Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4435381 [patent_doc_number] => 07898067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-01 [patent_title] => 'Pre-molded, clip-bonded multi-die semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/262486 [patent_app_country] => US [patent_app_date] => 2008-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 3094 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/898/07898067.pdf [firstpage_image] =>[orig_patent_app_number] => 12262486 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/262486
Pre-molded, clip-bonded multi-die semiconductor package Oct 30, 2008 Issued
Array ( [id] => 5383148 [patent_doc_number] => 20090224392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-09-10 [patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/261112 [patent_app_country] => US [patent_app_date] => 2008-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9669 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20090224392.pdf [firstpage_image] =>[orig_patent_app_number] => 12261112 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/261112
Semiconductor package having side walls and method for manufacturing the same Oct 29, 2008 Issued
Array ( [id] => 8018177 [patent_doc_number] => 08138593 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-20 [patent_title] => 'Packaged microchip with spacer for mitigating electrical leakage between components' [patent_app_type] => utility [patent_app_number] => 12/255012 [patent_app_country] => US [patent_app_date] => 2008-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3515 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/138/08138593.pdf [firstpage_image] =>[orig_patent_app_number] => 12255012 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/255012
Packaged microchip with spacer for mitigating electrical leakage between components Oct 20, 2008 Issued
Array ( [id] => 6479043 [patent_doc_number] => 20100213597 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-26 [patent_title] => 'SEMICONDUCTOR ELEMENT MOUNTING BOARD' [patent_app_type] => utility [patent_app_number] => 12/682649 [patent_app_country] => US [patent_app_date] => 2008-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 11105 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0213/20100213597.pdf [firstpage_image] =>[orig_patent_app_number] => 12682649 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/682649
Semiconductor element mounting board Oct 14, 2008 Issued
Array ( [id] => 5282437 [patent_doc_number] => 20090096111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/285832 [patent_app_country] => US [patent_app_date] => 2008-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4384 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20090096111.pdf [firstpage_image] =>[orig_patent_app_number] => 12285832 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/285832
Semiconductor device and method of manufacturing the same Oct 14, 2008 Issued
Array ( [id] => 5395550 [patent_doc_number] => 20090315613 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-24 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/251845 [patent_app_country] => US [patent_app_date] => 2008-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5241 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0315/20090315613.pdf [firstpage_image] =>[orig_patent_app_number] => 12251845 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/251845
Semiconductor device Oct 14, 2008 Issued
Array ( [id] => 8835084 [patent_doc_number] => 08450843 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-05-28 [patent_title] => 'Semiconductor device and method for designing the same' [patent_app_type] => utility [patent_app_number] => 12/682369 [patent_app_country] => US [patent_app_date] => 2008-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 6811 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12682369 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/682369
Semiconductor device and method for designing the same Oct 13, 2008 Issued
Array ( [id] => 4479771 [patent_doc_number] => 07906854 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-15 [patent_title] => 'Semiconductor device having spacer formed on semiconductor chip connected with wire' [patent_app_type] => utility [patent_app_number] => 12/285752 [patent_app_country] => US [patent_app_date] => 2008-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 7469 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/906/07906854.pdf [firstpage_image] =>[orig_patent_app_number] => 12285752 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/285752
Semiconductor device having spacer formed on semiconductor chip connected with wire Oct 13, 2008 Issued
Array ( [id] => 5413596 [patent_doc_number] => 20090039483 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-12 [patent_title] => 'HEAT SLUG AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/251116 [patent_app_country] => US [patent_app_date] => 2008-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2538 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0039/20090039483.pdf [firstpage_image] =>[orig_patent_app_number] => 12251116 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/251116
Heat slug and semiconductor package Oct 13, 2008 Issued
Array ( [id] => 4433548 [patent_doc_number] => 07969004 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-06-28 [patent_title] => 'Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/244856 [patent_app_country] => US [patent_app_date] => 2008-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 36 [patent_no_of_words] => 5860 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/969/07969004.pdf [firstpage_image] =>[orig_patent_app_number] => 12244856 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/244856
Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device Oct 2, 2008 Issued
