
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5757710
[patent_doc_number] => 20060208655
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-21
[patent_title] => 'Surface-emitting type device and its manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 11/344192
[patent_app_country] => US
[patent_app_date] => 2006-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 7106
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0208/20060208655.pdf
[firstpage_image] =>[orig_patent_app_number] => 11344192
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/344192 | Surface-emitting type device and its manufacturing method | Jan 31, 2006 | Issued |
Array
(
[id] => 253054
[patent_doc_number] => 07579689
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-08-25
[patent_title] => 'Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package'
[patent_app_type] => utility
[patent_app_number] => 11/344372
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[patent_app_date] => 2006-01-31
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[pdf_file] => patents/07/579/07579689.pdf
[firstpage_image] =>[orig_patent_app_number] => 11344372
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/344372 | Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package | Jan 30, 2006 | Issued |
Array
(
[id] => 133928
[patent_doc_number] => 07696616
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-13
[patent_title] => 'Stacked type semiconductor device and method of fabricating stacked type semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/339352
[patent_app_country] => US
[patent_app_date] => 2006-01-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/339352 | Stacked type semiconductor device and method of fabricating stacked type semiconductor device | Jan 24, 2006 | Issued |
Array
(
[id] => 5593952
[patent_doc_number] => 20060157868
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-20
[patent_title] => 'Flip-chip semiconductor device with improved power pad arrangement'
[patent_app_type] => utility
[patent_app_number] => 11/333311
[patent_app_country] => US
[patent_app_date] => 2006-01-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/333311 | Flip-chip semiconductor device with improved power pad arrangement | Jan 17, 2006 | Issued |
Array
(
[id] => 5667217
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[patent_title] => 'Semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11329101
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/329101 | Semiconductor device | Jan 10, 2006 | Issued |
Array
(
[id] => 5840333
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[patent_issue_date] => 2006-06-08
[patent_title] => 'Coolant cooled type semiconductor device'
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[patent_app_number] => 11/325331
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[firstpage_image] =>[orig_patent_app_number] => 11325331
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/325331 | Coolant cooled type semiconductor device | Jan 4, 2006 | Issued |
Array
(
[id] => 908287
[patent_doc_number] => 07332807
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[patent_issue_date] => 2008-02-19
[patent_title] => 'Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same'
[patent_app_type] => utility
[patent_app_number] => 11/323512
[patent_app_country] => US
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/07/332/07332807.pdf
[firstpage_image] =>[orig_patent_app_number] => 11323512
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/323512 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Dec 29, 2005 | Issued |
Array
(
[id] => 5745683
[patent_doc_number] => 20060108607
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-25
[patent_title] => 'Integrated circuit component and mounting method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/321811
[patent_app_country] => US
[patent_app_date] => 2005-12-29
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[patent_drawing_sheets_cnt] => 21
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[pdf_file] => publications/A1/0108/20060108607.pdf
[firstpage_image] =>[orig_patent_app_number] => 11321811
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/321811 | Integrated circuit component and mounting method thereof | Dec 28, 2005 | Issued |
Array
(
[id] => 908274
[patent_doc_number] => 07332799
[patent_country] => US
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[patent_issue_date] => 2008-02-19
[patent_title] => 'Packaged chip having features for improved signal transmission on the package'
[patent_app_type] => utility
[patent_app_number] => 11/319961
[patent_app_country] => US
[patent_app_date] => 2005-12-28
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[firstpage_image] =>[orig_patent_app_number] => 11319961
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/319961 | Packaged chip having features for improved signal transmission on the package | Dec 27, 2005 | Issued |
Array
(
[id] => 853378
[patent_doc_number] => 07378726
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-27
[patent_title] => 'Stacked packages with interconnecting pins'
[patent_app_type] => utility
[patent_app_number] => 11/320281
[patent_app_country] => US
[patent_app_date] => 2005-12-28
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[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/07/378/07378726.pdf
[firstpage_image] =>[orig_patent_app_number] => 11320281
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/320281 | Stacked packages with interconnecting pins | Dec 27, 2005 | Issued |
Array
(
[id] => 849528
[patent_doc_number] => 07382047
[patent_country] => US
[patent_kind] => B2
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[patent_title] => 'Heat dissipation device'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11306412
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306412 | Heat dissipation device | Dec 26, 2005 | Issued |
Array
(
[id] => 5133802
[patent_doc_number] => 20070075431
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-05
[patent_title] => 'Power feed device to power pins of electrical component'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/316861 | Power feed device to power pins of electrical component | Dec 26, 2005 | Issued |
Array
(
[id] => 5652889
[patent_doc_number] => 20060138624
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[patent_issue_date] => 2006-06-29
[patent_title] => 'Semiconductor device package'
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[firstpage_image] =>[orig_patent_app_number] => 11322886
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Array
(
[id] => 397956
[patent_doc_number] => 07294925
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[patent_kind] => B2
[patent_issue_date] => 2007-11-13
[patent_title] => 'Optical scanner package having heating dam'
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[firstpage_image] =>[orig_patent_app_number] => 11315242
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/315242 | Optical scanner package having heating dam | Dec 22, 2005 | Issued |
Array
(
[id] => 5652906
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[patent_issue_date] => 2006-06-29
[patent_title] => 'Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card'
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Array
(
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/314272 | Physically highly secure multi-chip assembly | Dec 20, 2005 | Issued |
Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/314328 | Thermoplastic overmolding for small package turbocharger speed sensor | Dec 19, 2005 | Issued |