
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 142552
[patent_doc_number] => 07687803
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-30
[patent_title] => 'Semiconductor device and method for manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/448721
[patent_app_country] => US
[patent_app_date] => 2006-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 28
[patent_no_of_words] => 9192
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/687/07687803.pdf
[firstpage_image] =>[orig_patent_app_number] => 11448721
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/448721 | Semiconductor device and method for manufacturing semiconductor device | Jun 7, 2006 | Issued |
Array
(
[id] => 7589080
[patent_doc_number] => 07663245
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-16
[patent_title] => 'Interposer and stacked chip package'
[patent_app_type] => utility
[patent_app_number] => 11/446971
[patent_app_country] => US
[patent_app_date] => 2006-06-06
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[patent_drawing_sheets_cnt] => 14
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[firstpage_image] =>[orig_patent_app_number] => 11446971
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/446971 | Interposer and stacked chip package | Jun 5, 2006 | Issued |
Array
(
[id] => 844078
[patent_doc_number] => 07388275
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-17
[patent_title] => 'Electronic package with integrated capacitor'
[patent_app_type] => utility
[patent_app_number] => 11/422007
[patent_app_country] => US
[patent_app_date] => 2006-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 11422007
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/422007 | Electronic package with integrated capacitor | Jun 1, 2006 | Issued |
Array
(
[id] => 5854209
[patent_doc_number] => 20060226142
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-12
[patent_title] => 'Enhancement of performance of a conductive wire in a multilayered substrate'
[patent_app_type] => utility
[patent_app_number] => 11/442911
[patent_app_country] => US
[patent_app_date] => 2006-05-30
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[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 9092
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[pdf_file] => publications/A1/0226/20060226142.pdf
[firstpage_image] =>[orig_patent_app_number] => 11442911
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/442911 | Enhancement of performance of a conductive wire in a multilayered substrate | May 29, 2006 | Issued |
Array
(
[id] => 5697606
[patent_doc_number] => 20060214290
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-28
[patent_title] => 'Semiconductor device with interlocking clip'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2006-05-26
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[patent_no_of_words] => 3994
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[firstpage_image] =>[orig_patent_app_number] => 11441569
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/441569 | Semiconductor device with interlocking clip | May 25, 2006 | Issued |
Array
(
[id] => 889017
[patent_doc_number] => 07348604
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Light-emitting module'
[patent_app_type] => utility
[patent_app_number] => 11/419292
[patent_app_country] => US
[patent_app_date] => 2006-05-19
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[pdf_file] => patents/07/348/07348604.pdf
[firstpage_image] =>[orig_patent_app_number] => 11419292
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/419292 | Light-emitting module | May 18, 2006 | Issued |
Array
(
[id] => 5148909
[patent_doc_number] => 20070048969
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[patent_issue_date] => 2007-03-01
[patent_title] => 'Stacked chip package using photosensitive polymer and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/436851
[patent_app_country] => US
[patent_app_date] => 2006-05-18
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[patent_drawing_sheets_cnt] => 24
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[pdf_file] => publications/A1/0048/20070048969.pdf
[firstpage_image] =>[orig_patent_app_number] => 11436851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/436851 | Stacked chip package using photosensitive polymer and manufacturing method thereof | May 17, 2006 | Issued |
Array
(
[id] => 349213
[patent_doc_number] => 07495331
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-24
[patent_title] => 'Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/433901
[patent_app_country] => US
[patent_app_date] => 2006-05-12
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[patent_drawing_sheets_cnt] => 11
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[pdf_file] => patents/07/495/07495331.pdf
[firstpage_image] =>[orig_patent_app_number] => 11433901
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/433901 | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | May 11, 2006 | Issued |
Array
(
[id] => 5730342
[patent_doc_number] => 20060255456
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Multilayer substrate and the manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/431021
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11431021
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/431021 | Multilayer substrate and the manufacturing method thereof | May 9, 2006 | Issued |
Array
(
[id] => 442743
[patent_doc_number] => 07256067
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-08-14
[patent_title] => 'LGA fixture for indium assembly process'
[patent_app_type] => utility
[patent_app_number] => 11/381089
[patent_app_country] => US
[patent_app_date] => 2006-05-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/256/07256067.pdf
[firstpage_image] =>[orig_patent_app_number] => 11381089
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/381089 | LGA fixture for indium assembly process | Apr 30, 2006 | Issued |
Array
(
[id] => 349202
[patent_doc_number] => 07495320
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-24
[patent_title] => 'System and method for providing a power bus in a wirebond leadframe package'
[patent_app_type] => utility
[patent_app_number] => 11/412521
[patent_app_country] => US
[patent_app_date] => 2006-04-27
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[pdf_file] => patents/07/495/07495320.pdf
[firstpage_image] =>[orig_patent_app_number] => 11412521
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/412521 | System and method for providing a power bus in a wirebond leadframe package | Apr 26, 2006 | Issued |
Array
(
[id] => 4968623
[patent_doc_number] => 20070108625
[patent_country] => US
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[patent_issue_date] => 2007-05-17
[patent_title] => 'Package and package module of the package'
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Array
(
[id] => 122813
[patent_doc_number] => 07709940
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[patent_title] => 'Micro device encapsulation'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/379932 | Micro device encapsulation | Apr 23, 2006 | Issued |
Array
(
[id] => 833827
[patent_doc_number] => 07397118
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[patent_issue_date] => 2008-07-08
[patent_title] => 'Ceramic chip-type electronic component and method of making the same'
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Array
(
[id] => 5123601
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/397914 | Surface-mountable light-emitting diode structural element | Apr 2, 2006 | Issued |
Array
(
[id] => 5073075
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Array
(
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/391607 | Package structure of a microphone | Mar 28, 2006 | Abandoned |