Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9345605 [patent_doc_number] => 08664755 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-03-04 [patent_title] => 'Power module package and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/247603 [patent_app_country] => US [patent_app_date] => 2011-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 6631 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13247603 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/247603
Power module package and method for manufacturing the same Sep 27, 2011 Issued
Array ( [id] => 8730348 [patent_doc_number] => 20130075917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-03-28 [patent_title] => 'Multi-Chip and Multi-Substrate Reconstitution Based Packaging' [patent_app_type] => utility [patent_app_number] => 13/246465 [patent_app_country] => US [patent_app_date] => 2011-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4522 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13246465 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/246465
Multi-chip and multi-substrate reconstitution based packaging Sep 26, 2011 Issued
Array ( [id] => 8166465 [patent_doc_number] => 20120104607 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-05-03 [patent_title] => 'STACKED SEMICONDUCTOR PACKAGES AND RELATED METHODS' [patent_app_type] => utility [patent_app_number] => 13/246408 [patent_app_country] => US [patent_app_date] => 2011-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4107 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0104/20120104607.pdf [firstpage_image] =>[orig_patent_app_number] => 13246408 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/246408
Stacked semiconductor packages and related methods Sep 26, 2011 Issued
Array ( [id] => 9021048 [patent_doc_number] => 08531034 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-10 [patent_title] => 'Semiconductor package and package on package having the same' [patent_app_type] => utility [patent_app_number] => 13/244506 [patent_app_country] => US [patent_app_date] => 2011-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 7527 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13244506 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/244506
Semiconductor package and package on package having the same Sep 24, 2011 Issued
Array ( [id] => 9086950 [patent_doc_number] => 08558381 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-10-15 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/239800 [patent_app_country] => US [patent_app_date] => 2011-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3691 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13239800 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/239800
Semiconductor device Sep 21, 2011 Issued
Array ( [id] => 8914078 [patent_doc_number] => 20130175703 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-11 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/821782 [patent_app_country] => US [patent_app_date] => 2011-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6284 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13821782 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/821782
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Sep 21, 2011
Array ( [id] => 9227392 [patent_doc_number] => 08633060 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-21 [patent_title] => 'Semiconductor device production method and semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/238740 [patent_app_country] => US [patent_app_date] => 2011-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 9246 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13238740 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/238740
Semiconductor device production method and semiconductor device Sep 20, 2011 Issued
Array ( [id] => 9010030 [patent_doc_number] => 08525332 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-03 [patent_title] => 'Semiconductor device having semiconductor substrate, and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/230395 [patent_app_country] => US [patent_app_date] => 2011-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 43 [patent_no_of_words] => 5500 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13230395 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/230395
Semiconductor device having semiconductor substrate, and method of manufacturing the same Sep 11, 2011 Issued
Array ( [id] => 7666905 [patent_doc_number] => 20110316174 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-29 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE' [patent_app_type] => utility [patent_app_number] => 13/224649 [patent_app_country] => US [patent_app_date] => 2011-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6526 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13224649 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/224649
Semiconductor integrated circuit device Sep 1, 2011 Issued
Array ( [id] => 8275093 [patent_doc_number] => 20120168959 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-07-05 [patent_title] => 'PACKAGE SUBSTRATE HAVING A THROUGH HOLE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/197177 [patent_app_country] => US [patent_app_date] => 2011-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2126 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13197177 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/197177
Package substrate having a through hole and method of fabricating the same Aug 2, 2011 Issued
Array ( [id] => 8647215 [patent_doc_number] => 20130032944 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/195187 [patent_app_country] => US [patent_app_date] => 2011-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 9547 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195187 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/195187
Microelectronic package with stacked microelectronic elements and method for manufacture thereof Jul 31, 2011 Issued
Array ( [id] => 8910063 [patent_doc_number] => 08482131 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-09 [patent_title] => 'Via structure' [patent_app_type] => utility [patent_app_number] => 13/194986 [patent_app_country] => US [patent_app_date] => 2011-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2536 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13194986 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/194986
Via structure Jul 30, 2011 Issued
Array ( [id] => 8932573 [patent_doc_number] => 08492272 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-23 [patent_title] => 'Passivated through wafer vias in low-doped semiconductor substrates' [patent_app_type] => utility [patent_app_number] => 13/193991 [patent_app_country] => US [patent_app_date] => 2011-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 23 [patent_no_of_words] => 5719 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13193991 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/193991
Passivated through wafer vias in low-doped semiconductor substrates Jul 28, 2011 Issued
Array ( [id] => 8180234 [patent_doc_number] => 20120112346 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-05-10 [patent_title] => 'THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/193413 [patent_app_country] => US [patent_app_date] => 2011-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8192 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0112/20120112346.pdf [firstpage_image] =>[orig_patent_app_number] => 13193413 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/193413
Thin-film transistor substrate and method of manufacturing the same Jul 27, 2011 Issued
Array ( [id] => 9483760 [patent_doc_number] => 08729713 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-20 [patent_title] => 'Via structure and method thereof' [patent_app_type] => utility [patent_app_number] => 13/193313 [patent_app_country] => US [patent_app_date] => 2011-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 22 [patent_no_of_words] => 7914 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13193313 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/193313
Via structure and method thereof Jul 27, 2011 Issued
Array ( [id] => 8634830 [patent_doc_number] => 20130026633 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-31 [patent_title] => 'Multilayer Metallization with Stress-Reducing Interlayer' [patent_app_type] => utility [patent_app_number] => 13/192376 [patent_app_country] => US [patent_app_date] => 2011-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2750 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13192376 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/192376
Multilayer metallization with stress-reducing interlayer Jul 26, 2011 Issued
Array ( [id] => 9818343 [patent_doc_number] => 08928132 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-06 [patent_title] => 'Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package' [patent_app_type] => utility [patent_app_number] => 13/188554 [patent_app_country] => US [patent_app_date] => 2011-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 65 [patent_no_of_words] => 21296 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13188554 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/188554
Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package Jul 21, 2011 Issued
Array ( [id] => 9389941 [patent_doc_number] => 08686545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-01 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/394430 [patent_app_country] => US [patent_app_date] => 2011-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 6661 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13394430 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/394430
Semiconductor device and method for manufacturing the same Jul 20, 2011 Issued
Array ( [id] => 7571034 [patent_doc_number] => 20110266690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-03 [patent_title] => 'SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS' [patent_app_type] => utility [patent_app_number] => 13/185039 [patent_app_country] => US [patent_app_date] => 2011-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7886 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20110266690.pdf [firstpage_image] =>[orig_patent_app_number] => 13185039 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/185039
Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus Jul 17, 2011 Issued
Array ( [id] => 9010004 [patent_doc_number] => 08525305 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-09-03 [patent_title] => 'Lead carrier with print-formed package components' [patent_app_type] => utility [patent_app_number] => 13/135210 [patent_app_country] => US [patent_app_date] => 2011-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 18 [patent_no_of_words] => 6269 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13135210 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/135210
Lead carrier with print-formed package components Jun 27, 2011 Issued
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