Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5031749 [patent_doc_number] => 20070096288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-03 [patent_title] => 'Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture' [patent_app_type] => utility [patent_app_number] => 11/606284 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3671 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20070096288.pdf [firstpage_image] =>[orig_patent_app_number] => 11606284 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/606284
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture Nov 29, 2006 Abandoned
Array ( [id] => 345483 [patent_doc_number] => 07498673 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-03 [patent_title] => 'Heatplates for heatsink attachment for semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/602861 [patent_app_country] => US [patent_app_date] => 2006-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 3406 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/498/07498673.pdf [firstpage_image] =>[orig_patent_app_number] => 11602861 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/602861
Heatplates for heatsink attachment for semiconductor chips Nov 20, 2006 Issued
Array ( [id] => 4570758 [patent_doc_number] => 07847389 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-07 [patent_title] => 'Semiconductor package, electronic part and electronic device' [patent_app_type] => utility [patent_app_number] => 12/093896 [patent_app_country] => US [patent_app_date] => 2006-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 46 [patent_no_of_words] => 10532 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/847/07847389.pdf [firstpage_image] =>[orig_patent_app_number] => 12093896 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/093896
Semiconductor package, electronic part and electronic device Nov 12, 2006 Issued
Array ( [id] => 454009 [patent_doc_number] => 07247941 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-24 [patent_title] => 'Printed circuit board assembly with strain-alleviating structures' [patent_app_type] => utility [patent_app_number] => 11/592209 [patent_app_country] => US [patent_app_date] => 2006-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 3267 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/247/07247941.pdf [firstpage_image] =>[orig_patent_app_number] => 11592209 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/592209
Printed circuit board assembly with strain-alleviating structures Nov 2, 2006 Issued
Array ( [id] => 296397 [patent_doc_number] => 07541670 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-02 [patent_title] => 'Semiconductor device having terminals' [patent_app_type] => utility [patent_app_number] => 11/554251 [patent_app_country] => US [patent_app_date] => 2006-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 24 [patent_no_of_words] => 5385 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/541/07541670.pdf [firstpage_image] =>[orig_patent_app_number] => 11554251 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/554251
Semiconductor device having terminals Oct 29, 2006 Issued
Array ( [id] => 315210 [patent_doc_number] => 07525181 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-28 [patent_title] => 'Tape wiring substrate and tape package using the same' [patent_app_type] => utility [patent_app_number] => 11/586601 [patent_app_country] => US [patent_app_date] => 2006-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4084 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/525/07525181.pdf [firstpage_image] =>[orig_patent_app_number] => 11586601 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/586601
Tape wiring substrate and tape package using the same Oct 25, 2006 Issued
Array ( [id] => 191326 [patent_doc_number] => 07642639 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-05 [patent_title] => 'COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/583951 [patent_app_country] => US [patent_app_date] => 2006-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 4464 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/642/07642639.pdf [firstpage_image] =>[orig_patent_app_number] => 11583951 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/583951
COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same Oct 19, 2006 Issued
Array ( [id] => 5268622 [patent_doc_number] => 20090072397 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-19 [patent_title] => 'REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 12/090686 [patent_app_country] => US [patent_app_date] => 2006-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3413 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0072/20090072397.pdf [firstpage_image] =>[orig_patent_app_number] => 12090686 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/090686
Redistribution layer for wafer-level chip scale package and method therefor Oct 17, 2006 Issued
Array ( [id] => 5038187 [patent_doc_number] => 20070090469 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-26 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/581581 [patent_app_country] => US [patent_app_date] => 2006-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3411 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20070090469.pdf [firstpage_image] =>[orig_patent_app_number] => 11581581 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/581581
Semiconductor device with a dummy electrode Oct 16, 2006 Issued
Array ( [id] => 1077346 [patent_doc_number] => 07615863 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-10 [patent_title] => 'Multi-dimensional wafer-level integrated antenna sensor micro packaging' [patent_app_type] => utility [patent_app_number] => 11/581851 [patent_app_country] => US [patent_app_date] => 2006-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3026 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/615/07615863.pdf [firstpage_image] =>[orig_patent_app_number] => 11581851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/581851
Multi-dimensional wafer-level integrated antenna sensor micro packaging Oct 15, 2006 Issued
