Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5060423 [patent_doc_number] => 20070222060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'Compact power semiconductor module having a connecting device' [patent_app_type] => utility [patent_app_number] => 11/726641 [patent_app_country] => US [patent_app_date] => 2007-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2587 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20070222060.pdf [firstpage_image] =>[orig_patent_app_number] => 11726641 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/726641
Compact power semiconductor module having a connecting device Mar 21, 2007 Issued
Array ( [id] => 4974697 [patent_doc_number] => 20070215927 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-20 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 11/686091 [patent_app_country] => US [patent_app_date] => 2007-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3539 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0215/20070215927.pdf [firstpage_image] =>[orig_patent_app_number] => 11686091 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/686091
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Mar 13, 2007 Abandoned
Array ( [id] => 4695580 [patent_doc_number] => 20080217764 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-11 [patent_title] => 'Piezoelectric cooling of a semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/716246 [patent_app_country] => US [patent_app_date] => 2007-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1473 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0217/20080217764.pdf [firstpage_image] =>[orig_patent_app_number] => 11716246 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/716246
Piezoelectric cooling of a semiconductor package Mar 8, 2007 Issued
Array ( [id] => 5019580 [patent_doc_number] => 20070145546 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS' [patent_app_type] => utility [patent_app_number] => 11/682729 [patent_app_country] => US [patent_app_date] => 2007-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 6215 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145546.pdf [firstpage_image] =>[orig_patent_app_number] => 11682729 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/682729
Thermal interface material and solder preforms Mar 5, 2007 Issued
Array ( [id] => 4929812 [patent_doc_number] => 20080000587 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'Bonding apparatus of semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/710521 [patent_app_country] => US [patent_app_date] => 2007-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2133 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20080000587.pdf [firstpage_image] =>[orig_patent_app_number] => 11710521 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/710521
Bonding apparatus of semiconductor package Feb 25, 2007 Abandoned
Array ( [id] => 163226 [patent_doc_number] => 07671432 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-02 [patent_title] => 'Dynamic quantity sensor' [patent_app_type] => utility [patent_app_number] => 11/709271 [patent_app_country] => US [patent_app_date] => 2007-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 8039 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/671/07671432.pdf [firstpage_image] =>[orig_patent_app_number] => 11709271 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/709271
Dynamic quantity sensor Feb 21, 2007 Issued
Array ( [id] => 5250643 [patent_doc_number] => 20070132099 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD AND ELECTRONIC INSTRUMENT' [patent_app_type] => utility [patent_app_number] => 11/675561 [patent_app_country] => US [patent_app_date] => 2007-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4591 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20070132099.pdf [firstpage_image] =>[orig_patent_app_number] => 11675561 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/675561
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Feb 14, 2007 Issued
Array ( [id] => 5233943 [patent_doc_number] => 20070126098 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-07 [patent_title] => 'SURFACE-MOUNTABLE LIGHT-EMITTING DIODE STRUCTURAL ELEMENT' [patent_app_type] => utility [patent_app_number] => 11/672092 [patent_app_country] => US [patent_app_date] => 2007-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4006 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0126/20070126098.pdf [firstpage_image] =>[orig_patent_app_number] => 11672092 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/672092
Surface-mountable light-emitting diode structural element Feb 6, 2007 Issued
Array ( [id] => 5129098 [patent_doc_number] => 20070205495 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-06 [patent_title] => 'Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means' [patent_app_type] => utility [patent_app_number] => 11/670821 [patent_app_country] => US [patent_app_date] => 2007-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5247 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20070205495.pdf [firstpage_image] =>[orig_patent_app_number] => 11670821 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/670821
Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means Feb 1, 2007 Abandoned
Array ( [id] => 4457704 [patent_doc_number] => 07893538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-22 [patent_title] => 'Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/278224 [patent_app_country] => US [patent_app_date] => 2007-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 23928 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/893/07893538.pdf [firstpage_image] =>[orig_patent_app_number] => 12278224 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/278224
Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device Jan 30, 2007 Issued
