Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5757710 [patent_doc_number] => 20060208655 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Surface-emitting type device and its manufacturing method' [patent_app_type] => utility [patent_app_number] => 11/344192 [patent_app_country] => US [patent_app_date] => 2006-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7106 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208655.pdf [firstpage_image] =>[orig_patent_app_number] => 11344192 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/344192
Surface-emitting type device and its manufacturing method Jan 31, 2006 Issued
Array ( [id] => 253054 [patent_doc_number] => 07579689 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-08-25 [patent_title] => 'Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package' [patent_app_type] => utility [patent_app_number] => 11/344372 [patent_app_country] => US [patent_app_date] => 2006-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 12609 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 230 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/579/07579689.pdf [firstpage_image] =>[orig_patent_app_number] => 11344372 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/344372
Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package Jan 30, 2006 Issued
Array ( [id] => 133928 [patent_doc_number] => 07696616 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-13 [patent_title] => 'Stacked type semiconductor device and method of fabricating stacked type semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/339352 [patent_app_country] => US [patent_app_date] => 2006-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 3889 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/696/07696616.pdf [firstpage_image] =>[orig_patent_app_number] => 11339352 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/339352
Stacked type semiconductor device and method of fabricating stacked type semiconductor device Jan 24, 2006 Issued
Array ( [id] => 5593952 [patent_doc_number] => 20060157868 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-20 [patent_title] => 'Flip-chip semiconductor device with improved power pad arrangement' [patent_app_type] => utility [patent_app_number] => 11/333311 [patent_app_country] => US [patent_app_date] => 2006-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4967 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20060157868.pdf [firstpage_image] =>[orig_patent_app_number] => 11333311 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/333311
Flip-chip semiconductor device with improved power pad arrangement Jan 17, 2006 Issued
Array ( [id] => 5667217 [patent_doc_number] => 20060172567 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-03 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/329101 [patent_app_country] => US [patent_app_date] => 2006-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3294 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0172/20060172567.pdf [firstpage_image] =>[orig_patent_app_number] => 11329101 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/329101
Semiconductor device Jan 10, 2006 Issued
Array ( [id] => 5840333 [patent_doc_number] => 20060120047 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Coolant cooled type semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/325331 [patent_app_country] => US [patent_app_date] => 2006-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 20549 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0120/20060120047.pdf [firstpage_image] =>[orig_patent_app_number] => 11325331 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/325331
Coolant cooled type semiconductor device Jan 4, 2006 Issued
Array ( [id] => 908287 [patent_doc_number] => 07332807 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-19 [patent_title] => 'Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same' [patent_app_type] => utility [patent_app_number] => 11/323512 [patent_app_country] => US [patent_app_date] => 2005-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 5907 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/332/07332807.pdf [firstpage_image] =>[orig_patent_app_number] => 11323512 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/323512
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Dec 29, 2005 Issued
Array ( [id] => 5745683 [patent_doc_number] => 20060108607 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-25 [patent_title] => 'Integrated circuit component and mounting method thereof' [patent_app_type] => utility [patent_app_number] => 11/321811 [patent_app_country] => US [patent_app_date] => 2005-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 7015 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20060108607.pdf [firstpage_image] =>[orig_patent_app_number] => 11321811 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/321811
Integrated circuit component and mounting method thereof Dec 28, 2005 Issued
Array ( [id] => 908274 [patent_doc_number] => 07332799 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-19 [patent_title] => 'Packaged chip having features for improved signal transmission on the package' [patent_app_type] => utility [patent_app_number] => 11/319961 [patent_app_country] => US [patent_app_date] => 2005-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 6404 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/332/07332799.pdf [firstpage_image] =>[orig_patent_app_number] => 11319961 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/319961
Packaged chip having features for improved signal transmission on the package Dec 27, 2005 Issued
Array ( [id] => 853378 [patent_doc_number] => 07378726 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-27 [patent_title] => 'Stacked packages with interconnecting pins' [patent_app_type] => utility [patent_app_number] => 11/320281 [patent_app_country] => US [patent_app_date] => 2005-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 2409 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/378/07378726.pdf [firstpage_image] =>[orig_patent_app_number] => 11320281 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/320281
