
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4435381
[patent_doc_number] => 07898067
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-01
[patent_title] => 'Pre-molded, clip-bonded multi-die semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 12/262486
[patent_app_country] => US
[patent_app_date] => 2008-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3094
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/898/07898067.pdf
[firstpage_image] =>[orig_patent_app_number] => 12262486
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/262486 | Pre-molded, clip-bonded multi-die semiconductor package | Oct 30, 2008 | Issued |
Array
(
[id] => 5383148
[patent_doc_number] => 20090224392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-10
[patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/261112
[patent_app_country] => US
[patent_app_date] => 2008-10-30
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/261112 | Semiconductor package having side walls and method for manufacturing the same | Oct 29, 2008 | Issued |
Array
(
[id] => 8018177
[patent_doc_number] => 08138593
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-03-20
[patent_title] => 'Packaged microchip with spacer for mitigating electrical leakage between components'
[patent_app_type] => utility
[patent_app_number] => 12/255012
[patent_app_country] => US
[patent_app_date] => 2008-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3515
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/255012 | Packaged microchip with spacer for mitigating electrical leakage between components | Oct 20, 2008 | Issued |
Array
(
[id] => 6479043
[patent_doc_number] => 20100213597
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-26
[patent_title] => 'SEMICONDUCTOR ELEMENT MOUNTING BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/682649
[patent_app_country] => US
[patent_app_date] => 2008-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[firstpage_image] =>[orig_patent_app_number] => 12682649
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/682649 | Semiconductor element mounting board | Oct 14, 2008 | Issued |
Array
(
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[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/285832 | Semiconductor device and method of manufacturing the same | Oct 14, 2008 | Issued |
Array
(
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[patent_title] => 'SEMICONDUCTOR DEVICE'
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Array
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Array
(
[id] => 4479771
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[patent_issue_date] => 2011-03-15
[patent_title] => 'Semiconductor device having spacer formed on semiconductor chip connected with wire'
[patent_app_type] => utility
[patent_app_number] => 12/285752
[patent_app_country] => US
[patent_app_date] => 2008-10-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/285752 | Semiconductor device having spacer formed on semiconductor chip connected with wire | Oct 13, 2008 | Issued |
Array
(
[id] => 5413596
[patent_doc_number] => 20090039483
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'HEAT SLUG AND SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2008-10-14
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[firstpage_image] =>[orig_patent_app_number] => 12251116
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/251116 | Heat slug and semiconductor package | Oct 13, 2008 | Issued |
Array
(
[id] => 4433548
[patent_doc_number] => 07969004
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[patent_issue_date] => 2011-06-28
[patent_title] => 'Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/244856
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[patent_app_date] => 2008-10-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/244856 | Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device | Oct 2, 2008 | Issued |
Array
(
[id] => 6358998
[patent_doc_number] => 20100078812
[patent_country] => US
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[patent_issue_date] => 2010-04-01
[patent_title] => 'WINDOW BGA SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/242315
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Array
(
[id] => 6358601
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[patent_title] => 'MIIM DIODES HAVING STACKED STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/240785 | MIIM diodes having stacked structure | Sep 28, 2008 | Issued |
Array
(
[id] => 7515871
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Array
(
[id] => 4443751
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Array
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Array
(
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Array
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