Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7592819 [patent_doc_number] => 07652383 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-26 [patent_title] => 'Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module' [patent_app_type] => utility [patent_app_number] => 11/305282 [patent_app_country] => US [patent_app_date] => 2005-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 3914 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/652/07652383.pdf [firstpage_image] =>[orig_patent_app_number] => 11305282 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/305282
Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module Dec 15, 2005 Issued
Array ( [id] => 5116889 [patent_doc_number] => 20070138603 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-21 [patent_title] => 'Apparatus and method incorporating discrete passive components in an electronic package' [patent_app_type] => utility [patent_app_number] => 11/305462 [patent_app_country] => US [patent_app_date] => 2005-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2038 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20070138603.pdf [firstpage_image] =>[orig_patent_app_number] => 11305462 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/305462
Apparatus and method incorporating discrete passive components in an electronic package Dec 15, 2005 Issued
Array ( [id] => 401535 [patent_doc_number] => 07291902 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-11-06 [patent_title] => 'Chip component and method for producing a chip component' [patent_app_type] => utility [patent_app_number] => 11/304491 [patent_app_country] => US [patent_app_date] => 2005-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 5746 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/291/07291902.pdf [firstpage_image] =>[orig_patent_app_number] => 11304491 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/304491
Chip component and method for producing a chip component Dec 14, 2005 Issued
Array ( [id] => 345474 [patent_doc_number] => 07498664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-03 [patent_title] => 'Semiconductor package having increased resistance to electrostatic discharge' [patent_app_type] => utility [patent_app_number] => 11/304862 [patent_app_country] => US [patent_app_date] => 2005-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2959 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/498/07498664.pdf [firstpage_image] =>[orig_patent_app_number] => 11304862 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/304862
Semiconductor package having increased resistance to electrostatic discharge Dec 13, 2005 Issued
Array ( [id] => 5774134 [patent_doc_number] => 20060103015 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-18 [patent_title] => 'Multi-chip electronic package and cooling system' [patent_app_type] => utility [patent_app_number] => 11/300151 [patent_app_country] => US [patent_app_date] => 2005-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5629 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0103/20060103015.pdf [firstpage_image] =>[orig_patent_app_number] => 11300151 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/300151
Multi-chip electronic package and cooling system Dec 12, 2005 Issued
Array ( [id] => 861357 [patent_doc_number] => 07372140 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-13 [patent_title] => 'Memory module with different types of multi chip packages' [patent_app_type] => utility [patent_app_number] => 11/302052 [patent_app_country] => US [patent_app_date] => 2005-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 1597 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/372/07372140.pdf [firstpage_image] =>[orig_patent_app_number] => 11302052 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/302052
Memory module with different types of multi chip packages Dec 11, 2005 Issued
Array ( [id] => 5869087 [patent_doc_number] => 20060163704 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-27 [patent_title] => 'Chip package and producing method thereof' [patent_app_type] => utility [patent_app_number] => 11/298522 [patent_app_country] => US [patent_app_date] => 2005-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1248 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0163/20060163704.pdf [firstpage_image] =>[orig_patent_app_number] => 11298522 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/298522
Chip package and producing method thereof Dec 11, 2005 Issued
Array ( [id] => 5233933 [patent_doc_number] => 20070126088 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-07 [patent_title] => 'Chip on lead frame for small package speed sensor' [patent_app_type] => utility [patent_app_number] => 11/295371 [patent_app_country] => US [patent_app_date] => 2005-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3258 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0126/20070126088.pdf [firstpage_image] =>[orig_patent_app_number] => 11295371 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/295371
Chip on lead frame for small package speed sensor Dec 4, 2005 Issued
Array ( [id] => 920154 [patent_doc_number] => 07321164 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-22 [patent_title] => 'Stack structure with semiconductor chip embedded in carrier' [patent_app_type] => utility [patent_app_number] => 11/294842 [patent_app_country] => US [patent_app_date] => 2005-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 4059 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/321/07321164.pdf [firstpage_image] =>[orig_patent_app_number] => 11294842 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/294842
Stack structure with semiconductor chip embedded in carrier Dec 4, 2005 Issued
Array ( [id] => 833820 [patent_doc_number] => 07397111 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-08 [patent_title] => 'Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component' [patent_app_type] => utility [patent_app_number] => 11/291072 [patent_app_country] => US [patent_app_date] => 2005-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2493 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/397/07397111.pdf [firstpage_image] =>[orig_patent_app_number] => 11291072 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/291072
Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component Nov 30, 2005 Issued
