![](/images/general/no_picture/200_user.png)
Jasmine Jhihan B Clark
Examiner (ID: 7485, Phone: (571)272-1726 , Office: P/2816 )
Most Active Art Unit | 2815 |
Art Unit(s) | 2815, 3621, 2899, 2503, 2816 |
Total Applications | 2981 |
Issued Applications | 2695 |
Pending Applications | 126 |
Abandoned Applications | 160 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 3740979
[patent_doc_number] => 05694296
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-02
[patent_title] => 'Multipoint electrical interconnection having deformable J-hooks'
[patent_app_type] => 1
[patent_app_number] => 8/575945
[patent_app_country] => US
[patent_app_date] => 1995-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 2647
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/694/05694296.pdf
[firstpage_image] =>[orig_patent_app_number] => 575945
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/575945 | Multipoint electrical interconnection having deformable J-hooks | Dec 19, 1995 | Issued |
Array
(
[id] => 3726679
[patent_doc_number] => 05617298
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-01
[patent_title] => 'Collinear terminated transmission line structure'
[patent_app_type] => 1
[patent_app_number] => 8/575423
[patent_app_country] => US
[patent_app_date] => 1995-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2119
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/617/05617298.pdf
[firstpage_image] =>[orig_patent_app_number] => 575423
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/575423 | Collinear terminated transmission line structure | Dec 19, 1995 | Issued |
Array
(
[id] => 3782895
[patent_doc_number] => 05774341
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-30
[patent_title] => 'Solderless electrical interconnection including metallized hook and loop fasteners'
[patent_app_type] => 1
[patent_app_number] => 8/575652
[patent_app_country] => US
[patent_app_date] => 1995-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 2686
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 171
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/774/05774341.pdf
[firstpage_image] =>[orig_patent_app_number] => 575652
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/575652 | Solderless electrical interconnection including metallized hook and loop fasteners | Dec 19, 1995 | Issued |
08/574931 | SPREAD SPECTRUM RADIO INCORPRATED IN A PCMCIA TYPE II CARD HOLDER | Dec 18, 1995 | Abandoned |
Array
(
[id] => 3628836
[patent_doc_number] => 05642266
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-24
[patent_title] => 'Apparatus for maintaining an electrical component in a fixed position'
[patent_app_type] => 1
[patent_app_number] => 8/574274
[patent_app_country] => US
[patent_app_date] => 1995-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2636
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/642/05642266.pdf
[firstpage_image] =>[orig_patent_app_number] => 574274
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/574274 | Apparatus for maintaining an electrical component in a fixed position | Dec 17, 1995 | Issued |
Array
(
[id] => 3829336
[patent_doc_number] => 05790380
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-04
[patent_title] => 'Method for fabricating a multiple chip module using orthogonal reorientation of connection planes'
[patent_app_type] => 1
[patent_app_number] => 8/573045
[patent_app_country] => US
[patent_app_date] => 1995-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2527
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 191
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/790/05790380.pdf
[firstpage_image] =>[orig_patent_app_number] => 573045
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/573045 | Method for fabricating a multiple chip module using orthogonal reorientation of connection planes | Dec 14, 1995 | Issued |
Array
(
[id] => 4060428
[patent_doc_number] => 05870289
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-09
[patent_title] => 'Chip connection structure having diret through-hole connections through adhesive film and wiring substrate'
[patent_app_type] => 1
[patent_app_number] => 8/572747
[patent_app_country] => US
[patent_app_date] => 1995-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 16
[patent_no_of_words] => 14199
[patent_no_of_claims] => 33
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/870/05870289.pdf
[firstpage_image] =>[orig_patent_app_number] => 572747
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/572747 | Chip connection structure having diret through-hole connections through adhesive film and wiring substrate | Dec 13, 1995 | Issued |
Array
(
[id] => 3525970
[patent_doc_number] => 05576934
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-19
[patent_title] => 'Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board'
[patent_app_type] => 1
[patent_app_number] => 8/367181
[patent_app_country] => US
[patent_app_date] => 1995-12-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1185
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/576/05576934.pdf
[firstpage_image] =>[orig_patent_app_number] => 367181
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/367181 | Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board | Dec 8, 1995 | Issued |
Array
(
[id] => 3738229
[patent_doc_number] => 05703760
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-30
[patent_title] => 'Mother board with flexible layout for accommodating computer system design options'
[patent_app_type] => 1
[patent_app_number] => 8/568661
[patent_app_country] => US
[patent_app_date] => 1995-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2242
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/703/05703760.pdf
[firstpage_image] =>[orig_patent_app_number] => 568661
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/568661 | Mother board with flexible layout for accommodating computer system design options | Dec 6, 1995 | Issued |
Array
(
[id] => 3738206
[patent_doc_number] => 05703759
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-30
[patent_title] => 'Multi-chip electrically reconfigurable module with predominantly extra-package inter-chip connections'
[patent_app_type] => 1
[patent_app_number] => 8/569032
[patent_app_country] => US
[patent_app_date] => 1995-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3408
