Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6369233 [patent_doc_number] => 20100314762 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-16 [patent_title] => 'Semiconductor Substrate with Through-Contact and Method for Production Thereof' [patent_app_type] => utility [patent_app_number] => 12/670303 [patent_app_country] => US [patent_app_date] => 2008-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5745 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0314/20100314762.pdf [firstpage_image] =>[orig_patent_app_number] => 12670303 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/670303
Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Jul 22, 2008 Issued
Array ( [id] => 4777786 [patent_doc_number] => 20080285784 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-20 [patent_title] => 'Package structure of a microphone' [patent_app_type] => utility [patent_app_number] => 12/219276 [patent_app_country] => US [patent_app_date] => 2008-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2950 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0285/20080285784.pdf [firstpage_image] =>[orig_patent_app_number] => 12219276 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/219276
Package structure of a microphone Jul 17, 2008 Issued
Array ( [id] => 14539 [patent_doc_number] => 07808113 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion' [patent_app_type] => utility [patent_app_number] => 12/171026 [patent_app_country] => US [patent_app_date] => 2008-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4502 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/808/07808113.pdf [firstpage_image] =>[orig_patent_app_number] => 12171026 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/171026
Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion Jul 9, 2008 Issued
Array ( [id] => 5407431 [patent_doc_number] => 20090121329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-14 [patent_title] => 'LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF' [patent_app_type] => utility [patent_app_number] => 12/167622 [patent_app_country] => US [patent_app_date] => 2008-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3464 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20090121329.pdf [firstpage_image] =>[orig_patent_app_number] => 12167622 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/167622
Lead frame structure and applications thereof Jul 2, 2008 Issued
Array ( [id] => 7797463 [patent_doc_number] => 08126174 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-28 [patent_title] => 'Hearing device with a multi-stage activation circuit and method for operating it' [patent_app_type] => utility [patent_app_number] => 12/217416 [patent_app_country] => US [patent_app_date] => 2008-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 5517 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/126/08126174.pdf [firstpage_image] =>[orig_patent_app_number] => 12217416 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/217416
Hearing device with a multi-stage activation circuit and method for operating it Jul 2, 2008 Issued
Array ( [id] => 4457687 [patent_doc_number] => 07893527 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-22 [patent_title] => 'Semiconductor plastic package and fabricating method thereof' [patent_app_type] => utility [patent_app_number] => 12/216375 [patent_app_country] => US [patent_app_date] => 2008-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8777 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/893/07893527.pdf [firstpage_image] =>[orig_patent_app_number] => 12216375 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/216375
Semiconductor plastic package and fabricating method thereof Jul 1, 2008 Issued
Array ( [id] => 4526930 [patent_doc_number] => 07952175 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-31 [patent_title] => 'Lead frame, semiconductor package including the lead frame and method of forming the lead frame' [patent_app_type] => utility [patent_app_number] => 12/217195 [patent_app_country] => US [patent_app_date] => 2008-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4363 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/952/07952175.pdf [firstpage_image] =>[orig_patent_app_number] => 12217195 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/217195
Lead frame, semiconductor package including the lead frame and method of forming the lead frame Jul 1, 2008 Issued
Array ( [id] => 5293844 [patent_doc_number] => 20090008770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-08 [patent_title] => 'HEAT DISSIPATION PLATE AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/164396 [patent_app_country] => US [patent_app_date] => 2008-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2622 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20090008770.pdf [firstpage_image] =>[orig_patent_app_number] => 12164396 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/164396
Heat dissipation plate and semiconductor device Jun 29, 2008 Issued
Array ( [id] => 4489124 [patent_doc_number] => 07884461 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-08 [patent_title] => 'System-in-package and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 12/217086 [patent_app_country] => US [patent_app_date] => 2008-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3731 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/884/07884461.pdf [firstpage_image] =>[orig_patent_app_number] => 12217086 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/217086
System-in-package and manufacturing method of the same Jun 29, 2008 Issued
Array ( [id] => 5461729 [patent_doc_number] => 20090321929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-31 [patent_title] => 'Standing chip scale package' [patent_app_type] => utility [patent_app_number] => 12/217136 [patent_app_country] => US [patent_app_date] => 2008-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6456 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0321/20090321929.pdf [firstpage_image] =>[orig_patent_app_number] => 12217136 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/217136
Standing chip scale package Jun 29, 2008 Issued
