
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6352870
[patent_doc_number] => 20100072625
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-03-25
[patent_title] => 'Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer level'
[patent_app_type] => utility
[patent_app_number] => 12/461511
[patent_app_country] => US
[patent_app_date] => 2009-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3384
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0072/20100072625.pdf
[firstpage_image] =>[orig_patent_app_number] => 12461511
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/461511 | Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer level | Aug 12, 2009 | Issued |
Array
(
[id] => 7703391
[patent_doc_number] => 08089148
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-01-03
[patent_title] => 'Circuit board and semiconductor device having the same'
[patent_app_type] => utility
[patent_app_number] => 12/539116
[patent_app_country] => US
[patent_app_date] => 2009-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 2875
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/089/08089148.pdf
[firstpage_image] =>[orig_patent_app_number] => 12539116
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/539116 | Circuit board and semiconductor device having the same | Aug 10, 2009 | Issued |
Array
(
[id] => 8982690
[patent_doc_number] => 08513810
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-08-20
[patent_title] => 'Semiconductor device and method of manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 13/003848
[patent_app_country] => US
[patent_app_date] => 2009-07-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 4699
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13003848
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/003848 | Semiconductor device and method of manufacturing same | Jul 28, 2009 | Issued |
Array
(
[id] => 6247311
[patent_doc_number] => 20100025843
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-04
[patent_title] => 'Optical semiconductor apparatus'
[patent_app_type] => utility
[patent_app_number] => 12/462125
[patent_app_country] => US
[patent_app_date] => 2009-07-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4460
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0025/20100025843.pdf
[firstpage_image] =>[orig_patent_app_number] => 12462125
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/462125 | Optical semiconductor apparatus | Jul 28, 2009 | Issued |
Array
(
[id] => 6247307
[patent_doc_number] => 20100025839
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-04
[patent_title] => 'Leadframe, semiconductor device, and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 12/458951
[patent_app_country] => US
[patent_app_date] => 2009-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3913
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0025/20100025839.pdf
[firstpage_image] =>[orig_patent_app_number] => 12458951
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/458951 | Leadframe, semiconductor device, and method of manufacturing the same | Jul 27, 2009 | Issued |
Array
(
[id] => 8630550
[patent_doc_number] => 08362623
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-01-29
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/133891
[patent_app_country] => US
[patent_app_date] => 2009-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 5450
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13133891
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/133891 | Semiconductor device and method for manufacturing the same | Jul 26, 2009 | Issued |
Array
(
[id] => 6336840
[patent_doc_number] => 20100019375
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-28
[patent_title] => 'Housing for a semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 12/460567
[patent_app_country] => US
[patent_app_date] => 2009-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2406
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0019/20100019375.pdf
[firstpage_image] =>[orig_patent_app_number] => 12460567
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/460567 | Housing for a semiconductor component | Jul 19, 2009 | Issued |
Array
(
[id] => 5558308
[patent_doc_number] => 20090269885
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-29
[patent_title] => 'PACKAGED SEMICONDUCTOR DEVICE WITH DUAL EXPOSED SURFACES AND METHOD OF MANUFACTURING'
[patent_app_type] => utility
[patent_app_number] => 12/499893
[patent_app_country] => US
[patent_app_date] => 2009-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5278
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0269/20090269885.pdf
[firstpage_image] =>[orig_patent_app_number] => 12499893
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/499893 | Packaged semiconductor device with dual exposed surfaces and method of manufacturing | Jul 8, 2009 | Issued |
Array
(
[id] => 8303873
[patent_doc_number] => RE043536
[patent_country] => US
[patent_kind] => E1
[patent_issue_date] => 2012-07-24
[patent_title] => 'Stackable layer containing ball grid array package'
[patent_app_type] => reissue
[patent_app_number] => 12/500434
[patent_app_country] => US
[patent_app_date] => 2009-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 2421
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12500434
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/500434 | Stackable layer containing ball grid array package | Jul 8, 2009 | Issued |
Array
(
[id] => 5299463
[patent_doc_number] => 20090294115
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-03
[patent_title] => 'Thermal Interconnect System and Production Thereof'
[patent_app_type] => utility
[patent_app_number] => 12/495118
[patent_app_country] => US
[patent_app_date] => 2009-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4683
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0294/20090294115.pdf
[firstpage_image] =>[orig_patent_app_number] => 12495118
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/495118 | Thermal Interconnect System and Production Thereof | Jun 29, 2009 | Abandoned |
Array
(
