Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 142552 [patent_doc_number] => 07687803 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-30 [patent_title] => 'Semiconductor device and method for manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/448721 [patent_app_country] => US [patent_app_date] => 2006-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 9192 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/687/07687803.pdf [firstpage_image] =>[orig_patent_app_number] => 11448721 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/448721
Semiconductor device and method for manufacturing semiconductor device Jun 7, 2006 Issued
Array ( [id] => 7589080 [patent_doc_number] => 07663245 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-16 [patent_title] => 'Interposer and stacked chip package' [patent_app_type] => utility [patent_app_number] => 11/446971 [patent_app_country] => US [patent_app_date] => 2006-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 22 [patent_no_of_words] => 5240 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/663/07663245.pdf [firstpage_image] =>[orig_patent_app_number] => 11446971 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/446971
Interposer and stacked chip package Jun 5, 2006 Issued
Array ( [id] => 844078 [patent_doc_number] => 07388275 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-17 [patent_title] => 'Electronic package with integrated capacitor' [patent_app_type] => utility [patent_app_number] => 11/422007 [patent_app_country] => US [patent_app_date] => 2006-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 5601 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/388/07388275.pdf [firstpage_image] =>[orig_patent_app_number] => 11422007 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/422007
Electronic package with integrated capacitor Jun 1, 2006 Issued
Array ( [id] => 5854209 [patent_doc_number] => 20060226142 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-12 [patent_title] => 'Enhancement of performance of a conductive wire in a multilayered substrate' [patent_app_type] => utility [patent_app_number] => 11/442911 [patent_app_country] => US [patent_app_date] => 2006-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9092 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0226/20060226142.pdf [firstpage_image] =>[orig_patent_app_number] => 11442911 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/442911
Enhancement of performance of a conductive wire in a multilayered substrate May 29, 2006 Issued
Array ( [id] => 5697606 [patent_doc_number] => 20060214290 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Semiconductor device with interlocking clip' [patent_app_type] => utility [patent_app_number] => 11/441569 [patent_app_country] => US [patent_app_date] => 2006-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3994 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214290.pdf [firstpage_image] =>[orig_patent_app_number] => 11441569 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/441569
Semiconductor device with interlocking clip May 25, 2006 Issued
Array ( [id] => 889017 [patent_doc_number] => 07348604 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-03-25 [patent_title] => 'Light-emitting module' [patent_app_type] => utility [patent_app_number] => 11/419292 [patent_app_country] => US [patent_app_date] => 2006-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5312 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/348/07348604.pdf [firstpage_image] =>[orig_patent_app_number] => 11419292 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/419292
Light-emitting module May 18, 2006 Issued
Array ( [id] => 5148909 [patent_doc_number] => 20070048969 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Stacked chip package using photosensitive polymer and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/436851 [patent_app_country] => US [patent_app_date] => 2006-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 7241 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0048/20070048969.pdf [firstpage_image] =>[orig_patent_app_number] => 11436851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/436851
Stacked chip package using photosensitive polymer and manufacturing method thereof May 17, 2006 Issued
Array ( [id] => 349213 [patent_doc_number] => 07495331 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-02-24 [patent_title] => 'Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus' [patent_app_type] => utility [patent_app_number] => 11/433901 [patent_app_country] => US [patent_app_date] => 2006-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 16 [patent_no_of_words] => 7835 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/495/07495331.pdf [firstpage_image] =>[orig_patent_app_number] => 11433901 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/433901
Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus May 11, 2006 Issued
Array ( [id] => 5730342 [patent_doc_number] => 20060255456 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Multilayer substrate and the manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/431021 [patent_app_country] => US [patent_app_date] => 2006-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3351 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0255/20060255456.pdf [firstpage_image] =>[orig_patent_app_number] => 11431021 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/431021
Multilayer substrate and the manufacturing method thereof May 9, 2006 Issued
Array ( [id] => 442743 [patent_doc_number] => 07256067 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-08-14 [patent_title] => 'LGA fixture for indium assembly process' [patent_app_type] => utility [patent_app_number] => 11/381089 [patent_app_country] => US [patent_app_date] => 2006-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3369 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/256/07256067.pdf [firstpage_image] =>[orig_patent_app_number] => 11381089 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/381089
LGA fixture for indium assembly process Apr 30, 2006 Issued
