
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6369233
[patent_doc_number] => 20100314762
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-16
[patent_title] => 'Semiconductor Substrate with Through-Contact and Method for Production Thereof'
[patent_app_type] => utility
[patent_app_number] => 12/670303
[patent_app_country] => US
[patent_app_date] => 2008-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5745
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[pdf_file] => publications/A1/0314/20100314762.pdf
[firstpage_image] =>[orig_patent_app_number] => 12670303
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/670303 | Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection | Jul 22, 2008 | Issued |
Array
(
[id] => 4777786
[patent_doc_number] => 20080285784
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-20
[patent_title] => 'Package structure of a microphone'
[patent_app_type] => utility
[patent_app_number] => 12/219276
[patent_app_country] => US
[patent_app_date] => 2008-07-18
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/219276 | Package structure of a microphone | Jul 17, 2008 | Issued |
Array
(
[id] => 14539
[patent_doc_number] => 07808113
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-05
[patent_title] => 'Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion'
[patent_app_type] => utility
[patent_app_number] => 12/171026
[patent_app_country] => US
[patent_app_date] => 2008-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/808/07808113.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/171026 | Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion | Jul 9, 2008 | Issued |
Array
(
[id] => 5407431
[patent_doc_number] => 20090121329
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-14
[patent_title] => 'LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/167622
[patent_app_country] => US
[patent_app_date] => 2008-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/167622 | Lead frame structure and applications thereof | Jul 2, 2008 | Issued |
Array
(
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[patent_title] => 'Hearing device with a multi-stage activation circuit and method for operating it'
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Array
(
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[patent_issue_date] => 2011-02-22
[patent_title] => 'Semiconductor plastic package and fabricating method thereof'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/216375 | Semiconductor plastic package and fabricating method thereof | Jul 1, 2008 | Issued |
Array
(
[id] => 4526930
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[patent_title] => 'Lead frame, semiconductor package including the lead frame and method of forming the lead frame'
[patent_app_type] => utility
[patent_app_number] => 12/217195
[patent_app_country] => US
[patent_app_date] => 2008-07-02
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Array
(
[id] => 5293844
[patent_doc_number] => 20090008770
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'HEAT DISSIPATION PLATE AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/164396
[patent_app_country] => US
[patent_app_date] => 2008-06-30
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[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/164396 | Heat dissipation plate and semiconductor device | Jun 29, 2008 | Issued |
Array
(
[id] => 4489124
[patent_doc_number] => 07884461
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[patent_issue_date] => 2011-02-08
[patent_title] => 'System-in-package and manufacturing method of the same'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/217086 | System-in-package and manufacturing method of the same | Jun 29, 2008 | Issued |
Array
(
[id] => 5461729
[patent_doc_number] => 20090321929
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[patent_issue_date] => 2009-12-31
[patent_title] => 'Standing chip scale package'
[patent_app_type] => utility
[patent_app_number] => 12/217136
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/217136 | Standing chip scale package | Jun 29, 2008 | Issued |
Array
(
[id] => 7778072
[patent_doc_number] => 08121320
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[patent_title] => 'Hearing aid'
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Array
(
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[patent_doc_number] => 20090321899
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/146101 | Integrated circuit package system stackable devices | Jun 24, 2008 | Issued |
Array
(
[id] => 5461708
[patent_doc_number] => 20090321908
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/666817 | Electrical contact for a cadmium tellurium component | Jun 22, 2008 | Issued |
Array
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/129711 | Electrical connecting structure and bonding structure | May 29, 2008 | Issued |