
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4535936
[patent_doc_number] => RE041869
[patent_country] => US
[patent_kind] => E1
[patent_issue_date] => 2010-10-26
[patent_title] => 'Semiconductor device'
[patent_app_type] => reissue
[patent_app_number] => 12/130782
[patent_app_country] => US
[patent_app_date] => 2008-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 17
[patent_no_of_words] => 6780
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/041/RE041869.pdf
[firstpage_image] =>[orig_patent_app_number] => 12130782
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/130782 | Semiconductor device | May 29, 2008 | Issued |
Array
(
[id] => 54847
[patent_doc_number] => 07768005
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[patent_kind] => B2
[patent_issue_date] => 2010-08-03
[patent_title] => 'Physically highly secure multi-chip assembly'
[patent_app_type] => utility
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[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/129040 | Physically highly secure multi-chip assembly | May 28, 2008 | Issued |
Array
(
[id] => 4443748
[patent_doc_number] => 07928563
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[patent_kind] => B2
[patent_issue_date] => 2011-04-19
[patent_title] => '3-D ICs with microfluidic interconnects and methods of constructing same'
[patent_app_type] => utility
[patent_app_number] => 12/128542
[patent_app_country] => US
[patent_app_date] => 2008-05-28
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[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/128542 | 3-D ICs with microfluidic interconnects and methods of constructing same | May 27, 2008 | Issued |
Array
(
[id] => 7752716
[patent_doc_number] => 08110929
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-07
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 12602462
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/602462 | Semiconductor module | May 26, 2008 | Issued |
Array
(
[id] => 4791151
[patent_doc_number] => 20080292124
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[patent_issue_date] => 2008-11-27
[patent_title] => 'HEARING AID PROTECTION DEVICE'
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[patent_app_country] => US
[patent_app_date] => 2008-05-16
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/122202 | HEARING AID PROTECTION DEVICE | May 15, 2008 | Abandoned |
Array
(
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[patent_kind] => B2
[patent_issue_date] => 2010-12-21
[patent_title] => 'Semiconductor wafer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/153086 | Semiconductor wafer | May 13, 2008 | Issued |
Array
(
[id] => 5319886
[patent_doc_number] => 20090057876
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[patent_title] => 'STACKED PACKAGE STRUCTURE FOR REDUCING PACKAGE VOLUME OF AN ACOUSTIC MICRO-SENSOR'
[patent_app_type] => utility
[patent_app_number] => 12/119551
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[pdf_file] => publications/A1/0057/20090057876.pdf
[firstpage_image] =>[orig_patent_app_number] => 12119551
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/119551 | Stacked package structure for reducing package volume of an acoustic micro-sensor | May 12, 2008 | Issued |
Array
(
[id] => 221369
[patent_doc_number] => 07608915
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-10-27
[patent_title] => 'Heat dissipation semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 12/151902
[patent_app_country] => US
[patent_app_date] => 2008-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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Array
(
[id] => 217529
[patent_doc_number] => 07612441
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[patent_kind] => B1
[patent_issue_date] => 2009-11-03
[patent_title] => 'Image-sensing chip package module adapted to dual-side soldering'
[patent_app_type] => utility
[patent_app_number] => 12/149546
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/149546 | Image-sensing chip package module adapted to dual-side soldering | May 4, 2008 | Issued |
Array
(
[id] => 5483312
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[patent_issue_date] => 2009-11-05
[patent_title] => 'MULTI-LID SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/114376
[patent_app_country] => US
[patent_app_date] => 2008-05-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/114376 | Multi-lid semiconductor package | May 1, 2008 | Issued |
Array
(
[id] => 4724020
[patent_doc_number] => 20080203561
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[patent_title] => 'HIGH FREQUENCY DEVICE MODULE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/112656
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/112656 | High frequency device module and manufacturing method thereof | Apr 29, 2008 | Issued |
Array
(
[id] => 24813
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[patent_title] => 'LED assembly with separated thermal and electrical structures thereof'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/110346 | LED assembly with separated thermal and electrical structures thereof | Apr 26, 2008 | Issued |
Array
(
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Array
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/102035 | Final via structures for bond pad-solder ball interconnections | Apr 13, 2008 | Issued |
Array
(
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Array
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