Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4535936 [patent_doc_number] => RE041869 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2010-10-26 [patent_title] => 'Semiconductor device' [patent_app_type] => reissue [patent_app_number] => 12/130782 [patent_app_country] => US [patent_app_date] => 2008-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 6780 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/041/RE041869.pdf [firstpage_image] =>[orig_patent_app_number] => 12130782 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/130782
Semiconductor device May 29, 2008 Issued
Array ( [id] => 54847 [patent_doc_number] => 07768005 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-03 [patent_title] => 'Physically highly secure multi-chip assembly' [patent_app_type] => utility [patent_app_number] => 12/129040 [patent_app_country] => US [patent_app_date] => 2008-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4020 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/768/07768005.pdf [firstpage_image] =>[orig_patent_app_number] => 12129040 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/129040
Physically highly secure multi-chip assembly May 28, 2008 Issued
Array ( [id] => 4443748 [patent_doc_number] => 07928563 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-19 [patent_title] => '3-D ICs with microfluidic interconnects and methods of constructing same' [patent_app_type] => utility [patent_app_number] => 12/128542 [patent_app_country] => US [patent_app_date] => 2008-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4911 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/928/07928563.pdf [firstpage_image] =>[orig_patent_app_number] => 12128542 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/128542
3-D ICs with microfluidic interconnects and methods of constructing same May 27, 2008 Issued
Array ( [id] => 7752716 [patent_doc_number] => 08110929 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Semiconductor module' [patent_app_type] => utility [patent_app_number] => 12/602462 [patent_app_country] => US [patent_app_date] => 2008-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 23 [patent_no_of_words] => 7161 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/110/08110929.pdf [firstpage_image] =>[orig_patent_app_number] => 12602462 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/602462
Semiconductor module May 26, 2008 Issued
Array ( [id] => 4791151 [patent_doc_number] => 20080292124 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-27 [patent_title] => 'HEARING AID PROTECTION DEVICE' [patent_app_type] => utility [patent_app_number] => 12/122202 [patent_app_country] => US [patent_app_date] => 2008-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2904 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0292/20080292124.pdf [firstpage_image] =>[orig_patent_app_number] => 12122202 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/122202
HEARING AID PROTECTION DEVICE May 15, 2008 Abandoned
Array ( [id] => 4577376 [patent_doc_number] => 07855436 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-21 [patent_title] => 'Semiconductor wafer' [patent_app_type] => utility [patent_app_number] => 12/153086 [patent_app_country] => US [patent_app_date] => 2008-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 6716 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/855/07855436.pdf [firstpage_image] =>[orig_patent_app_number] => 12153086 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/153086
Semiconductor wafer May 13, 2008 Issued
Array ( [id] => 5319886 [patent_doc_number] => 20090057876 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-05 [patent_title] => 'STACKED PACKAGE STRUCTURE FOR REDUCING PACKAGE VOLUME OF AN ACOUSTIC MICRO-SENSOR' [patent_app_type] => utility [patent_app_number] => 12/119551 [patent_app_country] => US [patent_app_date] => 2008-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1615 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20090057876.pdf [firstpage_image] =>[orig_patent_app_number] => 12119551 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/119551
Stacked package structure for reducing package volume of an acoustic micro-sensor May 12, 2008 Issued
Array ( [id] => 221369 [patent_doc_number] => 07608915 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-27 [patent_title] => 'Heat dissipation semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/151902 [patent_app_country] => US [patent_app_date] => 2008-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3084 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/608/07608915.pdf [firstpage_image] =>[orig_patent_app_number] => 12151902 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/151902
Heat dissipation semiconductor package May 7, 2008 Issued
Array ( [id] => 217529 [patent_doc_number] => 07612441 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-11-03 [patent_title] => 'Image-sensing chip package module adapted to dual-side soldering' [patent_app_type] => utility [patent_app_number] => 12/149546 [patent_app_country] => US [patent_app_date] => 2008-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3007 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 306 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/612/07612441.pdf [firstpage_image] =>[orig_patent_app_number] => 12149546 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/149546
Image-sensing chip package module adapted to dual-side soldering May 4, 2008 Issued
Array ( [id] => 5483312 [patent_doc_number] => 20090273077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-05 [patent_title] => 'MULTI-LID SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/114376 [patent_app_country] => US [patent_app_date] => 2008-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2112 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0273/20090273077.pdf [firstpage_image] =>[orig_patent_app_number] => 12114376 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/114376
Multi-lid semiconductor package May 1, 2008 Issued
