_app_type] => utility [patent_app_number] => 15/110907 [patent_app_country] => US [patent_app_date] => 2014-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3033 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15110907 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10055175 [patent_doc_number] => 09095074 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-28 [patent_title] => 'Structure for microelectronic packaging with bond elements to encapsulation surface' [patent_app_type] => utility [patent_app_number] => 14/517268 [patent_app_country] => US [patent_app_date] => 2014-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 32 [patent_no_of_words] => 16327 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14517268 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10217517 [patent_doc_number] => 20150102510 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-16 [patent_title] => 'WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD' [patent_app_type] => utility [patent_app_number] => 14/512754 [patent_app_country] => US [patent_app_date] => 2014-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 20053 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14512754 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10035423 [patent_doc_number] => 09076749 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-07 [patent_title] => 'Electronic system comprising stacked electronic devices comprising integrated-circuit chips' [patent_app_type] => utility [patent_app_number] => 14/512060 [patent_app_country] => US [patent_app_date] => 2014-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2054 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14512060 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11770293 [patent_doc_number] => 09378986 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-28 [patent_title] => 'Method for mounting a chip and chip package' [patent_app_type] => utility [patent_app_number] => 14/511353 [patent_app_country] => US [patent_app_date] => 2014-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3046 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14511353 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10217514 [patent_doc_number] => 20150102507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-16 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/511158 [patent_app_country] => US [patent_app_date] => 2014-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 16616 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14511158 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10217513 [patent_doc_number] => 20150102506 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-16 [patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF FORMING' [patent_app_type] => utility [patent_app_number] => 14/511149 [patent_app_country] => US [patent_app_date] => 2014-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 16981 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14511149 [rel_patent_id] =>[rel_patent_doc_number] =>)