
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5060423
[patent_doc_number] => 20070222060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-27
[patent_title] => 'Compact power semiconductor module having a connecting device'
[patent_app_type] => utility
[patent_app_number] => 11/726641
[patent_app_country] => US
[patent_app_date] => 2007-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2587
[patent_no_of_claims] => 13
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0222/20070222060.pdf
[firstpage_image] =>[orig_patent_app_number] => 11726641
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/726641 | Compact power semiconductor module having a connecting device | Mar 21, 2007 | Issued |
Array
(
[id] => 4974697
[patent_doc_number] => 20070215927
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-20
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/686091
[patent_app_country] => US
[patent_app_date] => 2007-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3539
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[pdf_file] => publications/A1/0215/20070215927.pdf
[firstpage_image] =>[orig_patent_app_number] => 11686091
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/686091 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Mar 13, 2007 | Abandoned |
Array
(
[id] => 4695580
[patent_doc_number] => 20080217764
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-11
[patent_title] => 'Piezoelectric cooling of a semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/716246
[patent_app_country] => US
[patent_app_date] => 2007-03-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0217/20080217764.pdf
[firstpage_image] =>[orig_patent_app_number] => 11716246
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/716246 | Piezoelectric cooling of a semiconductor package | Mar 8, 2007 | Issued |
Array
(
[id] => 5019580
[patent_doc_number] => 20070145546
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS'
[patent_app_type] => utility
[patent_app_number] => 11/682729
[patent_app_country] => US
[patent_app_date] => 2007-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 6215
[patent_no_of_claims] => 41
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0145/20070145546.pdf
[firstpage_image] =>[orig_patent_app_number] => 11682729
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/682729 | Thermal interface material and solder preforms | Mar 5, 2007 | Issued |
Array
(
[id] => 4929812
[patent_doc_number] => 20080000587
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'Bonding apparatus of semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/710521
[patent_app_country] => US
[patent_app_date] => 2007-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2133
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[pdf_file] => publications/A1/0000/20080000587.pdf
[firstpage_image] =>[orig_patent_app_number] => 11710521
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/710521 | Bonding apparatus of semiconductor package | Feb 25, 2007 | Abandoned |
Array
(
[id] => 163226
[patent_doc_number] => 07671432
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-02
[patent_title] => 'Dynamic quantity sensor'
[patent_app_type] => utility
[patent_app_number] => 11/709271
[patent_app_country] => US
[patent_app_date] => 2007-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/671/07671432.pdf
[firstpage_image] =>[orig_patent_app_number] => 11709271
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/709271 | Dynamic quantity sensor | Feb 21, 2007 | Issued |
Array
(
[id] => 5250643
[patent_doc_number] => 20070132099
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-14
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD AND ELECTRONIC INSTRUMENT'
[patent_app_type] => utility
[patent_app_number] => 11/675561
[patent_app_country] => US
[patent_app_date] => 2007-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4591
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0132/20070132099.pdf
[firstpage_image] =>[orig_patent_app_number] => 11675561
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/675561 | Semiconductor device and method of manufacture thereof, circuit board and electronic instrument | Feb 14, 2007 | Issued |
Array
(
[id] => 5233943
[patent_doc_number] => 20070126098
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'SURFACE-MOUNTABLE LIGHT-EMITTING DIODE STRUCTURAL ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 11/672092
[patent_app_country] => US
[patent_app_date] => 2007-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 4006
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[pdf_file] => publications/A1/0126/20070126098.pdf
[firstpage_image] =>[orig_patent_app_number] => 11672092
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/672092 | Surface-mountable light-emitting diode structural element | Feb 6, 2007 | Issued |
Array
(
[id] => 5129098
[patent_doc_number] => 20070205495
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-06
[patent_title] => 'Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means'
[patent_app_type] => utility
[patent_app_number] => 11/670821
[patent_app_country] => US
[patent_app_date] => 2007-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0205/20070205495.pdf
[firstpage_image] =>[orig_patent_app_number] => 11670821
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/670821 | Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means | Feb 1, 2007 | Abandoned |
Array
(
[id] => 4457704
[patent_doc_number] => 07893538
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-22
[patent_title] => 'Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/278224
[patent_app_country] => US
[patent_app_date] => 2007-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 23928
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[pdf_file] => patents/07/893/07893538.pdf
[firstpage_image] =>[orig_patent_app_number] => 12278224
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/278224 | Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device | Jan 30, 2007 | Issued |
Array
(
[id] => 7967857
[patent_doc_number] => 07939923
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-10
[patent_title] => 'Memory card and method for manufacturing memory card'
[patent_app_type] => utility
[patent_app_number] => 12/160954
[patent_app_country] => US
[patent_app_date] => 2007-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 6952
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[pdf_file] => patents/07/939/07939923.pdf
[firstpage_image] =>[orig_patent_app_number] => 12160954
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/160954 | Memory card and method for manufacturing memory card | Jan 30, 2007 | Issued |
Array
(
[id] => 5157531
[patent_doc_number] => 20070170575
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'STACK CHIP AND STACK CHIP PACKAGE HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/627791
[patent_app_country] => US
[patent_app_date] => 2007-01-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0170/20070170575.pdf
[firstpage_image] =>[orig_patent_app_number] => 11627791
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/627791 | Stack chip and stack chip package having the same | Jan 25, 2007 | Issued |
Array
(
[id] => 5077013
[patent_doc_number] => 20070120237
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-31
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 11/698104
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[patent_app_date] => 2007-01-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0120/20070120237.pdf
[firstpage_image] =>[orig_patent_app_number] => 11698104
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/698104 | Semiconductor integrated circuit | Jan 25, 2007 | Abandoned |
Array
(
[id] => 5157543
[patent_doc_number] => 20070170587
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[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Ball grid array'
[patent_app_type] => utility
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11656431
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/656431 | Ball grid array | Jan 22, 2007 | Issued |
Array
(
[id] => 587604
[patent_doc_number] => 07446405
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[patent_kind] => B2
[patent_issue_date] => 2008-11-04
[patent_title] => 'Wafer level chip scale package (WLCSP) with high reliability against thermal stress'
[patent_app_type] => utility
[patent_app_number] => 11/648281
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[patent_app_date] => 2006-12-29
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/648281 | Wafer level chip scale package (WLCSP) with high reliability against thermal stress | Dec 28, 2006 | Issued |
Array
(
[id] => 5175210
[patent_doc_number] => 20070176268
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[patent_title] => 'Socketless planar semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 11/646541
[patent_app_country] => US
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[pdf_file] => publications/A1/0176/20070176268.pdf
[firstpage_image] =>[orig_patent_app_number] => 11646541
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/646541 | Socketless planar semiconductor module | Dec 27, 2006 | Abandoned |
Array
(
[id] => 367014
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[patent_issue_date] => 2009-01-20
[patent_title] => 'Seal ring structures with unlanded via stacks'
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[patent_app_number] => 11/611391
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/611391 | Seal ring structures with unlanded via stacks | Dec 14, 2006 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/609121 | Compound heat sink | Dec 10, 2006 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/635941 | Integrated circuit package system employing structural support | Dec 6, 2006 | Issued |
Array
(
[id] => 5019612
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[patent_title] => 'Multi-chip package sharing temperature-compensated self-refresh signal and method thereof'
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[firstpage_image] =>[orig_patent_app_number] => 11606282
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/606282 | Multi-chip package sharing temperature-compensated self-refresh signal and method thereof | Nov 29, 2006 | Abandoned |