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/703/05703759.pdf
[firstpage_image] =>[orig_patent_app_number] => 569032
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569032 | Multi-chip electrically reconfigurable module with predominantly extra-package inter-chip connections | Dec 6, 1995 | Issued |
Array
(
[id] => 3732878
[patent_doc_number] => 05701234
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Surface mount component for selectively configuring a printed circuit board and method for using the same'
[patent_app_type] => 1
[patent_app_number] => 8/568035
[patent_app_country] => US
[patent_app_date] => 1995-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 22
[patent_no_of_words] => 5006
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/701/05701234.pdf
[firstpage_image] =>[orig_patent_app_number] => 568035
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/568035 | Surface mount component for selectively configuring a printed circuit board and method for using the same | Dec 5, 1995 | Issued |
Array
(
[id] => 3852801
[patent_doc_number] => 05745348
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-28
[patent_title] => 'Printed circuit board coupling device for use with a cathode ray tube'
[patent_app_type] => 1
[patent_app_number] => 8/566951
[patent_app_country] => US
[patent_app_date] => 1995-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1834
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/745/05745348.pdf
[firstpage_image] =>[orig_patent_app_number] => 566951
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/566951 | Printed circuit board coupling device for use with a cathode ray tube | Dec 3, 1995 | Issued |
Array
(
[id] => 3899484
[patent_doc_number] => 05777850
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-07
[patent_title] => 'Built-in control device for actuating loads with conductor foil-covered printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/553680
[patent_app_country] => US
[patent_app_date] => 1995-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2145
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/777/05777850.pdf
[firstpage_image] =>[orig_patent_app_number] => 553680
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/553680 | Built-in control device for actuating loads with conductor foil-covered printed circuit board | Nov 29, 1995 | Issued |
Array
(
[id] => 3752240
[patent_doc_number] => 05754408
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Stackable double-density integrated circuit assemblies'
[patent_app_type] => 1
[patent_app_number] => 8/565612
[patent_app_country] => US
[patent_app_date] => 1995-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/754/05754408.pdf
[firstpage_image] =>[orig_patent_app_number] => 565612
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/565612 | Stackable double-density integrated circuit assemblies | Nov 28, 1995 | Issued |
Array
(
[id] => 3836860
[patent_doc_number] => 05784264
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-21
[patent_title] => 'MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form'
[patent_app_type] => 1
[patent_app_number] => 8/562848
[patent_app_country] => US
[patent_app_date] => 1995-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 15
[patent_no_of_words] => 3041
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/784/05784264.pdf
[firstpage_image] =>[orig_patent_app_number] => 562848
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/562848 | MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form | Nov 26, 1995 | Issued |
Array
(
[id] => 3746260
[patent_doc_number] => 05699231
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'Method of packaging high voltage components with low voltage components in a small space'
[patent_app_type] => 1
[patent_app_number] => 8/562615
[patent_app_country] => US
[patent_app_date] => 1995-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2138
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/699/05699231.pdf
[firstpage_image] =>[orig_patent_app_number] => 562615
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/562615 | Method of packaging high voltage components with low voltage components in a small space | Nov 23, 1995 | Issued |
Array
(
[id] => 3752200
[patent_doc_number] => 05754405
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Stacked dual in-line package assembly'
[patent_app_type] => 1
[patent_app_number] => 8/559872
[patent_app_country] => US
[patent_app_date] => 1995-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/754/05754405.pdf
[firstpage_image] =>[orig_patent_app_number] => 559872
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/559872 | Stacked dual in-line package assembly | Nov 19, 1995 | Issued |
Array
(
[id] => 3657122
[patent_doc_number] => 05640308
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-17
[patent_title] => 'Field programmable circuit module'
[patent_app_type] => 1
[patent_app_number] => 8/560154
[patent_app_country] => US
[patent_app_date] => 1995-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/05/640/05640308.pdf
[firstpage_image] =>[orig_patent_app_number] => 560154
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/560154 | Field programmable circuit module | Nov 16, 1995 | Issued |
Array
(
[id] => 3821800
[patent_doc_number] => 05710695
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-20
[patent_title] => 'Leadframe ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 8/553113
[patent_app_country] => US
[patent_app_date] => 1995-11-07
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/710/05710695.pdf
[firstpage_image] =>[orig_patent_app_number] => 553113
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/553113 | Leadframe ball grid array package | Nov 6, 1995 | Issued |
Array
(
[id] => 3771403
[patent_doc_number] => 05742480
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-21
[patent_title] => 'Optical module circuit board having flexible structure'
[patent_app_type] => 1
[patent_app_number] => 8/552351
[patent_app_country] => US
[patent_app_date] => 1995-11-02
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/742/05742480.pdf
[firstpage_image] =>[orig_patent_app_number] => 552351
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/552351 | Optical module circuit board having flexible structure | Nov 1, 1995 | Issued |