
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5031749
[patent_doc_number] => 20070096288
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-03
[patent_title] => 'Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture'
[patent_app_type] => utility
[patent_app_number] => 11/606284
[patent_app_country] => US
[patent_app_date] => 2006-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3671
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0096/20070096288.pdf
[firstpage_image] =>[orig_patent_app_number] => 11606284
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/606284 | Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture | Nov 29, 2006 | Abandoned |
Array
(
[id] => 345483
[patent_doc_number] => 07498673
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-03
[patent_title] => 'Heatplates for heatsink attachment for semiconductor chips'
[patent_app_type] => utility
[patent_app_number] => 11/602861
[patent_app_country] => US
[patent_app_date] => 2006-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 19
[patent_no_of_words] => 3406
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/498/07498673.pdf
[firstpage_image] =>[orig_patent_app_number] => 11602861
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/602861 | Heatplates for heatsink attachment for semiconductor chips | Nov 20, 2006 | Issued |
Array
(
[id] => 4570758
[patent_doc_number] => 07847389
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-07
[patent_title] => 'Semiconductor package, electronic part and electronic device'
[patent_app_type] => utility
[patent_app_number] => 12/093896
[patent_app_country] => US
[patent_app_date] => 2006-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 46
[patent_no_of_words] => 10532
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/847/07847389.pdf
[firstpage_image] =>[orig_patent_app_number] => 12093896
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/093896 | Semiconductor package, electronic part and electronic device | Nov 12, 2006 | Issued |
Array
(
[id] => 454009
[patent_doc_number] => 07247941
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-24
[patent_title] => 'Printed circuit board assembly with strain-alleviating structures'
[patent_app_type] => utility
[patent_app_number] => 11/592209
[patent_app_country] => US
[patent_app_date] => 2006-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 14
[patent_no_of_words] => 3267
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/247/07247941.pdf
[firstpage_image] =>[orig_patent_app_number] => 11592209
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/592209 | Printed circuit board assembly with strain-alleviating structures | Nov 2, 2006 | Issued |
Array
(
[id] => 296397
[patent_doc_number] => 07541670
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-02
[patent_title] => 'Semiconductor device having terminals'
[patent_app_type] => utility
[patent_app_number] => 11/554251
[patent_app_country] => US
[patent_app_date] => 2006-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 24
[patent_no_of_words] => 5385
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/541/07541670.pdf
[firstpage_image] =>[orig_patent_app_number] => 11554251
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/554251 | Semiconductor device having terminals | Oct 29, 2006 | Issued |
Array
(
[id] => 315210
[patent_doc_number] => 07525181
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-28
[patent_title] => 'Tape wiring substrate and tape package using the same'
[patent_app_type] => utility
[patent_app_number] => 11/586601
[patent_app_country] => US
[patent_app_date] => 2006-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 4084
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 185
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/525/07525181.pdf
[firstpage_image] =>[orig_patent_app_number] => 11586601
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/586601 | Tape wiring substrate and tape package using the same | Oct 25, 2006 | Issued |
Array
(
[id] => 191326
[patent_doc_number] => 07642639
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-05
[patent_title] => 'COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/583951
[patent_app_country] => US
[patent_app_date] => 2006-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 13
[patent_no_of_words] => 4464
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/642/07642639.pdf
[firstpage_image] =>[orig_patent_app_number] => 11583951
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/583951 | COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same | Oct 19, 2006 | Issued |
Array
(
[id] => 5268622
[patent_doc_number] => 20090072397
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-19
[patent_title] => 'REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD THEREFOR'
[patent_app_type] => utility
[patent_app_number] => 12/090686
[patent_app_country] => US
[patent_app_date] => 2006-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3413
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0072/20090072397.pdf
[firstpage_image] =>[orig_patent_app_number] => 12090686
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/090686 | Redistribution layer for wafer-level chip scale package and method therefor | Oct 17, 2006 | Issued |
Array
(
[id] => 5038187
[patent_doc_number] => 20070090469
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-26
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/581581
[patent_app_country] => US
[patent_app_date] => 2006-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3411
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20070090469.pdf
[firstpage_image] =>[orig_patent_app_number] => 11581581
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/581581 | Semiconductor device with a dummy electrode | Oct 16, 2006 | Issued |
Array
(
[id] => 1077346
[patent_doc_number] => 07615863
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-10
[patent_title] => 'Multi-dimensional wafer-level integrated antenna sensor micro packaging'
[patent_app_type] => utility
[patent_app_number] => 11/581851
[patent_app_country] => US
[patent_app_date] => 2006-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 3026
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/615/07615863.pdf
