Jasmine Jhihan B. Clark

Array ( [id] => 908290 [patent_doc_number] => 07332808 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-19 [patent_title] => 'Semiconductor module and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/393531 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 5889 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/332/07332808.pdf [firstpage_image] =>[orig_patent_app_number] => 11393531 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5697591 [patent_doc_number] => 20060214275 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/378651 [patent_app_country] => US [patent_app_date] => 2006-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3862 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214275.pdf [firstpage_image] =>[orig_patent_app_number] => 11378651 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4974775 [patent_doc_number] => 20070216005 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-20 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM' [patent_app_type] => utility [patent_app_number] => 11/276941 [patent_app_country] => US [patent_app_date] => 2006-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5592 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0216/20070216005.pdf [firstpage_image] =>[orig_patent_app_number] => 11276941 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5208224 [patent_doc_number] => 20070246808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Power semiconductor module having surface-mountable flat external contacts and method for producing the same' [patent_app_type] => utility [patent_app_number] => 11/376871 [patent_app_country] => US [patent_app_date] => 2006-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6398 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20070246808.pdf [firstpage_image] =>[orig_patent_app_number] => 11376871 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5239817 [patent_doc_number] => 20070018308 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-25 [patent_title] => 'Electronic component and electronic configuration' [patent_app_type] => utility [patent_app_number] => 11/374419 [patent_app_country] => US [patent_app_date] => 2006-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 8258 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0018/20070018308.pdf [firstpage_image] =>[orig_patent_app_number] => 11374419 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5697595 [patent_doc_number] => 20060214279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Contacting device, testing method and corresponding production method' [patent_app_type] => utility [patent_app_number] => 11/374391 [patent_app_country] => US [patent_app_date] => 2006-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2609 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214279.pdf [firstpage_image] =>[orig_patent_app_number] => 11374391 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 833841 [patent_doc_number] => 07397132 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-08 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/373142 [patent_app_country] => US [patent_app_date] => 2006-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3295 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/397/07397132.pdf [firstpage_image] =>[orig_patent_app_number] => 11373142 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4992294 [patent_doc_number] => 20070007638 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-11 [patent_title] => 'MEMORY ARRAY MODULE MOUNTING STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/308161 [patent_app_country] => US [patent_app_date] => 2006-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2232 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20070007638.pdf [firstpage_image] =>[orig_patent_app_number] => 11308161 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5233942 [patent_doc_number] => 20070126097 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-07 [patent_title] => 'Chip package structure' [patent_app_type] => utility [patent_app_number] => 11/373531 [patent_app_country] => US [patent_app_date] => 2006-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6218 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0126/20070126097.pdf [firstpage_image] =>[orig_patent_app_number] => 11373531 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5256790 [patent_doc_number] => 20070210422 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS' [patent_app_type] => utility [patent_app_number] => 11/276681 [patent_app_country] => US [patent_app_date] => 2006-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6428 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210422.pdf [firstpage_image] =>[orig_patent_app_number] => 11276681 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5916615 [patent_doc_number] => 20060237814 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-26 [patent_title] => 'Semiconductor device having surface mountable external contact areas and method for producing the same' [patent_app_type] => utility [patent_app_number] => 11/370441 [patent_app_country] => US [patent_app_date] => 2006-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4009 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20060237814.pdf [firstpage_image] =>[orig_patent_app_number] => 11370441 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5757416 [patent_doc_number] => 20060208361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Semiconductor chip' [patent_app_type] => utility [patent_app_number] => 11/368671 [patent_app_country] => US [patent_app_date] => 2006-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7218 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208361.pdf [firstpage_image] =>[orig_patent_app_number] => 11368671 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 72591 [patent_doc_number] => 07755083 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-13 [patent_title] => 'Package module with alignment structure and electronic device with the same' [patent_app_type] => utility [patent_app_number] => 11/365181 [patent_app_country] => US [patent_app_date] => 2006-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2354 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/755/07755083.pdf [firstpage_image] =>[orig_patent_app_number] => 11365181 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5219840 [patent_doc_number] => 20070161151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-12 [patent_title] => 'Packaged semiconductor device with dual exposed surfaces and method of manufacturing' [patent_app_type] => utility [patent_app_number] => 11/364399 [patent_app_country] => US [patent_app_date] => 2006-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 5252 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0161/20070161151.pdf [firstpage_image] =>[orig_patent_app_number] => 11364399 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5002639 [patent_doc_number] => 20070200205 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING' [patent_app_type] => utility [patent_app_number] => 11/307861 [patent_app_country] => US [patent_app_date] => 2006-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3784 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20070200205.pdf [firstpage_image] =>[orig_patent_app_number] => 11307861 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5002690 [patent_doc_number] => 20070200257 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE INTERCONNECT INTERFACE' [patent_app_type] => utility [patent_app_number] => 11/307862 [patent_app_country] => US [patent_app_date] => 2006-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 7868 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20070200257.pdf [firstpage_image] =>[orig_patent_app_number] => 11307862 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5110508 [patent_doc_number] => 20070194423 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-23 [patent_title] => 'STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH RECESSED SPACER' [patent_app_type] => utility [patent_app_number] => 11/307722 [patent_app_country] => US [patent_app_date] => 2006-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6479 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0194/20070194423.pdf [firstpage_image] =>[orig_patent_app_number] => 11307722 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 496097 [patent_doc_number] => 07211902 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-01 [patent_title] => 'Method of forming a bonding pad structure' [patent_app_type] => utility [patent_app_number] => 11/354134 [patent_app_country] => US [patent_app_date] => 2006-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 7292 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 292 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/211/07211902.pdf [firstpage_image] =>[orig_patent_app_number] => 11354134 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7492394 [patent_doc_number] => 08030755 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-04 [patent_title] => 'Integrated circuit package system with a heat sink' [patent_app_type] => utility [patent_app_number] => 11/307532 [patent_app_country] => US [patent_app_date] => 2006-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 4274 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/030/08030755.pdf [firstpage_image] =>[orig_patent_app_number] => 11307532 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 646470 [patent_doc_number] => 07119446 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-10 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/348351 [patent_app_country] => US [patent_app_date] => 2006-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 21 [patent_no_of_words] => 9396 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/119/07119446.pdf [firstpage_image] =>[orig_patent_app_number] => 11348351 [rel_patent_id] =>[rel_patent_doc_number] =>)