
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10838628
[patent_doc_number] => 08866308
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[patent_issue_date] => 2014-10-21
[patent_title] => 'High density interconnect device and method'
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Array
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[patent_issue_date] => 2014-06-26
[patent_title] => 'STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE'
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Array
(
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[patent_issue_date] => 2013-05-30
[patent_title] => 'METHOD FOR CREATING AND PACKAGING THREE DIMENSIONAL STACKS OF BIOCHIPS CONTAINING MICROELECTRO-MECHANICAL SYSTEMS'
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Array
(
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Array
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Array
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[patent_title] => 'SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME'
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/624324 | Manufacturing method for semiconductor device | Sep 20, 2012 | Issued |
Array
(
[id] => 11143978
[patent_doc_number] => 09379056
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[patent_app_number] => 14/423020
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| 13/618866 | SEMICONDUCTOR DEVICE | Sep 13, 2012 | Abandoned |
Array
(
[id] => 8960912
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[patent_title] => 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME'
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Array
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[id] => 8818482
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[patent_title] => 'SEMICONDUCTOR DIE ASSEMBLIES WITH ENHANCED THERMAL MANAGEMENT, SEMICONDUCTOR DEVICES INCLUDING SAME AND RELATED METHODS'
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Array
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[id] => 10638479
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[patent_title] => 'Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method'
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Array
(
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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