Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4648805 [patent_doc_number] => 20080036060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'Semiconductor chip packages and assemblies with chip carrier units' [patent_app_type] => utility [patent_app_number] => 11/502941 [patent_app_country] => US [patent_app_date] => 2006-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8225 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036060.pdf [firstpage_image] =>[orig_patent_app_number] => 11502941 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/502941
Semiconductor chip packages and assemblies with chip carrier units Aug 10, 2006 Issued
Array ( [id] => 5049112 [patent_doc_number] => 20070029656 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-08 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/462196 [patent_app_country] => US [patent_app_date] => 2006-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4448 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20070029656.pdf [firstpage_image] =>[orig_patent_app_number] => 11462196 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/462196
SEMICONDUCTOR DEVICE Aug 2, 2006 Abandoned
Array ( [id] => 7597264 [patent_doc_number] => 07619313 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-17 [patent_title] => 'Multi-chip module and methods' [patent_app_type] => utility [patent_app_number] => 11/497079 [patent_app_country] => US [patent_app_date] => 2006-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 4940 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/619/07619313.pdf [firstpage_image] =>[orig_patent_app_number] => 11497079 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/497079
Multi-chip module and methods Jul 31, 2006 Issued
Array ( [id] => 4685717 [patent_doc_number] => 20080029898 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-07 [patent_title] => 'VIA STACK STRUCTURES' [patent_app_type] => utility [patent_app_number] => 11/461511 [patent_app_country] => US [patent_app_date] => 2006-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1937 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20080029898.pdf [firstpage_image] =>[orig_patent_app_number] => 11461511 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/461511
VIA STACK STRUCTURES Jul 31, 2006 Abandoned
Array ( [id] => 239983 [patent_doc_number] => 07592702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-22 [patent_title] => 'Via heat sink material' [patent_app_type] => utility [patent_app_number] => 11/461211 [patent_app_country] => US [patent_app_date] => 2006-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2914 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/592/07592702.pdf [firstpage_image] =>[orig_patent_app_number] => 11461211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/461211
Via heat sink material Jul 30, 2006 Issued
Array ( [id] => 4654969 [patent_doc_number] => 20080023829 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Substrate and process for semiconductor flip chip package' [patent_app_type] => utility [patent_app_number] => 11/496111 [patent_app_country] => US [patent_app_date] => 2006-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4501 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023829.pdf [firstpage_image] =>[orig_patent_app_number] => 11496111 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/496111
Substrate and process for semiconductor flip chip package Jul 30, 2006 Issued
Array ( [id] => 5202443 [patent_doc_number] => 20070023922 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-01 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/490022 [patent_app_country] => US [patent_app_date] => 2006-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5989 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20070023922.pdf [firstpage_image] =>[orig_patent_app_number] => 11490022 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/490022
Semiconductor package Jul 20, 2006 Abandoned
Array ( [id] => 5049107 [patent_doc_number] => 20070029651 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-08 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/488072 [patent_app_country] => US [patent_app_date] => 2006-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4142 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20070029651.pdf [firstpage_image] =>[orig_patent_app_number] => 11488072 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/488072
Semiconductor device Jul 17, 2006 Issued
Array ( [id] => 5168889 [patent_doc_number] => 20070069320 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-29 [patent_title] => 'Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/486041 [patent_app_country] => US [patent_app_date] => 2006-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 9774 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0069/20070069320.pdf [firstpage_image] =>[orig_patent_app_number] => 11486041 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/486041
Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same Jul 13, 2006 Abandoned
Array ( [id] => 563131 [patent_doc_number] => 07470939 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-12-30 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/484701 [patent_app_country] => US [patent_app_date] => 2006-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 5250 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 260 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/470/07470939.pdf [firstpage_image] =>[orig_patent_app_number] => 11484701 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/484701
Semiconductor device Jul 11, 2006 Issued
Array ( [id] => 203452 [patent_doc_number] => 07633150 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-15 [patent_title] => 'Semiconductor device and method for manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/483911 [patent_app_country] => US [patent_app_date] => 2006-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 5267 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/633/07633150.pdf [firstpage_image] =>[orig_patent_app_number] => 11483911 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/483911