[id] => 5461712
[patent_doc_number] => 20090321912
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-31
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 12/457896
[patent_app_country] => US
[patent_app_date] => 2009-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5541
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0321/20090321912.pdf
[firstpage_image] =>[orig_patent_app_number] => 12457896
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/457896 | Semiconductor device and method of manufacturing the same | Jun 23, 2009 | Issued |
Array
(
[id] => 8458600
[patent_doc_number] => 08294271
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-23
[patent_title] => 'Gold-tin-indium solder for processing compatibility with lead-free tin-based solder'
[patent_app_type] => utility
[patent_app_number] => 12/996825
[patent_app_country] => US
[patent_app_date] => 2009-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1215
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12996825
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/996825 | Gold-tin-indium solder for processing compatibility with lead-free tin-based solder | Jun 17, 2009 | Issued |
Array
(
[id] => 6369161
[patent_doc_number] => 20100314750
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-16
[patent_title] => 'Integrated circuit package having security feature and method of manufacturing\nsame'
[patent_app_type] => utility
[patent_app_number] => 12/456450
[patent_app_country] => US
[patent_app_date] => 2009-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4046
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0314/20100314750.pdf
[firstpage_image] =>[orig_patent_app_number] => 12456450
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/456450 | Integrated circuit package having security feature and method of manufacturing same | Jun 15, 2009 | Issued |
Array
(
[id] => 5372753
[patent_doc_number] => 20090310313
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-17
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 12/457522
[patent_app_country] => US
[patent_app_date] => 2009-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2812
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0310/20090310313.pdf
[firstpage_image] =>[orig_patent_app_number] => 12457522
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/457522 | Semiconductor module | Jun 14, 2009 | Issued |
Array
(
[id] => 7519294
[patent_doc_number] => 07973397
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Package substrate having embedded semiconductor chip and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/483528
[patent_app_country] => US
[patent_app_date] => 2009-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 17
[patent_no_of_words] => 4284
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/973/07973397.pdf
[firstpage_image] =>[orig_patent_app_number] => 12483528
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/483528 | Package substrate having embedded semiconductor chip and fabrication method thereof | Jun 11, 2009 | Issued |
Array
(
[id] => 7763648
[patent_doc_number] => 08115310
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-14
[patent_title] => 'Copper pillar bonding for fine pitch flip chip devices'
[patent_app_type] => utility
[patent_app_number] => 12/482855
[patent_app_country] => US
[patent_app_date] => 2009-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 3300
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/115/08115310.pdf
[firstpage_image] =>[orig_patent_app_number] => 12482855
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/482855 | Copper pillar bonding for fine pitch flip chip devices | Jun 10, 2009 | Issued |
Array
(
[id] => 6586227
[patent_doc_number] => 20100308462
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-09
[patent_title] => 'GLASS COMPOSITIONS USED IN CONDUCTORS FOR PHOTOVOLTAIC CELLS'
[patent_app_type] => utility
[patent_app_number] => 12/479965
[patent_app_country] => US
[patent_app_date] => 2009-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6240
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0308/20100308462.pdf
[firstpage_image] =>[orig_patent_app_number] => 12479965
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/479965 | Glass compositions used in conductors for photovoltaic cells | Jun 7, 2009 | Issued |
Array
(
[id] => 8592383
[patent_doc_number] => 08350259
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-01-08
[patent_title] => 'Electronic circuit'
[patent_app_type] => utility
[patent_app_number] => 12/994170
[patent_app_country] => US
[patent_app_date] => 2009-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 4431
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 203
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12994170
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/994170 | Electronic circuit | May 28, 2009 | Issued |
Array
(
[id] => 8085501
[patent_doc_number] => 08150081
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-03
[patent_title] => 'Method for optimizing a multilevel filter bank and corresponding filter bank and hearing apparatus'
[patent_app_type] => utility
[patent_app_number] => 12/469030
[patent_app_country] => US
[patent_app_date] => 2009-05-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 3733
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/150/08150081.pdf
[firstpage_image] =>[orig_patent_app_number] => 12469030
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/469030 | Method for optimizing a multilevel filter bank and corresponding filter bank and hearing apparatus | May 19, 2009 | Issued |
Array
(
[id] => 8909302
[patent_doc_number] => 08481365
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-07-09
[patent_title] => 'MEMS devices'
[patent_app_type] => utility
[patent_app_number] => 12/995100
[patent_app_country] => US
[patent_app_date] => 2009-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2321
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12995100
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/995100 | MEMS devices | May 18, 2009 | Issued |