Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5157539 [patent_doc_number] => 20070170583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Multilayer integrated circuit for RF communication and method for assembly thereof' [patent_app_type] => utility [patent_app_number] => 11/528047 [patent_app_country] => US [patent_app_date] => 2006-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4454 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170583.pdf [firstpage_image] =>[orig_patent_app_number] => 11528047 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/528047
Multilayer integrated circuit for RF communication and method for assembly thereof Sep 26, 2006 Issued
Array ( [id] => 5157536 [patent_doc_number] => 20070170580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Cooling apparatus for memory module' [patent_app_type] => utility [patent_app_number] => 11/528211 [patent_app_country] => US [patent_app_date] => 2006-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3380 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170580.pdf [firstpage_image] =>[orig_patent_app_number] => 11528211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/528211
Cooling apparatus for memory module Sep 26, 2006 Issued
Array ( [id] => 5168960 [patent_doc_number] => 20070069391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-29 [patent_title] => 'Stacked die semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/528841 [patent_app_country] => US [patent_app_date] => 2006-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4890 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0069/20070069391.pdf [firstpage_image] =>[orig_patent_app_number] => 11528841 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/528841
Stacked die semiconductor package Sep 26, 2006 Issued
Array ( [id] => 311436 [patent_doc_number] => 07528468 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-05 [patent_title] => 'Capacitor assembly with shielded connections and method for forming the same' [patent_app_type] => utility [patent_app_number] => 11/526971 [patent_app_country] => US [patent_app_date] => 2006-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 5335 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/528/07528468.pdf [firstpage_image] =>[orig_patent_app_number] => 11526971 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/526971
Capacitor assembly with shielded connections and method for forming the same Sep 24, 2006 Issued
Array ( [id] => 300238 [patent_doc_number] => 07538442 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-26 [patent_title] => 'Semiconductor chip and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/525041 [patent_app_country] => US [patent_app_date] => 2006-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 6285 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/538/07538442.pdf [firstpage_image] =>[orig_patent_app_number] => 11525041 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/525041
Semiconductor chip and semiconductor device Sep 21, 2006 Issued
Array ( [id] => 5104341 [patent_doc_number] => 20070063216 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-22 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/524692 [patent_app_country] => US [patent_app_date] => 2006-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2156 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20070063216.pdf [firstpage_image] =>[orig_patent_app_number] => 11524692 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/524692
Semiconductor package Sep 20, 2006 Issued
Array ( [id] => 454020 [patent_doc_number] => 07247947 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-24 [patent_title] => 'Semiconductor device comprising a plurality of semiconductor constructs' [patent_app_type] => utility [patent_app_number] => 11/524481 [patent_app_country] => US [patent_app_date] => 2006-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3244 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/247/07247947.pdf [firstpage_image] =>[orig_patent_app_number] => 11524481 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/524481
Semiconductor device comprising a plurality of semiconductor constructs Sep 19, 2006 Issued
Array ( [id] => 5019636 [patent_doc_number] => 20070145602 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure' [patent_app_type] => utility [patent_app_number] => 11/533762 [patent_app_country] => US [patent_app_date] => 2006-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4167 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145602.pdf [firstpage_image] =>[orig_patent_app_number] => 11533762 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/533762
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure Sep 19, 2006 Issued
Array ( [id] => 5093049 [patent_doc_number] => 20070114658 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-24 [patent_title] => 'Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array' [patent_app_type] => utility [patent_app_number] => 11/532894 [patent_app_country] => US [patent_app_date] => 2006-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5738 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0114/20070114658.pdf [firstpage_image] =>[orig_patent_app_number] => 11532894 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/532894
Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array Sep 17, 2006 Abandoned
Array ( [id] => 4919334 [patent_doc_number] => 20080067646 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-20 [patent_title] => 'SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW' [patent_app_type] => utility [patent_app_number] => 11/532591 [patent_app_country] => US [patent_app_date] => 2006-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3617 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0067/20080067646.pdf [firstpage_image] =>[orig_patent_app_number] => 11532591 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/532591
SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW Sep 17, 2006 Abandoned