Semiconductor device and method for manufacturing semiconductor device Jul 9, 2006 Issued
Array ( [id] => 5073416 [patent_doc_number] => 20070013391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-18 [patent_title] => 'Semiconductor integrated circuit device' [patent_app_type] => utility [patent_app_number] => 11/481041 [patent_app_country] => US [patent_app_date] => 2006-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4055 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0013/20070013391.pdf [firstpage_image] =>[orig_patent_app_number] => 11481041 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/481041
Semiconductor integrated circuit device Jul 5, 2006 Issued
Array ( [id] => 8876414 [patent_doc_number] => 08471381 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-25 [patent_title] => 'Complete power management system implemented in a single surface mount package' [patent_app_type] => utility [patent_app_number] => 11/479671 [patent_app_country] => US [patent_app_date] => 2006-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 22 [patent_no_of_words] => 3757 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11479671 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/479671
Complete power management system implemented in a single surface mount package Jun 29, 2006 Issued
Array ( [id] => 4930492 [patent_doc_number] => 20080001267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'Alternative to desmear for build-up roughening and copper adhesion promotion' [patent_app_type] => utility [patent_app_number] => 11/479101 [patent_app_country] => US [patent_app_date] => 2006-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1885 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001267.pdf [firstpage_image] =>[orig_patent_app_number] => 11479101 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/479101
Alternative to desmear for build-up roughening and copper adhesion promotion Jun 29, 2006 Issued
Array ( [id] => 5832142 [patent_doc_number] => 20060243972 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-02 [patent_title] => 'Structure of polymer-matrix conductive film and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/477412 [patent_app_country] => US [patent_app_date] => 2006-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4478 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0243/20060243972.pdf [firstpage_image] =>[orig_patent_app_number] => 11477412 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/477412
Structure of polymer-matrix conductive film and method for fabricating the same Jun 29, 2006 Issued
Array ( [id] => 75268 [patent_doc_number] => 07750441 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-06 [patent_title] => 'Conductive interconnects along the edge of a microelectronic device' [patent_app_type] => utility [patent_app_number] => 11/479611 [patent_app_country] => US [patent_app_date] => 2006-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 3328 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/750/07750441.pdf [firstpage_image] =>[orig_patent_app_number] => 11479611 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/479611
Conductive interconnects along the edge of a microelectronic device Jun 28, 2006 Issued
Array ( [id] => 5196747 [patent_doc_number] => 20070296065 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-27 [patent_title] => '3D electronic packaging structure having a conductive support substrate' [patent_app_type] => utility [patent_app_number] => 11/475131 [patent_app_country] => US [patent_app_date] => 2006-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4102 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20070296065.pdf [firstpage_image] =>[orig_patent_app_number] => 11475131 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/475131
3D electronic packaging structure having a conductive support substrate Jun 26, 2006 Issued
Array ( [id] => 5088910 [patent_doc_number] => 20070228549 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-04 [patent_title] => 'Interconnect structure with stress buffering ability and the manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/473271 [patent_app_country] => US [patent_app_date] => 2006-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3212 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0228/20070228549.pdf [firstpage_image] =>[orig_patent_app_number] => 11473271 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/473271
Interconnect structure with stress buffering ability and the manufacturing method thereof Jun 22, 2006 Issued
Array ( [id] => 587586 [patent_doc_number] => 07446403 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-04 [patent_title] => 'Carrier structure stacking system and method' [patent_app_type] => utility [patent_app_number] => 11/452531 [patent_app_country] => US [patent_app_date] => 2006-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4047 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/446/07446403.pdf [firstpage_image] =>[orig_patent_app_number] => 11452531 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/452531
Carrier structure stacking system and method Jun 13, 2006 Issued
Array ( [id] => 857366 [patent_doc_number] => 07375418 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-20 [patent_title] => 'Interposer stacking system and method' [patent_app_type] => utility [patent_app_number] => 11/452532 [patent_app_country] => US [patent_app_date] => 2006-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 3454 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/375/07375418.pdf [firstpage_image] =>[orig_patent_app_number] => 11452532 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/452532
Interposer stacking system and method Jun 13, 2006 Issued
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