Array ( [id] => 349202 [patent_doc_number] => 07495320 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-02-24 [patent_title] => 'System and method for providing a power bus in a wirebond leadframe package' [patent_app_type] => utility [patent_app_number] => 11/412521 [patent_app_country] => US [patent_app_date] => 2006-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 2616 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/495/07495320.pdf [firstpage_image] =>[orig_patent_app_number] => 11412521 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/412521
System and method for providing a power bus in a wirebond leadframe package Apr 26, 2006 Issued
Array ( [id] => 4968623 [patent_doc_number] => 20070108625 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-17 [patent_title] => 'Package and package module of the package' [patent_app_type] => utility [patent_app_number] => 11/410902 [patent_app_country] => US [patent_app_date] => 2006-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3174 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20070108625.pdf [firstpage_image] =>[orig_patent_app_number] => 11410902 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/410902
Package and package module of the package Apr 25, 2006 Issued
Array ( [id] => 122813 [patent_doc_number] => 07709940 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-04 [patent_title] => 'Micro device encapsulation' [patent_app_type] => utility [patent_app_number] => 11/379932 [patent_app_country] => US [patent_app_date] => 2006-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 4559 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/709/07709940.pdf [firstpage_image] =>[orig_patent_app_number] => 11379932 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/379932
Micro device encapsulation Apr 23, 2006 Issued
Array ( [id] => 833827 [patent_doc_number] => 07397118 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-08 [patent_title] => 'Ceramic chip-type electronic component and method of making the same' [patent_app_type] => utility [patent_app_number] => 11/403741 [patent_app_country] => US [patent_app_date] => 2006-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2397 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/397/07397118.pdf [firstpage_image] =>[orig_patent_app_number] => 11403741 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/403741
Ceramic chip-type electronic component and method of making the same Apr 12, 2006 Issued
Array ( [id] => 5123601 [patent_doc_number] => 20070235871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'High frequency IC package and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/400182 [patent_app_country] => US [patent_app_date] => 2006-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3129 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235871.pdf [firstpage_image] =>[orig_patent_app_number] => 11400182 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/400182
High frequency IC package and method for fabricating the same Apr 9, 2006 Issued
Array ( [id] => 530414 [patent_doc_number] => 07183632 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-27 [patent_title] => 'Surface-mountable light-emitting diode structural element' [patent_app_type] => utility [patent_app_number] => 11/397914 [patent_app_country] => US [patent_app_date] => 2006-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 4092 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 225 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/183/07183632.pdf [firstpage_image] =>[orig_patent_app_number] => 11397914 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/397914
Surface-mountable light-emitting diode structural element Apr 2, 2006 Issued
Array ( [id] => 5073075 [patent_doc_number] => 20070013050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-18 [patent_title] => 'Structure of an over-current protection device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/396197 [patent_app_country] => US [patent_app_date] => 2006-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2077 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0013/20070013050.pdf [firstpage_image] =>[orig_patent_app_number] => 11396197 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/396197
Structure of an over-current protection device and method for manufacturing the same Mar 30, 2006 Abandoned
Array ( [id] => 203458 [patent_doc_number] => 07633154 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-15 [patent_title] => 'Encapsulation and methods thereof' [patent_app_type] => utility [patent_app_number] => 11/392721 [patent_app_country] => US [patent_app_date] => 2006-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 28 [patent_no_of_words] => 2930 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/633/07633154.pdf [firstpage_image] =>[orig_patent_app_number] => 11392721 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/392721
Encapsulation and methods thereof Mar 29, 2006 Issued
Array ( [id] => 904377 [patent_doc_number] => 07335974 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-26 [patent_title] => 'Multi stack packaging chip and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/391211 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 25 [patent_no_of_words] => 4424 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/335/07335974.pdf [firstpage_image] =>[orig_patent_app_number] => 11391211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/391211
Multi stack packaging chip and method of manufacturing the same Mar 28, 2006 Issued
Array ( [id] => 5098742 [patent_doc_number] => 20070182002 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-09 [patent_title] => 'Package structure of a microphone' [patent_app_type] => utility [patent_app_number] => 11/391607 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2950 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0182/20070182002.pdf [firstpage_image] =>[orig_patent_app_number] => 11391607 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/391607
Package structure of a microphone Mar 28, 2006 Abandoned
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