Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18168052 [patent_doc_number] => 20230034661 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-02 [patent_title] => NOVEL IMAGE SENSOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/960028 [patent_app_country] => US [patent_app_date] => 2022-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5302 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17960028 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/960028
Image sensor device Oct 3, 2022 Issued
Array ( [id] => 19086164 [patent_doc_number] => 20240112965 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-04 [patent_title] => TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/937764 [patent_app_country] => US [patent_app_date] => 2022-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5546 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17937764 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/937764
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE Oct 2, 2022 Pending
Array ( [id] => 20455963 [patent_doc_number] => 12519025 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-06 [patent_title] => Package substrate and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 17/936937 [patent_app_country] => US [patent_app_date] => 2022-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 973 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936937 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/936937
Package substrate and semiconductor package including the same Sep 29, 2022 Issued
Array ( [id] => 18213111 [patent_doc_number] => 20230059375 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => WIRE BOND WIRES FOR INTERFERENCE SHIELDING [patent_app_type] => utility [patent_app_number] => 17/893725 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8532 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17893725 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/893725
Wire bond wires for interference shielding Aug 22, 2022 Issued
Array ( [id] => 18040170 [patent_doc_number] => 20220384387 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS [patent_app_type] => utility [patent_app_number] => 17/885445 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9291 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17885445 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/885445
Manufacturing method of semiconductor apparatus and semiconductor apparatus Aug 9, 2022 Issued
Array ( [id] => 18857471 [patent_doc_number] => 11855067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Integrated circuit package and method [patent_app_type] => utility [patent_app_number] => 17/884096 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 8226 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17884096 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/884096
Integrated circuit package and method Aug 8, 2022 Issued
Array ( [id] => 18943573 [patent_doc_number] => 20240038712 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/876466 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10147 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17876466 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/876466
Semiconductor device package and method of manufacturing the same Jul 27, 2022 Issued
Array ( [id] => 18943585 [patent_doc_number] => 20240038724 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => Semiconductor Package with Side Wall Interconnection [patent_app_type] => utility [patent_app_number] => 17/876504 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6903 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17876504 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/876504
Semiconductor package with side wall interconnection Jul 27, 2022 Issued
Array ( [id] => 18193126 [patent_doc_number] => 20230046645 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED IN LAMINATED SUBSTRATE BELOW THE INTEGRATED CIRCUIT DIE [patent_app_type] => utility [patent_app_number] => 17/870235 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2398 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17870235 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/870235
Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit die Jul 20, 2022 Issued
Array ( [id] => 18319737 [patent_doc_number] => 20230117865 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/862459 [patent_app_country] => US [patent_app_date] => 2022-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7587 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17862459 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/862459
Semiconductor package Jul 11, 2022 Issued
Array ( [id] => 18913092 [patent_doc_number] => 11876080 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Semiconductor memory device [patent_app_type] => utility [patent_app_number] => 17/860830 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 29 [patent_no_of_words] => 11794 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860830 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860830
Semiconductor memory device Jul 7, 2022 Issued
Array ( [id] => 17963690 [patent_doc_number] => 20220344271 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/811362 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10329 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17811362 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/811362
Semiconductor package Jul 7, 2022 Issued
Array ( [id] => 19900236 [patent_doc_number] => 12278173 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Electronic package and substrate structure thereof [patent_app_type] => utility [patent_app_number] => 17/859291 [patent_app_country] => US [patent_app_date] => 2022-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 0 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17859291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/859291
Electronic package and substrate structure thereof Jul 6, 2022 Issued
Array ( [id] => 20638114 [patent_doc_number] => 12599013 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-07 [patent_title] => Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/857057 [patent_app_country] => US [patent_app_date] => 2022-07-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 2165 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17857057 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/857057
Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same Jul 3, 2022 Issued
Array ( [id] => 17949375 [patent_doc_number] => 20220336394 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/809991 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 52802 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17809991 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/809991
Bonded assembly including interconnect-level bonding pads and methods of forming the same Jun 29, 2022 Issued
Array ( [id] => 18883000 [patent_doc_number] => 20240006369 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER PACKAGE SUBSTRATE, AND RELATED FABRICATION METHODS [patent_app_type] => utility [patent_app_number] => 17/809675 [patent_app_country] => US [patent_app_date] => 2022-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11986 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17809675 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/809675
Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods Jun 28, 2022 Issued
Array ( [id] => 18283879 [patent_doc_number] => 20230099351 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/844815 [patent_app_country] => US [patent_app_date] => 2022-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10177 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17844815 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/844815
Semiconductor package Jun 20, 2022 Issued
Array ( [id] => 19936983 [patent_doc_number] => 12310204 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-20 [patent_title] => Display panel and display apparatus [patent_app_type] => utility [patent_app_number] => 17/833696 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 39 [patent_no_of_words] => 7718 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17833696 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/833696
Display panel and display apparatus Jun 5, 2022 Issued
Array ( [id] => 20229354 [patent_doc_number] => 12418010 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-16 [patent_title] => Semiconductor package with improved heat distribution [patent_app_type] => utility [patent_app_number] => 17/830861 [patent_app_country] => US [patent_app_date] => 2022-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 1135 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17830861 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/830861
Semiconductor package with improved heat distribution Jun 1, 2022 Issued
Array ( [id] => 18631904 [patent_doc_number] => 20230290809 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING [patent_app_type] => utility [patent_app_number] => 17/828844 [patent_app_country] => US [patent_app_date] => 2022-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8824 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17828844 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/828844
Semiconductor device with inductive component and method of forming May 30, 2022 Issued
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