Array ( [id] => 415175 [patent_doc_number] => 07279356 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-09 [patent_title] => 'Depopulation of a ball grid array to allow via placement' [patent_app_type] => utility [patent_app_number] => 11/523153 [patent_app_country] => US [patent_app_date] => 2006-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 4131 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/279/07279356.pdf [firstpage_image] =>[orig_patent_app_number] => 11523153 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/523153
Depopulation of a ball grid array to allow via placement Sep 17, 2006 Issued
Array ( [id] => 345484 [patent_doc_number] => 07498674 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-03 [patent_title] => 'Semiconductor module having a coupling substrate, and methods for its production' [patent_app_type] => utility [patent_app_number] => 11/532321 [patent_app_country] => US [patent_app_date] => 2006-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 5448 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/498/07498674.pdf [firstpage_image] =>[orig_patent_app_number] => 11532321 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/532321
Semiconductor module having a coupling substrate, and methods for its production Sep 14, 2006 Issued
Array ( [id] => 327028 [patent_doc_number] => 07514802 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-07 [patent_title] => 'Wiring board' [patent_app_type] => utility [patent_app_number] => 11/531381 [patent_app_country] => US [patent_app_date] => 2006-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3648 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/514/07514802.pdf [firstpage_image] =>[orig_patent_app_number] => 11531381 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/531381
Wiring board Sep 12, 2006 Issued
Array ( [id] => 5054452 [patent_doc_number] => 20070057373 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-15 [patent_title] => 'Semiconductor device having metallic plate with groove' [patent_app_type] => utility [patent_app_number] => 11/516501 [patent_app_country] => US [patent_app_date] => 2006-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6161 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20070057373.pdf [firstpage_image] =>[orig_patent_app_number] => 11516501 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/516501
Semiconductor device having metallic plate with groove Sep 6, 2006 Issued
Array ( [id] => 38846 [patent_doc_number] => RE041559 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2010-08-24 [patent_title] => 'Semiconductor device package with improved cooling' [patent_app_type] => reissue [patent_app_number] => 11/514327 [patent_app_country] => US [patent_app_date] => 2006-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 33 [patent_no_of_words] => 3904 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/041/RE041559.pdf [firstpage_image] =>[orig_patent_app_number] => 11514327 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/514327
Semiconductor device package with improved cooling Aug 30, 2006 Issued
Array ( [id] => 5105523 [patent_doc_number] => 20070064398 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-22 [patent_title] => 'HEAT DISSIPATION IN INTEGRATED CIRCUITS' [patent_app_type] => utility [patent_app_number] => 11/468901 [patent_app_country] => US [patent_app_date] => 2006-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2245 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0064/20070064398.pdf [firstpage_image] =>[orig_patent_app_number] => 11468901 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/468901
Heat dissipation in integrated circuits Aug 30, 2006 Issued
Array ( [id] => 4768761 [patent_doc_number] => 20080054417 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'Semiconductor die package including stacked dice and heat sink structures' [patent_app_type] => utility [patent_app_number] => 11/512941 [patent_app_country] => US [patent_app_date] => 2006-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5186 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054417.pdf [firstpage_image] =>[orig_patent_app_number] => 11512941 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/512941
Semiconductor die package including stacked dice and heat sink structures Aug 28, 2006 Issued
Array ( [id] => 5014133 [patent_doc_number] => 20070257341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-08 [patent_title] => 'Structure of a lead-frame matrix of photoelectron devices' [patent_app_type] => utility [patent_app_number] => 11/510661 [patent_app_country] => US [patent_app_date] => 2006-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2469 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0257/20070257341.pdf [firstpage_image] =>[orig_patent_app_number] => 11510661 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/510661
Structure of a lead-frame matrix of photoelectron devices Aug 27, 2006 Issued
Array ( [id] => 5145774 [patent_doc_number] => 20070045828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Semiconductor device package' [patent_app_type] => utility [patent_app_number] => 11/509641 [patent_app_country] => US [patent_app_date] => 2006-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4925 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20070045828.pdf [firstpage_image] =>[orig_patent_app_number] => 11509641 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/509641
Semiconductor device package Aug 24, 2006 Issued
Array ( [id] => 247434 [patent_doc_number] => 07586188 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-08 [patent_title] => 'Chip package and coreless package substrate thereof' [patent_app_type] => utility [patent_app_number] => 11/466851 [patent_app_country] => US [patent_app_date] => 2006-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2662 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/586/07586188.pdf [firstpage_image] =>[orig_patent_app_number] => 11466851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/466851
Chip package and coreless package substrate thereof Aug 23, 2006 Issued
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