
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6614941
[patent_doc_number] => 20100224999
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-09
[patent_title] => 'Method for Producing Metallic Interconnect Lines'
[patent_app_type] => utility
[patent_app_number] => 12/718587
[patent_app_country] => US
[patent_app_date] => 2010-03-05
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[pdf_file] => publications/A1/0224/20100224999.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/718587 | Method for producing metallic interconnect lines | Mar 4, 2010 | Issued |
Array
(
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[patent_kind] => B2
[patent_issue_date] => 2013-07-23
[patent_title] => 'Bump, method for forming the bump, and method for mounting substrate having the bump thereon'
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Array
(
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[patent_issue_date] => 2013-05-07
[patent_title] => 'Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof'
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Array
(
[id] => 8258113
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[patent_kind] => B2
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[patent_title] => 'Semiconductor memory device'
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[patent_app_number] => 12/718374
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Array
(
[id] => 6484921
[patent_doc_number] => 20100258930
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[patent_issue_date] => 2010-10-14
[patent_title] => 'Stacked semiconductor package and method of manufacturing thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/659330 | Stacked semiconductor package and method of manufacturing thereof | Mar 3, 2010 | Issued |
Array
(
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[patent_doc_number] => 08586467
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[patent_issue_date] => 2013-11-19
[patent_title] => 'Method of mounting electronic component and mounting substrate'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/138582 | Method of mounting electronic component and mounting substrate | Feb 24, 2010 | Issued |
Array
(
[id] => 6479285
[patent_doc_number] => 20100213620
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[patent_issue_date] => 2010-08-26
[patent_title] => 'Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package'
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[patent_app_number] => 12/656866
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/656866 | Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package | Feb 17, 2010 | Issued |
Array
(
[id] => 7763639
[patent_doc_number] => 08115306
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-14
[patent_title] => 'Apparatus and method for packaging circuits'
[patent_app_type] => utility
[patent_app_number] => 12/705277
[patent_app_country] => US
[patent_app_date] => 2010-02-12
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[pdf_file] => patents/08/115/08115306.pdf
[firstpage_image] =>[orig_patent_app_number] => 12705277
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/705277 | Apparatus and method for packaging circuits | Feb 11, 2010 | Issued |
Array
(
[id] => 7577418
[patent_doc_number] => 20110291300
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-01
[patent_title] => 'DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/147127
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[firstpage_image] =>[orig_patent_app_number] => 13147127
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/147127 | DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE | Feb 9, 2010 | Abandoned |
Array
(
[id] => 7577400
[patent_doc_number] => 20110291282
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-01
[patent_title] => 'JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR JUNCTION BODY'
[patent_app_type] => utility
[patent_app_number] => 13/148150
[patent_app_country] => US
[patent_app_date] => 2010-02-02
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[firstpage_image] =>[orig_patent_app_number] => 13148150
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/148150 | Junction body, semiconductor module, and manufacturing method for junction body | Feb 1, 2010 | Issued |
Array
(
[id] => 8071631
[patent_doc_number] => 20110241209
[patent_country] => US
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[patent_issue_date] => 2011-10-06
[patent_title] => 'Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power'
[patent_app_type] => utility
[patent_app_number] => 12/998802
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[patent_app_date] => 2010-01-28
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Array
(
[id] => 6433245
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[patent_kind] => A1
[patent_issue_date] => 2010-07-29
[patent_title] => '3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES'
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Array
(
[id] => 7586628
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[patent_issue_date] => 2011-11-17
[patent_title] => 'METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD,METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/144112 | Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same | Jan 25, 2010 | Issued |
Array
(
[id] => 6494896
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[patent_title] => 'High current capacity inner leads for semiconductor device'
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Array
(
[id] => 4634981
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[patent_title] => 'Semiconductor module'
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Array
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[patent_title] => 'Adhesive Flexible Barrier Film, Method Of Forming Same, And Organic Electronic Device Including Same'
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/651122 | Supply voltage or ground connections for integrated circuit device | Dec 30, 2009 | Issued |
Array
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