Stacked packages with interconnecting pins Dec 27, 2005 Issued
Array ( [id] => 849528 [patent_doc_number] => 07382047 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-03 [patent_title] => 'Heat dissipation device' [patent_app_type] => utility [patent_app_number] => 11/306412 [patent_app_country] => US [patent_app_date] => 2005-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1606 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/382/07382047.pdf [firstpage_image] =>[orig_patent_app_number] => 11306412 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/306412
Heat dissipation device Dec 26, 2005 Issued
Array ( [id] => 5133802 [patent_doc_number] => 20070075431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-05 [patent_title] => 'Power feed device to power pins of electrical component' [patent_app_type] => utility [patent_app_number] => 11/316861 [patent_app_country] => US [patent_app_date] => 2005-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6239 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0075/20070075431.pdf [firstpage_image] =>[orig_patent_app_number] => 11316861 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/316861
Power feed device to power pins of electrical component Dec 26, 2005 Issued
Array ( [id] => 5652889 [patent_doc_number] => 20060138624 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Semiconductor device package' [patent_app_type] => utility [patent_app_number] => 11/322886 [patent_app_country] => US [patent_app_date] => 2005-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5061 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138624.pdf [firstpage_image] =>[orig_patent_app_number] => 11322886 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/322886
Semiconductor device package Dec 26, 2005 Issued
Array ( [id] => 397956 [patent_doc_number] => 07294925 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-11-13 [patent_title] => 'Optical scanner package having heating dam' [patent_app_type] => utility [patent_app_number] => 11/315242 [patent_app_country] => US [patent_app_date] => 2005-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3027 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/294/07294925.pdf [firstpage_image] =>[orig_patent_app_number] => 11315242 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/315242
Optical scanner package having heating dam Dec 22, 2005 Issued
Array ( [id] => 5652906 [patent_doc_number] => 20060138641 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card' [patent_app_type] => utility [patent_app_number] => 11/315482 [patent_app_country] => US [patent_app_date] => 2005-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 41 [patent_figures_cnt] => 41 [patent_no_of_words] => 12170 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138641.pdf [firstpage_image] =>[orig_patent_app_number] => 11315482 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/315482
Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card Dec 22, 2005 Issued
Array ( [id] => 5628848 [patent_doc_number] => 20060145316 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Semiconductor package having enhanced heat dissipation and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/313721 [patent_app_country] => US [patent_app_date] => 2005-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3876 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145316.pdf [firstpage_image] =>[orig_patent_app_number] => 11313721 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/313721
Semiconductor package having enhanced heat dissipation and method of fabricating the same Dec 21, 2005 Issued
Array ( [id] => 5019603 [patent_doc_number] => 20070145569 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'Image sensor module with passive component' [patent_app_type] => utility [patent_app_number] => 11/317071 [patent_app_country] => US [patent_app_date] => 2005-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1403 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145569.pdf [firstpage_image] =>[orig_patent_app_number] => 11317071 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/317071
Image sensor module with passive component Dec 21, 2005 Issued
Array ( [id] => 826778 [patent_doc_number] => 07402442 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-22 [patent_title] => 'Physically highly secure multi-chip assembly' [patent_app_type] => utility [patent_app_number] => 11/314272 [patent_app_country] => US [patent_app_date] => 2005-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3976 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/402/07402442.pdf [firstpage_image] =>[orig_patent_app_number] => 11314272 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/314272
Physically highly secure multi-chip assembly Dec 20, 2005 Issued
Array ( [id] => 5168914 [patent_doc_number] => 20070069345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-29 [patent_title] => 'Package of leadframe with heatsinks' [patent_app_type] => utility [patent_app_number] => 11/312461 [patent_app_country] => US [patent_app_date] => 2005-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1557 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0069/20070069345.pdf [firstpage_image] =>[orig_patent_app_number] => 11312461 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/312461
Package of leadframe with heatsinks Dec 20, 2005 Issued
Array ( [id] => 857333 [patent_doc_number] => 07375406 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-20 [patent_title] => 'Thermoplastic overmolding for small package turbocharger speed sensor' [patent_app_type] => utility [patent_app_number] => 11/314328 [patent_app_country] => US [patent_app_date] => 2005-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 3512 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/375/07375406.pdf [firstpage_image] =>[orig_patent_app_number] => 11314328 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/314328
Thermoplastic overmolding for small package turbocharger speed sensor Dec 19, 2005 Issued
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