Array ( [id] => 5038227 [patent_doc_number] => 20070090509 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-26 [patent_title] => 'Electromagnetic interference circuit package shield' [patent_app_type] => utility [patent_app_number] => 11/580212 [patent_app_country] => US [patent_app_date] => 2006-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4261 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20070090509.pdf [firstpage_image] =>[orig_patent_app_number] => 11580212 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/580212
Electromagnetic interference circuit package shield Oct 11, 2006 Abandoned
Array ( [id] => 5111558 [patent_doc_number] => 20070195473 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-23 [patent_title] => 'PRINTED CIRCUIT BOARD' [patent_app_type] => utility [patent_app_number] => 11/548431 [patent_app_country] => US [patent_app_date] => 2006-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5745 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20070195473.pdf [firstpage_image] =>[orig_patent_app_number] => 11548431 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/548431
Printed circuit board Oct 10, 2006 Issued
Array ( [id] => 5500631 [patent_doc_number] => 20090161319 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-25 [patent_title] => 'Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement' [patent_app_type] => utility [patent_app_number] => 12/093332 [patent_app_country] => US [patent_app_date] => 2006-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3733 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0161/20090161319.pdf [firstpage_image] =>[orig_patent_app_number] => 12093332 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/093332
Electronic circuit arrangement and method for producing an electronic circuit arrangement Oct 4, 2006 Issued
Array ( [id] => 33703 [patent_doc_number] => 07791186 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/542261 [patent_app_country] => US [patent_app_date] => 2006-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 82 [patent_no_of_words] => 30797 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/791/07791186.pdf [firstpage_image] =>[orig_patent_app_number] => 11542261 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/542261
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Oct 3, 2006 Issued
Array ( [id] => 5152152 [patent_doc_number] => 20070035034 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-15 [patent_title] => 'System and Method for Improved Auto-Boating' [patent_app_type] => utility [patent_app_number] => 11/537822 [patent_app_country] => US [patent_app_date] => 2006-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1862 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20070035034.pdf [firstpage_image] =>[orig_patent_app_number] => 11537822 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/537822
System and method for improved auto-boating Oct 1, 2006 Issued
Array ( [id] => 4941851 [patent_doc_number] => 20080079174 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-03 [patent_title] => 'Substrate slot design for die stack packaging' [patent_app_type] => utility [patent_app_number] => 11/540351 [patent_app_country] => US [patent_app_date] => 2006-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1903 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20080079174.pdf [firstpage_image] =>[orig_patent_app_number] => 11540351 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/540351
Substrate slot design for die stack packaging Sep 28, 2006 Abandoned
Array ( [id] => 7595210 [patent_doc_number] => 07626251 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-01 [patent_title] => 'Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same' [patent_app_type] => utility [patent_app_number] => 11/529851 [patent_app_country] => US [patent_app_date] => 2006-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 7138 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/626/07626251.pdf [firstpage_image] =>[orig_patent_app_number] => 11529851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/529851
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same Sep 28, 2006 Issued
Array ( [id] => 408815 [patent_doc_number] => 07285851 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-10-23 [patent_title] => 'Liquid immersion cooled multichip module' [patent_app_type] => utility [patent_app_number] => 11/540391 [patent_app_country] => US [patent_app_date] => 2006-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2023 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/285/07285851.pdf [firstpage_image] =>[orig_patent_app_number] => 11540391 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/540391
Liquid immersion cooled multichip module Sep 28, 2006 Issued
Array ( [id] => 4893467 [patent_doc_number] => 20080102565 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-01 [patent_title] => 'Substrate with lossy material insert' [patent_app_type] => utility [patent_app_number] => 11/529011 [patent_app_country] => US [patent_app_date] => 2006-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2801 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20080102565.pdf [firstpage_image] =>[orig_patent_app_number] => 11529011 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/529011
Substrate with lossy material insert Sep 27, 2006 Issued
Array ( [id] => 4527114 [patent_doc_number] => 07952209 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-31 [patent_title] => 'Integrated circuit package system with pad to pad bonding' [patent_app_type] => utility [patent_app_number] => 11/536242 [patent_app_country] => US [patent_app_date] => 2006-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 4039 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/952/07952209.pdf [firstpage_image] =>[orig_patent_app_number] => 11536242 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/536242
Integrated circuit package system with pad to pad bonding Sep 27, 2006 Issued
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