[firstpage_image] =>[orig_patent_app_number] => 11581851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/581851 | Multi-dimensional wafer-level integrated antenna sensor micro packaging | Oct 15, 2006 | Issued |
Array
(
[id] => 5038227
[patent_doc_number] => 20070090509
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-26
[patent_title] => 'Electromagnetic interference circuit package shield'
[patent_app_type] => utility
[patent_app_number] => 11/580212
[patent_app_country] => US
[patent_app_date] => 2006-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4261
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20070090509.pdf
[firstpage_image] =>[orig_patent_app_number] => 11580212
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/580212 | Electromagnetic interference circuit package shield | Oct 11, 2006 | Abandoned |
Array
(
[id] => 5111558
[patent_doc_number] => 20070195473
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-23
[patent_title] => 'PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 11/548431
[patent_app_country] => US
[patent_app_date] => 2006-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5745
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20070195473.pdf
[firstpage_image] =>[orig_patent_app_number] => 11548431
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/548431 | Printed circuit board | Oct 10, 2006 | Issued |
Array
(
[id] => 5500631
[patent_doc_number] => 20090161319
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-25
[patent_title] => 'Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement'
[patent_app_type] => utility
[patent_app_number] => 12/093332
[patent_app_country] => US
[patent_app_date] => 2006-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3733
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0161/20090161319.pdf
[firstpage_image] =>[orig_patent_app_number] => 12093332
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/093332 | Electronic circuit arrangement and method for producing an electronic circuit arrangement | Oct 4, 2006 | Issued |
Array
(
[id] => 33703
[patent_doc_number] => 07791186
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-07
[patent_title] => 'Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/542261
[patent_app_country] => US
[patent_app_date] => 2006-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 82
[patent_no_of_words] => 30797
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/791/07791186.pdf
[firstpage_image] =>[orig_patent_app_number] => 11542261
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/542261 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Oct 3, 2006 | Issued |
Array
(
[id] => 5152152
[patent_doc_number] => 20070035034
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-15
[patent_title] => 'System and Method for Improved Auto-Boating'
[patent_app_type] => utility
[patent_app_number] => 11/537822
[patent_app_country] => US
[patent_app_date] => 2006-10-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1862
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0035/20070035034.pdf
[firstpage_image] =>[orig_patent_app_number] => 11537822
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/537822 | System and method for improved auto-boating | Oct 1, 2006 | Issued |
Array
(
[id] => 4941851
[patent_doc_number] => 20080079174
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-03
[patent_title] => 'Substrate slot design for die stack packaging'
[patent_app_type] => utility
[patent_app_number] => 11/540351
[patent_app_country] => US
[patent_app_date] => 2006-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1903
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0079/20080079174.pdf
[firstpage_image] =>[orig_patent_app_number] => 11540351
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/540351 | Substrate slot design for die stack packaging | Sep 28, 2006 | Abandoned |
Array
(
[id] => 7595210
[patent_doc_number] => 07626251
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-12-01
[patent_title] => 'Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same'
[patent_app_type] => utility
[patent_app_number] => 11/529851
[patent_app_country] => US
[patent_app_date] => 2006-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 7138
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/626/07626251.pdf
[firstpage_image] =>[orig_patent_app_number] => 11529851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/529851 | Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same | Sep 28, 2006 | Issued |
Array
(
[id] => 408815
[patent_doc_number] => 07285851
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-10-23
[patent_title] => 'Liquid immersion cooled multichip module'
[patent_app_type] => utility
[patent_app_number] => 11/540391
[patent_app_country] => US
[patent_app_date] => 2006-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2023
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/285/07285851.pdf
[firstpage_image] =>[orig_patent_app_number] => 11540391
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/540391 | Liquid immersion cooled multichip module | Sep 28, 2006 | Issued |
Array
(
[id] => 4893467
[patent_doc_number] => 20080102565
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-01
[patent_title] => 'Substrate with lossy material insert'
[patent_app_type] => utility
[patent_app_number] => 11/529011
[patent_app_country] => US
[patent_app_date] => 2006-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2801
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0102/20080102565.pdf
[firstpage_image] =>[orig_patent_app_number] => 11529011
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/529011 | Substrate with lossy material insert | Sep 27, 2006 | Issued |
Array
(
[id] => 4527114
[patent_doc_number] => 07952209
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-31
[patent_title] => 'Integrated circuit package system with pad to pad bonding'
[patent_app_type] => utility
[patent_app_number] => 11/536242
[patent_app_country] => US
[patent_app_date] => 2006-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 4039
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/952/07952209.pdf
[firstpage_image] =>[orig_patent_app_number] => 11536242
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/536242 | Integrated circuit package system with pad to pad bonding | Sep 27, 2006 | Issued |