Array ( [id] => 5233941 [patent_doc_number] => 20070126096 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-07 [patent_title] => 'Leadframe comprising tin plating or an intermetallic layer formed therefrom' [patent_app_type] => utility [patent_app_number] => 11/293711 [patent_app_country] => US [patent_app_date] => 2005-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3054 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0126/20070126096.pdf [firstpage_image] =>[orig_patent_app_number] => 11293711 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/293711
Leadframe comprising tin plating or an intermetallic layer formed therefrom Nov 30, 2005 Issued
Array ( [id] => 5077009 [patent_doc_number] => 20070120233 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-31 [patent_title] => 'Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/290111 [patent_app_country] => US [patent_app_date] => 2005-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3939 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0120/20070120233.pdf [firstpage_image] =>[orig_patent_app_number] => 11290111 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/290111
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Nov 29, 2005 Issued
Array ( [id] => 5076968 [patent_doc_number] => 20070120192 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-31 [patent_title] => 'Method and apparatus that provides differential connections with improved ESD protection and routing' [patent_app_type] => utility [patent_app_number] => 11/291521 [patent_app_country] => US [patent_app_date] => 2005-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 1575 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0120/20070120192.pdf [firstpage_image] =>[orig_patent_app_number] => 11291521 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/291521
Method and apparatus that provides differential connections with improved ESD protection and routing Nov 29, 2005 Issued
Array ( [id] => 824000 [patent_doc_number] => 07405473 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-07-29 [patent_title] => 'Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing' [patent_app_type] => utility [patent_app_number] => 11/285912 [patent_app_country] => US [patent_app_date] => 2005-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3915 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/405/07405473.pdf [firstpage_image] =>[orig_patent_app_number] => 11285912 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/285912
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing Nov 22, 2005 Issued
Array ( [id] => 5843618 [patent_doc_number] => 20060121703 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Assembly structure of electronic element and heat sink' [patent_app_type] => utility [patent_app_number] => 11/287022 [patent_app_country] => US [patent_app_date] => 2005-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3066 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20060121703.pdf [firstpage_image] =>[orig_patent_app_number] => 11287022 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/287022
Assembly structure of electronic element and heat sink Nov 22, 2005 Issued
Array ( [id] => 5093067 [patent_doc_number] => 20070114676 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-24 [patent_title] => 'Semiconductor package structure and method of manufacture' [patent_app_type] => utility [patent_app_number] => 11/281141 [patent_app_country] => US [patent_app_date] => 2005-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2090 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0114/20070114676.pdf [firstpage_image] =>[orig_patent_app_number] => 11281141 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/281141
Semiconductor package structure and method of manufacture Nov 17, 2005 Issued
Array ( [id] => 5652797 [patent_doc_number] => 20060138532 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Semiconductor device and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 11/281502 [patent_app_country] => US [patent_app_date] => 2005-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 15603 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138532.pdf [firstpage_image] =>[orig_patent_app_number] => 11281502 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/281502
Semiconductor device and manufacturing method of the same Nov 17, 2005 Issued
Array ( [id] => 807313 [patent_doc_number] => 07420265 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-09-02 [patent_title] => 'Integrated circuit package system with integrated circuit support' [patent_app_type] => utility [patent_app_number] => 11/164321 [patent_app_country] => US [patent_app_date] => 2005-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4087 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/420/07420265.pdf [firstpage_image] =>[orig_patent_app_number] => 11164321 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/164321
Integrated circuit package system with integrated circuit support Nov 16, 2005 Issued
Array ( [id] => 5863247 [patent_doc_number] => 20060097377 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-11 [patent_title] => 'Flip chip bonding structure using non-conductive adhesive and related fabrication method' [patent_app_type] => utility [patent_app_number] => 11/270431 [patent_app_country] => US [patent_app_date] => 2005-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4160 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20060097377.pdf [firstpage_image] =>[orig_patent_app_number] => 11270431 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/270431
Flip chip bonding structure using non-conductive adhesive and related fabrication method Nov 7, 2005 Abandoned
Array ( [id] => 5031595 [patent_doc_number] => 20070096134 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-03 [patent_title] => 'Light emitting diode fixture and heat sink' [patent_app_type] => utility [patent_app_number] => 11/265692 [patent_app_country] => US [patent_app_date] => 2005-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2645 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20070096134.pdf [firstpage_image] =>[orig_patent_app_number] => 11265692 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/265692
Light emitting diode fixture and heat sink Oct 31, 2005 Issued
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