
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5157539
[patent_doc_number] => 20070170583
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Multilayer integrated circuit for RF communication and method for assembly thereof'
[patent_app_type] => utility
[patent_app_number] => 11/528047
[patent_app_country] => US
[patent_app_date] => 2006-09-27
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[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0170/20070170583.pdf
[firstpage_image] =>[orig_patent_app_number] => 11528047
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/528047 | Multilayer integrated circuit for RF communication and method for assembly thereof | Sep 26, 2006 | Issued |
Array
(
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[patent_doc_number] => 20070170580
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[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Cooling apparatus for memory module'
[patent_app_type] => utility
[patent_app_number] => 11/528211
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Array
(
[id] => 5168960
[patent_doc_number] => 20070069391
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[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Stacked die semiconductor package'
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[patent_app_number] => 11/528841
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[patent_app_date] => 2006-09-27
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Array
(
[id] => 311436
[patent_doc_number] => 07528468
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[patent_issue_date] => 2009-05-05
[patent_title] => 'Capacitor assembly with shielded connections and method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/526971
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[patent_app_date] => 2006-09-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/526971 | Capacitor assembly with shielded connections and method for forming the same | Sep 24, 2006 | Issued |
Array
(
[id] => 300238
[patent_doc_number] => 07538442
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[patent_title] => 'Semiconductor chip and semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11525041
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/525041 | Semiconductor chip and semiconductor device | Sep 21, 2006 | Issued |
Array
(
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[patent_title] => 'Semiconductor package'
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Array
(
[id] => 454020
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[patent_title] => 'Semiconductor device comprising a plurality of semiconductor constructs'
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[pdf_file] => patents/07/247/07247947.pdf
[firstpage_image] =>[orig_patent_app_number] => 11524481
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/524481 | Semiconductor device comprising a plurality of semiconductor constructs | Sep 19, 2006 | Issued |
Array
(
[id] => 5019636
[patent_doc_number] => 20070145602
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[patent_title] => 'Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure'
[patent_app_type] => utility
[patent_app_number] => 11/533762
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[firstpage_image] =>[orig_patent_app_number] => 11533762
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Array
(
[id] => 5093049
[patent_doc_number] => 20070114658
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[patent_title] => 'Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array'
[patent_app_type] => utility
[patent_app_number] => 11/532894
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/532894 | Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array | Sep 17, 2006 | Abandoned |
Array
(
[id] => 4919334
[patent_doc_number] => 20080067646
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[patent_title] => 'SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW'
[patent_app_type] => utility
[patent_app_number] => 11/532591
[patent_app_country] => US
[patent_app_date] => 2006-09-18
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[firstpage_image] =>[orig_patent_app_number] => 11532591
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/532591 | SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW | Sep 17, 2006 | Abandoned |
Array
(
[id] => 415175
[patent_doc_number] => 07279356
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[patent_title] => 'Depopulation of a ball grid array to allow via placement'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/523153 | Depopulation of a ball grid array to allow via placement | Sep 17, 2006 | Issued |
Array
(
[id] => 345484
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Array
(
[id] => 327028
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[patent_title] => 'Wiring board'
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Array
(
[id] => 5054452
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[patent_title] => 'Semiconductor device having metallic plate with groove'
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Array
(
[id] => 38846
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/514327 | Semiconductor device package with improved cooling | Aug 30, 2006 | Issued |
Array
(
[id] => 5105523
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[patent_title] => 'HEAT DISSIPATION IN INTEGRATED CIRCUITS'
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Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466851 | Chip package and coreless package substrate thereof | Aug 23, 2006 | Issued |