
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7592819
[patent_doc_number] => 07652383
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-26
[patent_title] => 'Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module'
[patent_app_type] => utility
[patent_app_number] => 11/305282
[patent_app_country] => US
[patent_app_date] => 2005-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 3914
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[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/652/07652383.pdf
[firstpage_image] =>[orig_patent_app_number] => 11305282
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/305282 | Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module | Dec 15, 2005 | Issued |
Array
(
[id] => 5116889
[patent_doc_number] => 20070138603
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[patent_kind] => A1
[patent_issue_date] => 2007-06-21
[patent_title] => 'Apparatus and method incorporating discrete passive components in an electronic package'
[patent_app_type] => utility
[patent_app_number] => 11/305462
[patent_app_country] => US
[patent_app_date] => 2005-12-16
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 401535
[patent_doc_number] => 07291902
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-06
[patent_title] => 'Chip component and method for producing a chip component'
[patent_app_type] => utility
[patent_app_number] => 11/304491
[patent_app_country] => US
[patent_app_date] => 2005-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/07/291/07291902.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304491 | Chip component and method for producing a chip component | Dec 14, 2005 | Issued |
Array
(
[id] => 345474
[patent_doc_number] => 07498664
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-03
[patent_title] => 'Semiconductor package having increased resistance to electrostatic discharge'
[patent_app_type] => utility
[patent_app_number] => 11/304862
[patent_app_country] => US
[patent_app_date] => 2005-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2959
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[firstpage_image] =>[orig_patent_app_number] => 11304862
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304862 | Semiconductor package having increased resistance to electrostatic discharge | Dec 13, 2005 | Issued |
Array
(
[id] => 5774134
[patent_doc_number] => 20060103015
[patent_country] => US
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[patent_issue_date] => 2006-05-18
[patent_title] => 'Multi-chip electronic package and cooling system'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2005-12-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/300151 | Multi-chip electronic package and cooling system | Dec 12, 2005 | Issued |
Array
(
[id] => 861357
[patent_doc_number] => 07372140
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[patent_kind] => B2
[patent_issue_date] => 2008-05-13
[patent_title] => 'Memory module with different types of multi chip packages'
[patent_app_type] => utility
[patent_app_number] => 11/302052
[patent_app_country] => US
[patent_app_date] => 2005-12-12
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[pdf_file] => patents/07/372/07372140.pdf
[firstpage_image] =>[orig_patent_app_number] => 11302052
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/302052 | Memory module with different types of multi chip packages | Dec 11, 2005 | Issued |
Array
(
[id] => 5869087
[patent_doc_number] => 20060163704
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[patent_issue_date] => 2006-07-27
[patent_title] => 'Chip package and producing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/298522
[patent_app_country] => US
[patent_app_date] => 2005-12-12
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[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 11298522
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/298522 | Chip package and producing method thereof | Dec 11, 2005 | Issued |
Array
(
[id] => 5233933
[patent_doc_number] => 20070126088
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'Chip on lead frame for small package speed sensor'
[patent_app_type] => utility
[patent_app_number] => 11/295371
[patent_app_country] => US
[patent_app_date] => 2005-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[firstpage_image] =>[orig_patent_app_number] => 11295371
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/295371 | Chip on lead frame for small package speed sensor | Dec 4, 2005 | Issued |
Array
(
[id] => 920154
[patent_doc_number] => 07321164
[patent_country] => US
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[patent_issue_date] => 2008-01-22
[patent_title] => 'Stack structure with semiconductor chip embedded in carrier'
[patent_app_type] => utility
[patent_app_number] => 11/294842
[patent_app_country] => US
[patent_app_date] => 2005-12-05
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[pdf_file] => patents/07/321/07321164.pdf
[firstpage_image] =>[orig_patent_app_number] => 11294842
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/294842 | Stack structure with semiconductor chip embedded in carrier | Dec 4, 2005 | Issued |
Array
(
[id] => 833820
[patent_doc_number] => 07397111
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-08
[patent_title] => 'Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component'
[patent_app_type] => utility
[patent_app_number] => 11/291072
[patent_app_country] => US
[patent_app_date] => 2005-12-01
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[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/07/397/07397111.pdf
[firstpage_image] =>[orig_patent_app_number] => 11291072
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Array
(
[id] => 5233941
[patent_doc_number] => 20070126096
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[patent_issue_date] => 2007-06-07
[patent_title] => 'Leadframe comprising tin plating or an intermetallic layer formed therefrom'
[patent_app_type] => utility
[patent_app_number] => 11/293711
[patent_app_country] => US
[patent_app_date] => 2005-12-01
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Array
(
[id] => 5077009
[patent_doc_number] => 20070120233
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[patent_title] => 'Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices'
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Array
(
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Array
(
[id] => 824000
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[patent_title] => 'Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing'
[patent_app_type] => utility
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Array
(
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Array
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[id] => 5093067
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Array
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/265692 | Light emitting diode fixture and heat sink | Oct 31, 2005 | Issued |