Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9600857 [patent_doc_number] => 20140197539 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-17 [patent_title] => 'Bonded System with Coated Copper Conductor' [patent_app_type] => utility [patent_app_number] => 13/739351 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2728 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739351 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739351
Bonded system with coated copper conductor Jan 10, 2013 Issued
Array ( [id] => 9704607 [patent_doc_number] => 08829678 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-09 [patent_title] => 'Semiconductor package and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/739547 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 2462 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739547 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739547
Semiconductor package and method for manufacturing the same Jan 10, 2013 Issued
Array ( [id] => 9600867 [patent_doc_number] => 20140197548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-17 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED GRID-ARRAY MECHANISM AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/740151 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 14376 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13740151 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/740151
Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof Jan 10, 2013 Issued
Array ( [id] => 10053474 [patent_doc_number] => 09093360 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-28 [patent_title] => 'Compact device package' [patent_app_type] => utility [patent_app_number] => 13/739953 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10492 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739953
Compact device package Jan 10, 2013 Issued
Array ( [id] => 10053474 [patent_doc_number] => 09093360 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-28 [patent_title] => 'Compact device package' [patent_app_type] => utility [patent_app_number] => 13/739953 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10492 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739953
Compact device package Jan 10, 2013 Issued
Array ( [id] => 10053474 [patent_doc_number] => 09093360 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-28 [patent_title] => 'Compact device package' [patent_app_type] => utility [patent_app_number] => 13/739953 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10492 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739953
Compact device package Jan 10, 2013 Issued
Array ( [id] => 10053474 [patent_doc_number] => 09093360 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-28 [patent_title] => 'Compact device package' [patent_app_type] => utility [patent_app_number] => 13/739953 [patent_app_country] => US [patent_app_date] => 2013-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10492 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/739953
Compact device package Jan 10, 2013 Issued
Array ( [id] => 9869748 [patent_doc_number] => 08957523 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-17 [patent_title] => 'Dielectric posts in metal layers' [patent_app_type] => utility [patent_app_number] => 13/737957 [patent_app_country] => US [patent_app_date] => 2013-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3285 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13737957 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/737957
Dielectric posts in metal layers Jan 9, 2013 Issued
Array ( [id] => 8937466 [patent_doc_number] => 20130187263 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-25 [patent_title] => 'SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/738082 [patent_app_country] => US [patent_app_date] => 2013-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1556 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738082 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/738082
Semiconductor stacked package and method of fabricating the same Jan 9, 2013 Issued
Array ( [id] => 9104701 [patent_doc_number] => 20130277832 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-24 [patent_title] => 'METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY' [patent_app_type] => utility [patent_app_number] => 13/738220 [patent_app_country] => US [patent_app_date] => 2013-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 15705 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738220 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/738220
METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY Jan 9, 2013 Abandoned
Array ( [id] => 9763050 [patent_doc_number] => 08847378 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-30 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 13/738322 [patent_app_country] => US [patent_app_date] => 2013-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 9893 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738322 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/738322
Semiconductor package Jan 9, 2013 Issued
Array ( [id] => 10888095 [patent_doc_number] => 08912091 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-16 [patent_title] => 'Backside metal ground plane with improved metal adhesion and design structures' [patent_app_type] => utility [patent_app_number] => 13/738541 [patent_app_country] => US [patent_app_date] => 2013-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4330 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738541 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/738541
Backside metal ground plane with improved metal adhesion and design structures Jan 9, 2013 Issued
Array ( [id] => 9594715 [patent_doc_number] => 20140191392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-10 [patent_title] => 'Post-Passivation Interconnect Structure and Methods for Forming the Same' [patent_app_type] => utility [patent_app_number] => 13/737177 [patent_app_country] => US [patent_app_date] => 2013-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2992 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13737177 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/737177
Post-passivation interconnect structure and methods for forming the same Jan 8, 2013 Issued
Array ( [id] => 11904326 [patent_doc_number] => 09773766 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-09-26 [patent_title] => 'Semiconductor device including independent film layer for embedding and/or spacing semiconductor die' [patent_app_type] => utility [patent_app_number] => 14/422152 [patent_app_country] => US [patent_app_date] => 2013-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 6133 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14422152 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/422152
Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Jan 8, 2013 Issued
Array ( [id] => 9594741 [patent_doc_number] => 20140191418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-10 [patent_title] => 'METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS' [patent_app_type] => utility [patent_app_number] => 13/736984 [patent_app_country] => US [patent_app_date] => 2013-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3734 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736984 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/736984
Metal to metal bonding for stacked (3D) integrated circuits Jan 8, 2013 Issued
Array ( [id] => 8925586 [patent_doc_number] => 20130181345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-18 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROUGH SEMICONDUCTOR SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 13/736652 [patent_app_country] => US [patent_app_date] => 2013-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7672 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736652 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/736652
Semiconductor device having penetration electrode penetrating through semiconductor substrate Jan 7, 2013 Issued
Array ( [id] => 9432935 [patent_doc_number] => 20140110841 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-24 [patent_title] => 'Semiconductor Packages with Integrated Antenna and Methods of Forming Thereof' [patent_app_type] => utility [patent_app_number] => 13/736641 [patent_app_country] => US [patent_app_date] => 2013-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 8577 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736641 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/736641
Semiconductor packages with integrated antenna and methods of forming thereof Jan 7, 2013 Issued
Array ( [id] => 9432934 [patent_doc_number] => 20140110840 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-24 [patent_title] => 'Semiconductor Packages with Integrated Antenna and Method of Forming Thereof' [patent_app_type] => utility [patent_app_number] => 13/736553 [patent_app_country] => US [patent_app_date] => 2013-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 8681 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736553 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/736553
Semiconductor packages with integrated antenna and method of forming thereof Jan 7, 2013 Issued
Array ( [id] => 9316600 [patent_doc_number] => 20140048938 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-20 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/722757 [patent_app_country] => US [patent_app_date] => 2012-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5773 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13722757 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/722757
Semiconductor device and method for fabricating the same Dec 19, 2012 Issued
Array ( [id] => 9704617 [patent_doc_number] => 08829687 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-09 [patent_title] => 'Semiconductor package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 13/722138 [patent_app_country] => US [patent_app_date] => 2012-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 2135 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13722138 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/722138
Semiconductor package and fabrication method thereof Dec 19, 2012 Issued
Menu