
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9600857
[patent_doc_number] => 20140197539
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-17
[patent_title] => 'Bonded System with Coated Copper Conductor'
[patent_app_type] => utility
[patent_app_number] => 13/739351
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2728
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739351
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739351 | Bonded system with coated copper conductor | Jan 10, 2013 | Issued |
Array
(
[id] => 9704607
[patent_doc_number] => 08829678
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-09-09
[patent_title] => 'Semiconductor package and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/739547
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 2462
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739547
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739547 | Semiconductor package and method for manufacturing the same | Jan 10, 2013 | Issued |
Array
(
[id] => 9600867
[patent_doc_number] => 20140197548
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-17
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED GRID-ARRAY MECHANISM AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/740151
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 14376
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13740151
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/740151 | Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof | Jan 10, 2013 | Issued |
Array
(
[id] => 10053474
[patent_doc_number] => 09093360
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Compact device package'
[patent_app_type] => utility
[patent_app_number] => 13/739953
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 10492
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739953 | Compact device package | Jan 10, 2013 | Issued |
Array
(
[id] => 10053474
[patent_doc_number] => 09093360
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Compact device package'
[patent_app_type] => utility
[patent_app_number] => 13/739953
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 10492
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739953 | Compact device package | Jan 10, 2013 | Issued |
Array
(
[id] => 10053474
[patent_doc_number] => 09093360
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Compact device package'
[patent_app_type] => utility
[patent_app_number] => 13/739953
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 10492
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739953 | Compact device package | Jan 10, 2013 | Issued |
Array
(
[id] => 10053474
[patent_doc_number] => 09093360
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Compact device package'
[patent_app_type] => utility
[patent_app_number] => 13/739953
[patent_app_country] => US
[patent_app_date] => 2013-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 10492
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13739953
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/739953 | Compact device package | Jan 10, 2013 | Issued |
Array
(
[id] => 9869748
[patent_doc_number] => 08957523
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-17
[patent_title] => 'Dielectric posts in metal layers'
[patent_app_type] => utility
[patent_app_number] => 13/737957
[patent_app_country] => US
[patent_app_date] => 2013-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 3285
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13737957
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/737957 | Dielectric posts in metal layers | Jan 9, 2013 | Issued |
Array
(
[id] => 8937466
[patent_doc_number] => 20130187263
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-07-25
[patent_title] => 'SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/738082
[patent_app_country] => US
[patent_app_date] => 2013-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1556
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738082
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/738082 | Semiconductor stacked package and method of fabricating the same | Jan 9, 2013 | Issued |
Array
(
[id] => 9104701
[patent_doc_number] => 20130277832
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-24
[patent_title] => 'METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY'
[patent_app_type] => utility
[patent_app_number] => 13/738220
[patent_app_country] => US
[patent_app_date] => 2013-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 15705
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738220
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/738220 | METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY | Jan 9, 2013 | Abandoned |
Array
(
[id] => 9763050
[patent_doc_number] => 08847378
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-09-30
[patent_title] => 'Semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 13/738322
[patent_app_country] => US
[patent_app_date] => 2013-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 19
[patent_no_of_words] => 9893
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738322
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/738322 | Semiconductor package | Jan 9, 2013 | Issued |
Array
(
[id] => 10888095
[patent_doc_number] => 08912091
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-12-16
[patent_title] => 'Backside metal ground plane with improved metal adhesion and design structures'
[patent_app_type] => utility
[patent_app_number] => 13/738541
[patent_app_country] => US
[patent_app_date] => 2013-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 4330
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13738541
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/738541 | Backside metal ground plane with improved metal adhesion and design structures | Jan 9, 2013 | Issued |
Array
(
[id] => 9594715
[patent_doc_number] => 20140191392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-10
[patent_title] => 'Post-Passivation Interconnect Structure and Methods for Forming the Same'
[patent_app_type] => utility
[patent_app_number] => 13/737177
[patent_app_country] => US
[patent_app_date] => 2013-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 2992
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13737177
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/737177 | Post-passivation interconnect structure and methods for forming the same | Jan 8, 2013 | Issued |
Array
(
[id] => 11904326
[patent_doc_number] => 09773766
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-09-26
[patent_title] => 'Semiconductor device including independent film layer for embedding and/or spacing semiconductor die'
[patent_app_type] => utility
[patent_app_number] => 14/422152
[patent_app_country] => US
[patent_app_date] => 2013-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 6133
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14422152
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/422152 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Jan 8, 2013 | Issued |
Array
(
[id] => 9594741
[patent_doc_number] => 20140191418
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-10
[patent_title] => 'METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS'
[patent_app_type] => utility
[patent_app_number] => 13/736984
[patent_app_country] => US
[patent_app_date] => 2013-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3734
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736984
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/736984 | Metal to metal bonding for stacked (3D) integrated circuits | Jan 8, 2013 | Issued |
Array
(
[id] => 8925586
[patent_doc_number] => 20130181345
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-07-18
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROUGH SEMICONDUCTOR SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 13/736652
[patent_app_country] => US
[patent_app_date] => 2013-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7672
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736652
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/736652 | Semiconductor device having penetration electrode penetrating through semiconductor substrate | Jan 7, 2013 | Issued |
Array
(
[id] => 9432935
[patent_doc_number] => 20140110841
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-04-24
[patent_title] => 'Semiconductor Packages with Integrated Antenna and Methods of Forming Thereof'
[patent_app_type] => utility
[patent_app_number] => 13/736641
[patent_app_country] => US
[patent_app_date] => 2013-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 8577
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736641
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/736641 | Semiconductor packages with integrated antenna and methods of forming thereof | Jan 7, 2013 | Issued |
Array
(
[id] => 9432934
[patent_doc_number] => 20140110840
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-04-24
[patent_title] => 'Semiconductor Packages with Integrated Antenna and Method of Forming Thereof'
[patent_app_type] => utility
[patent_app_number] => 13/736553
[patent_app_country] => US
[patent_app_date] => 2013-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 8681
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13736553
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/736553 | Semiconductor packages with integrated antenna and method of forming thereof | Jan 7, 2013 | Issued |
Array
(
[id] => 9316600
[patent_doc_number] => 20140048938
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-02-20
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/722757
[patent_app_country] => US
[patent_app_date] => 2012-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5773
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13722757
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/722757 | Semiconductor device and method for fabricating the same | Dec 19, 2012 | Issued |
Array
(
[id] => 9704617
[patent_doc_number] => 08829687
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-09-09
[patent_title] => 'Semiconductor package and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 13/722138
[patent_app_country] => US
[patent_app_date] => 2012-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 2135
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 24
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13722138
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/722138 | Semiconductor package and fabrication method thereof | Dec 19, 2012 | Issued |