Array ( [id] => 7967857 [patent_doc_number] => 07939923 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-10 [patent_title] => 'Memory card and method for manufacturing memory card' [patent_app_type] => utility [patent_app_number] => 12/160954 [patent_app_country] => US [patent_app_date] => 2007-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 6952 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/939/07939923.pdf [firstpage_image] =>[orig_patent_app_number] => 12160954 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/160954
Memory card and method for manufacturing memory card Jan 30, 2007 Issued
Array ( [id] => 5157531 [patent_doc_number] => 20070170575 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'STACK CHIP AND STACK CHIP PACKAGE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/627791 [patent_app_country] => US [patent_app_date] => 2007-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6576 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170575.pdf [firstpage_image] =>[orig_patent_app_number] => 11627791 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/627791
Stack chip and stack chip package having the same Jan 25, 2007 Issued
Array ( [id] => 5077013 [patent_doc_number] => 20070120237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-31 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => utility [patent_app_number] => 11/698104 [patent_app_country] => US [patent_app_date] => 2007-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 12610 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0120/20070120237.pdf [firstpage_image] =>[orig_patent_app_number] => 11698104 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/698104
Semiconductor integrated circuit Jan 25, 2007 Abandoned
Array ( [id] => 5157543 [patent_doc_number] => 20070170587 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Ball grid array' [patent_app_type] => utility [patent_app_number] => 11/656431 [patent_app_country] => US [patent_app_date] => 2007-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 9910 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170587.pdf [firstpage_image] =>[orig_patent_app_number] => 11656431 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/656431
Ball grid array Jan 22, 2007 Issued
Array ( [id] => 587604 [patent_doc_number] => 07446405 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-04 [patent_title] => 'Wafer level chip scale package (WLCSP) with high reliability against thermal stress' [patent_app_type] => utility [patent_app_number] => 11/648281 [patent_app_country] => US [patent_app_date] => 2006-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2434 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/446/07446405.pdf [firstpage_image] =>[orig_patent_app_number] => 11648281 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/648281
Wafer level chip scale package (WLCSP) with high reliability against thermal stress Dec 28, 2006 Issued
Array ( [id] => 5175210 [patent_doc_number] => 20070176268 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-02 [patent_title] => 'Socketless planar semiconductor module' [patent_app_type] => utility [patent_app_number] => 11/646541 [patent_app_country] => US [patent_app_date] => 2006-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3631 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0176/20070176268.pdf [firstpage_image] =>[orig_patent_app_number] => 11646541 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/646541
Socketless planar semiconductor module Dec 27, 2006 Abandoned
Array ( [id] => 367014 [patent_doc_number] => 07479699 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-20 [patent_title] => 'Seal ring structures with unlanded via stacks' [patent_app_type] => utility [patent_app_number] => 11/611391 [patent_app_country] => US [patent_app_date] => 2006-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2218 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/479/07479699.pdf [firstpage_image] =>[orig_patent_app_number] => 11611391 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/611391
Seal ring structures with unlanded via stacks Dec 14, 2006 Issued
Array ( [id] => 239976 [patent_doc_number] => 07592695 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-22 [patent_title] => 'Compound heat sink' [patent_app_type] => utility [patent_app_number] => 11/609121 [patent_app_country] => US [patent_app_date] => 2006-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 8261 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/592/07592695.pdf [firstpage_image] =>[orig_patent_app_number] => 11609121 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/609121
Compound heat sink Dec 10, 2006 Issued
Array ( [id] => 152399 [patent_doc_number] => 07683467 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-23 [patent_title] => 'Integrated circuit package system employing structural support' [patent_app_type] => utility [patent_app_number] => 11/635941 [patent_app_country] => US [patent_app_date] => 2006-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3784 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/683/07683467.pdf [firstpage_image] =>[orig_patent_app_number] => 11635941 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/635941
Integrated circuit package system employing structural support Dec 6, 2006 Issued
Array ( [id] => 5019612 [patent_doc_number] => 20070145578 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'Multi-chip package sharing temperature-compensated self-refresh signal and method thereof' [patent_app_type] => utility [patent_app_number] => 11/606282 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3192 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145578.pdf [firstpage_image] =>[orig_patent_app_number] => 11606282 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/606282
Multi-chip package sharing temperature-compensated self-refresh signal and method thereof Nov 29, 2006 Abandoned
Menu