Array ( [id] => 6358998 [patent_doc_number] => 20100078812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-04-01 [patent_title] => 'WINDOW BGA SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/242315 [patent_app_country] => US [patent_app_date] => 2008-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4673 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0078/20100078812.pdf [firstpage_image] =>[orig_patent_app_number] => 12242315 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/242315
Window BGA semiconductor package Sep 29, 2008 Issued
Array ( [id] => 6358601 [patent_doc_number] => 20100078759 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-04-01 [patent_title] => 'MIIM DIODES HAVING STACKED STRUCTURE' [patent_app_type] => utility [patent_app_number] => 12/240785 [patent_app_country] => US [patent_app_date] => 2008-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 11019 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0078/20100078759.pdf [firstpage_image] =>[orig_patent_app_number] => 12240785 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/240785
MIIM diodes having stacked structure Sep 28, 2008 Issued
Array ( [id] => 7515871 [patent_doc_number] => 08039943 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-18 [patent_title] => 'Semiconductor device and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 12/239566 [patent_app_country] => US [patent_app_date] => 2008-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 42 [patent_no_of_words] => 6814 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/039/08039943.pdf [firstpage_image] =>[orig_patent_app_number] => 12239566 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/239566
Semiconductor device and manufacturing method therefor Sep 25, 2008 Issued
Array ( [id] => 4443751 [patent_doc_number] => 07928564 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-19 [patent_title] => 'Multichip module package and fabrication method' [patent_app_type] => utility [patent_app_number] => 12/237276 [patent_app_country] => US [patent_app_date] => 2008-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3124 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/928/07928564.pdf [firstpage_image] =>[orig_patent_app_number] => 12237276 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/237276
Multichip module package and fabrication method Sep 23, 2008 Issued
Array ( [id] => 5282421 [patent_doc_number] => 20090096095 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/232786 [patent_app_country] => US [patent_app_date] => 2008-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4160 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20090096095.pdf [firstpage_image] =>[orig_patent_app_number] => 12232786 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/232786
Semiconductor device and method of manufacturing the same Sep 23, 2008 Issued
Array ( [id] => 6352875 [patent_doc_number] => 20100072626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-25 [patent_title] => 'WAFER LEVEL PACKAGED MEMS INTEGRATED CIRCUIT' [patent_app_type] => utility [patent_app_number] => 12/234406 [patent_app_country] => US [patent_app_date] => 2008-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3965 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0072/20100072626.pdf [firstpage_image] =>[orig_patent_app_number] => 12234406 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/234406
Wafer level packaged MEMS integrated circuit Sep 18, 2008 Issued
Array ( [id] => 8258114 [patent_doc_number] => 08207612 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-26 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 12/682383 [patent_app_country] => US [patent_app_date] => 2008-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 14641 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 241 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12682383 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/682383
Semiconductor device and manufacturing method thereof Sep 18, 2008 Issued
Array ( [id] => 4570695 [patent_doc_number] => 07847380 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-07 [patent_title] => 'Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card' [patent_app_type] => utility [patent_app_number] => 12/212575 [patent_app_country] => US [patent_app_date] => 2008-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 2947 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/847/07847380.pdf [firstpage_image] =>[orig_patent_app_number] => 12212575 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/212575
Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card Sep 16, 2008 Issued
Array ( [id] => 7530828 [patent_doc_number] => 07843051 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-30 [patent_title] => 'Semiconductor package and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/212566 [patent_app_country] => US [patent_app_date] => 2008-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 4495 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/843/07843051.pdf [firstpage_image] =>[orig_patent_app_number] => 12212566 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/212566
Semiconductor package and method of fabricating the same Sep 16, 2008 Issued
Array ( [id] => 6557500 [patent_doc_number] => 20100289146 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-18 [patent_title] => 'Electronic System and Method for Manufacturing a Three-Dimensional Electronic System' [patent_app_type] => utility [patent_app_number] => 12/678473 [patent_app_country] => US [patent_app_date] => 2008-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7393 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 20 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0289/20100289146.pdf [firstpage_image] =>[orig_patent_app_number] => 12678473 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/678473
Electronic system and method for manufacturing a three-dimensional electronic system Sep 16, 2008 Issued
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