Array ( [id] => 7778072 [patent_doc_number] => 08121320 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-21 [patent_title] => 'Hearing aid' [patent_app_type] => utility [patent_app_number] => 12/147113 [patent_app_country] => US [patent_app_date] => 2008-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2740 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/121/08121320.pdf [firstpage_image] =>[orig_patent_app_number] => 12147113 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/147113
Hearing aid Jun 25, 2008 Issued
Array ( [id] => 5461699 [patent_doc_number] => 20090321899 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-31 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM STACKABLE DEVICES' [patent_app_type] => utility [patent_app_number] => 12/146101 [patent_app_country] => US [patent_app_date] => 2008-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6675 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0321/20090321899.pdf [firstpage_image] =>[orig_patent_app_number] => 12146101 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/146101
Integrated circuit package system stackable devices Jun 24, 2008 Issued
Array ( [id] => 5461708 [patent_doc_number] => 20090321908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-31 [patent_title] => 'STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSULATION' [patent_app_type] => utility [patent_app_number] => 12/146411 [patent_app_country] => US [patent_app_date] => 2008-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3281 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0321/20090321908.pdf [firstpage_image] =>[orig_patent_app_number] => 12146411 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/146411
Stacked integrated circuit package system with intra-stack encapsulation Jun 24, 2008 Issued
Array ( [id] => 7492387 [patent_doc_number] => 08030752 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-04 [patent_title] => 'Method of manufacturing semiconductor package and semiconductor plastic package using the same' [patent_app_type] => utility [patent_app_number] => 12/213796 [patent_app_country] => US [patent_app_date] => 2008-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 13940 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/030/08030752.pdf [firstpage_image] =>[orig_patent_app_number] => 12213796 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/213796
Method of manufacturing semiconductor package and semiconductor plastic package using the same Jun 23, 2008 Issued
Array ( [id] => 6230642 [patent_doc_number] => 20100184341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-22 [patent_title] => 'ELECTRICAL CONTACT FOR A CADMIUM TELLURIUM COMPONENT' [patent_app_type] => utility [patent_app_number] => 12/666817 [patent_app_country] => US [patent_app_date] => 2008-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5415 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0184/20100184341.pdf [firstpage_image] =>[orig_patent_app_number] => 12666817 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/666817
Electrical contact for a cadmium tellurium component Jun 22, 2008 Issued
Array ( [id] => 5371675 [patent_doc_number] => 20090309235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-17 [patent_title] => 'Method and Apparatus for Wafer Level Integration Using Tapered Vias' [patent_app_type] => utility [patent_app_number] => 12/137242 [patent_app_country] => US [patent_app_date] => 2008-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 7532 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0309/20090309235.pdf [firstpage_image] =>[orig_patent_app_number] => 12137242 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/137242
Method and apparatus for wafer level integration using tapered vias Jun 10, 2008 Issued
Array ( [id] => 7504865 [patent_doc_number] => 08035217 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-11 [patent_title] => 'Semiconductor device and method for manufacturing same' [patent_app_type] => utility [patent_app_number] => 12/135355 [patent_app_country] => US [patent_app_date] => 2008-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 32 [patent_no_of_words] => 7990 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/035/08035217.pdf [firstpage_image] =>[orig_patent_app_number] => 12135355 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/135355
Semiconductor device and method for manufacturing same Jun 8, 2008 Issued
Array ( [id] => 7504893 [patent_doc_number] => 08035226 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-10-11 [patent_title] => 'Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core' [patent_app_type] => utility [patent_app_number] => 12/134026 [patent_app_country] => US [patent_app_date] => 2008-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4524 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/035/08035226.pdf [firstpage_image] =>[orig_patent_app_number] => 12134026 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/134026
Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core Jun 4, 2008 Issued
Array ( [id] => 4708219 [patent_doc_number] => 20080296745 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-04 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA' [patent_app_type] => utility [patent_app_number] => 12/131216 [patent_app_country] => US [patent_app_date] => 2008-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3030 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20080296745.pdf [firstpage_image] =>[orig_patent_app_number] => 12131216 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/131216
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA Jun 1, 2008 Abandoned
Array ( [id] => 5477729 [patent_doc_number] => 20090200686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-13 [patent_title] => 'ELECTRICAL CONNECTING STRUCTURE AND BONDING STRUCTURE' [patent_app_type] => utility [patent_app_number] => 12/129711 [patent_app_country] => US [patent_app_date] => 2008-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2805 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20090200686.pdf [firstpage_image] =>[orig_patent_app_number] => 12129711 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/129711
Electrical connecting structure and bonding structure May 29, 2008 Issued
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