
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6256057
[patent_doc_number] => 20100295090
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-25
[patent_title] => 'MOUNT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/850213
[patent_app_country] => US
[patent_app_date] => 2010-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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Array
(
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[patent_doc_number] => RE043663
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[patent_kind] => E1
[patent_issue_date] => 2012-09-18
[patent_title] => 'Semiconductor device'
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Array
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[patent_issue_date] => 2014-11-25
[patent_title] => 'Electronic device and fabrication method thereof'
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Array
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Array
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Array
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Array
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[patent_issue_date] => 2015-01-06
[patent_title] => 'Complete power management system implemented in a single surface mount package'
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Array
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[id] => 6507030
[patent_doc_number] => 20100219421
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[patent_issue_date] => 2010-09-02
[patent_title] => 'METHOD AND SYSTEM FOR ELECTRICALLY COUPLING A CHIP TO CHIP PACKAGE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/777118 | Method and system for electrically coupling a chip to chip package | May 9, 2010 | Issued |
Array
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[patent_title] => 'Integrated circuit package-in-package system and method for making thereof'
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Array
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[id] => 6507452
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[patent_title] => 'CARRIER ASSEMBLY FOR AN INTEGRATED CIRCUIT'
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Array
(
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Array
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Array
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Array
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