Array ( [id] => 4724020 [patent_doc_number] => 20080203561 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-28 [patent_title] => 'HIGH FREQUENCY DEVICE MODULE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/112656 [patent_app_country] => US [patent_app_date] => 2008-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2138 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0203/20080203561.pdf [firstpage_image] =>[orig_patent_app_number] => 12112656 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/112656
High frequency device module and manufacturing method thereof Apr 29, 2008 Issued
Array ( [id] => 24813 [patent_doc_number] => 07795628 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-14 [patent_title] => 'LED assembly with separated thermal and electrical structures thereof' [patent_app_type] => utility [patent_app_number] => 12/110346 [patent_app_country] => US [patent_app_date] => 2008-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 5433 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/795/07795628.pdf [firstpage_image] =>[orig_patent_app_number] => 12110346 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/110346
LED assembly with separated thermal and electrical structures thereof Apr 26, 2008 Issued
Array ( [id] => 4708226 [patent_doc_number] => 20080296752 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-04 [patent_title] => 'SUBSTRATE WITH PIN, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PRODUCT' [patent_app_type] => utility [patent_app_number] => 12/107966 [patent_app_country] => US [patent_app_date] => 2008-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 8471 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20080296752.pdf [firstpage_image] =>[orig_patent_app_number] => 12107966 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/107966
Substrate with pin, manufacturing method thereof, and semiconductor product Apr 22, 2008 Issued
Array ( [id] => 124203 [patent_doc_number] => 07705469 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-27 [patent_title] => 'Lead frame, semiconductor device using same and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 12/081535 [patent_app_country] => US [patent_app_date] => 2008-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 10999 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705469.pdf [firstpage_image] =>[orig_patent_app_number] => 12081535 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/081535
Lead frame, semiconductor device using same and manufacturing method thereof Apr 16, 2008 Issued
Array ( [id] => 4873245 [patent_doc_number] => 20080199979 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-21 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/104774 [patent_app_country] => US [patent_app_date] => 2008-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9811 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0199/20080199979.pdf [firstpage_image] =>[orig_patent_app_number] => 12104774 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/104774
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Apr 16, 2008 Abandoned
Array ( [id] => 5456105 [patent_doc_number] => 20090256257 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-15 [patent_title] => 'FINAL VIA STRUCTURES FOR BOND PAD-SOLDER BALL INTERCONNECTIONS' [patent_app_type] => utility [patent_app_number] => 12/102035 [patent_app_country] => US [patent_app_date] => 2008-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3077 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0256/20090256257.pdf [firstpage_image] =>[orig_patent_app_number] => 12102035 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/102035
Final via structures for bond pad-solder ball interconnections Apr 13, 2008 Issued
Array ( [id] => 5530755 [patent_doc_number] => 20090230543 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-09-17 [patent_title] => 'Semiconductor package structure with heat sink' [patent_app_type] => utility [patent_app_number] => 12/081145 [patent_app_country] => US [patent_app_date] => 2008-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1813 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20090230543.pdf [firstpage_image] =>[orig_patent_app_number] => 12081145 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/081145
Semiconductor package structure with heat sink Apr 10, 2008 Abandoned
Array ( [id] => 5456115 [patent_doc_number] => 20090256267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-15 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH CENTRAL BOND WIRES' [patent_app_type] => utility [patent_app_number] => 12/101961 [patent_app_country] => US [patent_app_date] => 2008-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6531 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0256/20090256267.pdf [firstpage_image] =>[orig_patent_app_number] => 12101961 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/101961
Integrated circuit package-on-package system with central bond wires Apr 10, 2008 Issued
Array ( [id] => 7754715 [patent_doc_number] => 08111839 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Always on headwear recording system' [patent_app_type] => utility [patent_app_number] => 12/100281 [patent_app_country] => US [patent_app_date] => 2008-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 8673 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/111/08111839.pdf [firstpage_image] =>[orig_patent_app_number] => 12100281 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/100281
Always on headwear recording system Apr 8, 2008 Issued
Array ( [id] => 4679940 [patent_doc_number] => 20080246166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-09 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 12/099961 [patent_app_country] => US [patent_app_date] => 2008-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3685 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20080246166.pdf [firstpage_image] =>[orig_patent_app_number] => 12099961 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/099961
Semiconductor device and method of manufacturing same Apr 8, 2008 Issued
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